Listed by the USPTO as WIECZOREK, MICHAEL P
Tech Center 2800 • Art Units: 1712 1715 1716 1717 1773 1787 1788 1792 2853 2892
This examiner grants 55% of resolved cases
WIECZOREK, MICHAEL P is assigned to Tech Center 2800 and Art Unit 1712. His record covers 904 resolved cases, with an allowance rate of 55.4% and a median of 1169 days to allowance. The 16.8% interview lift is positive, indicating that interviews may improve outcomes in a docket where allowance and nonallowance are relatively balanced.
The listed companies are Taiwan Semiconductor Manufacturing Company, Ltd., Trumpf SE + Co. KG, and Canon Inc. The listed firms are Abel Schillinger, LLP, ALSTON & BIRD LLP, and AMSTER, ROTHSTEIN & EBENSTEIN LLP. Practitioners should use interviews to clarify which claim limitations matter most, then present focused amendments supported by the specification. The 1169-day median makes early development of fallback positions and continuation strategies useful.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18925888 | MANUFACTURING METHOD FOR CONDUCTIVE SUBSTRATE | Non-Final OA | FUJIFILM Corporation |
| 19095357 | PHOTOCURABLE COMPOSITION | Final Rejection | CANON KABUSHIKI KAISHA |
| 19296195 | MANUFACTURING METHOD FOR NEGATIVE ELECTRODE | Non-Final OA | TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 18654474 | ADDITIVE MANUFACTURING USING BONDING OF VOXELS AND RELATED SYSTEMS, DEVICES, AND ARTICLES | Final Rejection | Massachusetts Institute of Technology |
| 19259758 | METHODS FOR DETERMINING ATTACHMENT PLACEMENT APPLIANCE GEOMETRY | Final Rejection | Align Technology, Inc. |
| 18547236 | Insulation System for Electrically Rotating MachinesAnd Method for the Production Thereof | Non-Final OA | Siemens Aktiengesellschaft |
| 18734417 | AMORPHOUS MULTI-METAL-DOPED FILM FOR HARDMASK APPLICATION | Final Rejection | Applied Materials, Inc. |
| 19283688 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18415770 | INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 19093433 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18641282 | Scalable Self-assembly Technique for Strain-Engineering of Amorphous Complex Oxides and Fabrication of Hybrid Superlattices | Non-Final OA | UNM Rainforest Innovations |
| 18224842 | METHODS OF ALTERING PROTEIN DEPOSITION ON URINARY CATHETERS AND DEVICES | Final Rejection | University of Notre Dame du Lac |
| 18833460 | METHOD FOR PRODUCING MODIFIED WOODEN MATERIAL, 5-HMF RESINIFICATION SOLUTION, AND MODIFIED WOODEN MATERIAL | Non-Final OA | KYOTO PREFECTURAL PUBLIC UNIVERSITY CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy55.4% of resolved applications examined by Michael P Wieczorek were allowed (904 resolved cases), compared with 43.3% across Art Unit 1712 over the last five years.
This examiner's interview lift is +16.8 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Michael P Wieczorek took 1,169 days on average from filing to allowance.
Michael P Wieczorek examines applications in Art Unit 1712 in Tech Center 2800 (Semiconductors, Circuits & Optics).
