Prosecution Insights
Last updated: October 02, 2026

Precitec GmbH & Co. Kg

Technology area: Medical Devices & Mechanical Engineering

8 pending office actions • 3 art units • 8 examiners • 0 of 8 (0%) have an AI response strategy ready • 6 patents granted in the last 365 days

Portfolio Summary

8
Total Pending OAs
5
Non-Final OAs
2
Final Rejections
1
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 2 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

1
Overdue
0
Due this week
1
Due this month
0
Due in next 60 days
0
Due later

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

4
Hard (50%)
4
Medium (50%)
0
Easy (0%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only4 (50%)
Multi-statute (no §101)4 (50%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

0
Life Sciences
0% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
1
Semiconductors
12% of docket
7
Mechanical / Eng
88% of docket
0
Business / Other
0% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

80 h
Manual time on pending OAs
16 h
Time saved (low, 20%)
28 h
Time saved (mid, 35%)
0.7 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
TRAN, TIFFANY T 1 59.4% +48.6%
CHEN, SIMPSON ABRAHAM 1 62.1% +42.4%
LAZO, THOMAS E 1 86.8% +8.9%
TRAN-LE, THAO UYEN 1 42.6% +48.6%
NGUYEN, PHUONG T 1 73.8% +37.0%
DODSON, JUSTIN C 1 46.8% +35.6%
SCHNASE, PAUL DANIEL 1 69.0% +6.1%
KERR, ELIZABETH M 1 64.7% +27.7%

Hard Cases (4)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 4 ordered by deadline are shown.

App #TitleExaminerDue in
17791788 MONITORING OF A LASER MACHINING PROCESS USING A NEUROMORPHIC IMAGE SENSOR DODSON, JUSTIN C 15d
18276698 A METHOD FOR OPTIMISING A MACHINING TIME OF A LASER MACHINING PROCESS, METHOD FOR CARRYING OUT A LASER MACHINING PROCESS ON A WORKPIECE, AND LASER MACHINING SYSTEM DESIGNED FOR CARRYING OUT THIS PROCESS TRAN, TIFFANY T —
18346611 LASER MACHINING HEAD WITH OVERHEAT PROTECTION DEVICE LAZO, THOMAS E —
18023969 Method for Analyzing a Workpiece Surface for a Laser Machining Process and Analysis Device for Analyzing a Workpiece Surface TRAN-LE, THAO UYEN —

Interview Candidates (6)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.

App #TitleExaminerDue in
17801157 METHOD FOR ANALYSING A WELD DURING LASER WELDING OF WORKPIECES NGUYEN, PHUONG T 44d overdue
17791788 MONITORING OF A LASER MACHINING PROCESS USING A NEUROMORPHIC IMAGE SENSOR DODSON, JUSTIN C 15d
18276698 A METHOD FOR OPTIMISING A MACHINING TIME OF A LASER MACHINING PROCESS, METHOD FOR CARRYING OUT A LASER MACHINING PROCESS ON A WORKPIECE, AND LASER MACHINING SYSTEM DESIGNED FOR CARRYING OUT THIS PROCESS TRAN, TIFFANY T —
18349352 LASER MACHINING HEAD AND METHOD FOR MACHINING A WORKPIECE CHEN, SIMPSON ABRAHAM —
18023969 Method for Analyzing a Workpiece Surface for a Laser Machining Process and Analysis Device for Analyzing a Workpiece Surface TRAN-LE, THAO UYEN —
17585749 LASER PROCESSING HEAD HAVING A DIAPHRAGM TO INCREASE SCAN FIELD OF THE LASER BEAM KERR, ELIZABETH M —

Top Art Units

Art UnitApps
3761 6
3745 1
2877 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
18276698 A METHOD FOR OPTIMISING A MACHINING TIME OF A LASER MACHINING PROCESS, METHOD FOR CARRYING OUT A LASER MACHINING PROCESS ON A WORKPIECE, AND LASER MACHINING SYSTEM DESIGNED FOR CARRYING OUT THIS PROCESS TRAN, TIFFANY T 3761 §102§103 Non-Final OA — Pending Aug 10, 2023
18349352 LASER MACHINING HEAD AND METHOD FOR MACHINING A WORKPIECE CHEN, SIMPSON ABRAHAM 3761 §103 Final Rejection — Pending Jul 10, 2023
18346611 LASER MACHINING HEAD WITH OVERHEAT PROTECTION DEVICE LAZO, THOMAS E 3745 §102§103 Non-Final OA — Pending Jul 03, 2023
18023969 Method for Analyzing a Workpiece Surface for a Laser Machining Process and Analysis Device for Analyzing a Workpiece Surface TRAN-LE, THAO UYEN 3761 §103§112 Final Rejection — Pending Feb 28, 2023
17801157 METHOD FOR ANALYSING A WELD DURING LASER WELDING OF WORKPIECES NGUYEN, PHUONG T 3761 §103 Non-Final OA 44d overdue Pending Aug 19, 2022
17791788 MONITORING OF A LASER MACHINING PROCESS USING A NEUROMORPHIC IMAGE SENSOR DODSON, JUSTIN C 3761 §103§112 Non-Final OA 15d Pending Jul 08, 2022
17767642 LASER WORKING SYSTEM FOR PERFORMING A WORKING PROCESS ON A WORKPIECE BY MEANS OF A LASER BEAM AND METHOD FOR MONITORING A WORKING PROCESS ON A WORKPIECE BY MEANS OF A LASER BEAM SCHNASE, PAUL DANIEL 2877 §103 Non-Final OA — Pending Apr 08, 2022
17585749 LASER PROCESSING HEAD HAVING A DIAPHRAGM TO INCREASE SCAN FIELD OF THE LASER BEAM KERR, ELIZABETH M 3761 §103 Non-Final OA — Pending Jan 27, 2022

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