Prosecution Insights
Last updated: October 04, 2026

Shanghai Xizhi Technology Co. Ltd.

Technology area: Semiconductors, Circuits & Optics

3 pending office actions • 1 art units • 3 examiners • 0 of 3 (0%) have an AI response strategy ready • 4 patents granted in the last 365 days

Analysis

Shanghai Xizhi Technology Co. Ltd. is managing 3 pending office actions within the Semiconductors, Circuits & Optics technology area. These actions are distributed across 3 distinct examiners, yet they are all concentrated within 1 distinct art unit. This suggests that while the company must navigate different examiner preferences, the technical focus of its filings is very consistent. The concentration in 1 art unit indicates a specific technical specialty within the semiconductor field.

RAHLL, JERRY T is the busiest examiner for the portfolio, currently handling 1 pending office action. With 3 distinct examiners for 3 total actions, the workload is distributed across the different individuals. Practitioners should note that the company can maintain a consistent technical strategy within the 1 distinct art unit while managing the individual requirements of the 3 distinct examiners involved.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Portfolio Summary

3
Total Pending OAs
2
Non-Final OAs
1
Final Rejections
0
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 1 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

0
Overdue
0
Due this week
1
Due this month
0
Due in next 60 days
0
Due later

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

1
Hard (33%)
2
Medium (67%)
0
Easy (0%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only1 (33%)
§102 only1 (33%)
Multi-statute (no §101)1 (33%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

0
Life Sciences
0% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
1
Semiconductors
33% of docket
0
Mechanical / Eng
0% of docket
2
Business / Other
67% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

30 h
Manual time on pending OAs
6 h
Time saved (low, 20%)
10 h
Time saved (mid, 35%)
0.3 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
RAHLL, JERRY T 1 89.8% +8.3%
YANG, NAN-YING 1 77.9% +8.6%
WONG, TINA MEI SENG 1 84.3% +14.4%

Quick Wins (1)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.

App #TitleExaminerDue in
18399030 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF WONG, TINA MEI SENG 15d

Hard Cases (1)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 1 ordered by deadline are shown.

App #TitleExaminerDue in
18849041 ELECTRO-OPTICAL MODULATOR AND MANUFACTURING METHOD THEREOF RAHLL, JERRY T —

Interview Candidates (1)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 1 ordered by deadline are shown.

App #TitleExaminerDue in
18399030 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF WONG, TINA MEI SENG 15d

Top Art Units

Art UnitApps
2874 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
18849041 ELECTRO-OPTICAL MODULATOR AND MANUFACTURING METHOD THEREOF RAHLL, JERRY T — §103§112 Non-Final OA — Pending Sep 20, 2024
18842042 PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF, AND PHOTONIC INTEGRATED CIRCUIT CHIP YANG, NAN-YING — §102 Non-Final OA — Pending Aug 28, 2024
18399030 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF WONG, TINA MEI SENG 2874 §103 Final Rejection 15d Pending Dec 28, 2023

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