Listed by the USPTO as WHITESELL, STEVEN H
Tech Center 2800 • Art Units: 1737 1759 2682 2813 2851 2882
This examiner grants 82% of resolved cases
WHITESELL, STEVEN H is assigned to Tech Center 2800 and Art Unit 1737. His record includes 979 resolved cases, with an allowance rate of 82.0% and a median of 958 days to allowance. The 12.9% interview lift is positive, indicating that interviews may provide additional value in a docket with a high overall allowance rate.
The listed companies are ASML Holding N.V., Carl Zeiss SMT GmbH, and Taiwan Semiconductor Manufacturing Company, Ltd. The listed firms are Pillsbury Winthrop Shaw Pittman, LLP, Studebaker Brackett PLLC, and EDELL, SHAPIRO & FINNAN, LLC. The substantial case volume makes the observed pattern useful for planning. Practitioners should use interviews to resolve targeted issues while preserving commercially important scope, and should account for the 958-day median.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19064395 | HOLDING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND ARTICLE MANUFACTURING METHOD | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18060593 | LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS | Non-Final OA | Intel Corporation |
| 17896105 | BUTTRESSED FIELD TARGET DESIGN FOR OPTICAL AND E-BEAM BASED METROLOGY TO ENABLE FIRST LAYER PRINT REGISTRATION MEASUREMENTS FOR FIELD SHAPE MATCHING AND RETICLE STITCHING IN HIGH NA LITHOGRAPHY | Final Rejection | Intel Corporation |
| 18644211 | SUBSTRATE TREATMENT APPARATUS | Non-Final OA | CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED |
| 18528903 | EXPOSURE APPARATUS | Final Rejection | NIKON CORPORATION |
| 19170138 | DEVELOPING APPARATUS, DEVELOPING METHOD, AND COMPUTER PROGRAM | Non-Final OA | Tokyo Electron Limited |
| 19169567 | EUV WAFER DEFECT IMPROVEMENT AND METHOD OF COLLECTING NONCONDUCTIVE PARTICLES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 19088255 | REDUCE MASK DEFECT IMPACT BY CONTAMINATION DECOMPOSE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18787928 | RETICLE ENCLOSURE FOR LITHOGRAPHY SYSTEMS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18638982 | RADIATION SOURCE APPARATUS AND METHOD FOR OPERATING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18552906 | DRAWING APPARATUS AND DRAWING METHOD | Final Rejection | SCREEN Holdings Co., Ltd. |
| 19011092 | SUBSTRATE HOLDER FOR USE IN A LITHOGRAPHIC APPARATUS | Final Rejection | ASML NETHERLANDS B.V |
| 18859655 | MIRROR ASSEMBLY FOR MICROMIRROR ARRAY | Final Rejection | ASML Netherlands B.V. |
| 18716806 | MACHINE LEARNING MODEL FOR ASYMMETRY-INDUCED OVERLAY ERROR CORRECTION | Final Rejection | ASML NETHERLANDS B.V. |
| 18294202 | AN OBJECT GRIPPER, A METHOD OF HOLDING AN OBJECT AND A LITHOGRAPHIC APPARATUS | Final Rejection | ASML NETHERLANDS B.V. |
| 18533662 | OBJECT TABLE, A STAGE APPARATUS AND A LITHOGRAPHIC APPARATUS | Final Rejection | ASML NETHERLANDS B. V. |
| 18511454 | PROCESS WINDOW BASED ON DEFECT PROBABILITY | Final Rejection | ASML NETHERLANDS B.V. |
| 18025183 | TARGET STRUCTURE AND ASSOCIATED METHODS AND APPARATUS | Final Rejection | ASML NETHERLANDS B.V. |
| 17874582 | COMPUTATIONAL METROLOGY BASED CORRECTION AND CONTROL | Non-Final OA | ASML NETHERLANDS B.V. |
| 17277583 | METROLOGY METHOD AND APPARATUS THEREFOR | Non-Final OA | ASML NETHERLANDS B.V. |
| 19082444 | METHOD FOR OPERATING A PROJECTION EXPOSURE SYSTEM | Non-Final OA | Carl Zeiss SMT GmbH |
| 19073220 | MICROELECTROMECHANICAL DEVICE | Non-Final OA | Carl Zeiss SMT GmbH |
| 19018304 | LENS ELEMENT FOR A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS DESIGNED FOR OPERATION IN THE DUV, AND METHOD AND ARRANGEMENT FOR FORMING AN ANTIREFLECTION LAYER | Non-Final OA | Carl Zeiss SMT GmbH |
| 18901513 | DEVICE AND METHOD FOR ALIGNING TWO COMPONENTS | Non-Final OA | Carl Zeiss SMT GmbH |
| 18895292 | DRIVE DEVICE, OPTICAL SYSTEM AND LITHOGRAPHY APPARATUS | Final Rejection | Carl Zeiss SMT GmbH |
| 18362630 | METHOD FOR PRODUCING A MULTI-PART MIRROR OF A PROJECTION ILLUMINATION SYSTEM FOR MICROLITHOGRAPHY | Final Rejection | Carl Zeiss SMT Gmbh |
| 18421454 | OVERLAY METROLOGY TARGET FOR DIE-TO-WAFER OVERLAY METROLOGY | Non-Final OA | KLA Corporation |
| 19106760 | FOREIGN MATTER REMOVING DEVICE, PELLICLE PRODUCING DEVICE, PELLICLE FILM PRODUCING METHOD, AND PELLICLE | Non-Final OA | MITSUI CHEMICALS, INC. |
| 18949144 | APPARATUS AND METHOD FOR EXPOSURE OF RELIEF PRECURSORS | Non-Final OA | XSYS PREPRESS NV |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy82.0% of resolved applications examined by Steven H Whitesell were allowed (979 resolved cases), compared with 63.4% across Art Unit 1737 over the last five years.
This examiner's interview lift is +12.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Steven H Whitesell took 958 days on average from filing to allowance.
Steven H Whitesell examines applications in Art Unit 1737 in Tech Center 2800 (Semiconductors, Circuits & Optics).
