Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1745 1746 1767 1791
This examiner grants 68% of resolved cases
Christopher C. Caillouet works in Tech Center 1700 and Art Unit 1745. He has 765 resolved cases. His allowance rate is 67.7 percent. This 67.7 percent rate indicates the likelihood of a grant for applications assigned to his docket in Art Unit 1745.
The interview lift for this examiner is 14.8 percent. This 14.8 percent lift suggests that interviews are an effective tool for further increasing the chances of allowance. For the 765 resolved cases, practitioners can benefit from the 14.8 percent lift to resolve outstanding issues and move the application toward a grant more effectively.
The median days to allowance is 1093. This 1093 day figure represents the typical duration of the prosecution process from filing to grant. The 1093 day median provides a benchmark for pendency in Tech Center 1700. Applicants can use the 67.7 percent allowance rate and the 14.8 percent interview lift to plan their prosecution strategy effectively.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19182937 | MEDICAL BALLOON | Non-Final OA | BOSTON SCIENTIFIC SCIMED, INC. |
| 18747455 | ACTIVE ENERGY RAY-CURABLE INK JET INK, IMAGE RECORDING METHOD, AND MANUFACTURING METHOD OF LAMINATE | Non-Final OA | FUJIFILM CORPORATION |
| 19195846 | Zonal Lamination for Composite Parts in a Moving Line | Non-Final OA | The Boeing Company |
| 18600824 | Non-Uniform Tail Sealing and Methods Thereof | Non-Final OA | The Procter & Gamble Company |
| 18719206 | PLASMA PROCESSING APPARATUS AND LAMINATION SYSTEM FOR SECONDARY BATTERY INCLUDING THE SAME | Non-Final OA | LG ENERGY SOLUTION, LTD. |
| 18140572 | LAMINATING APPARATUS, IMAGE FORMING SYSTEM, STORAGE MEDIUM, AND CONTROL DEVICE | Final Rejection | KONICA MINOLTA, INC. |
| 18920151 | CURABLE EPOXY COMPOSITIONS, STRUCTURAL ADHESIVE THEREFROM, AND METHODS OF USING SAME | Non-Final OA | Henkel AG & Co. KGaA |
| 18747460 | BATTERY BONDING DEVICE | Final Rejection | SK On Co., Ltd. |
| 18829933 | METHOD FOR DISASSEMBLING ELECTRODE BODY | Final Rejection | Prime Planet Energy & Solutions, Inc. |
| 18267157 | HEM FLANGE BONDING METHOD | Final Rejection | SIKA TECHNOLOGY AG |
| 19173092 | SEAM CONSTRUCTION USING RADIO FREQUENCY WELDING AND TAPE | Non-Final OA | Weltop Outdoor (HK) Co., Ltd. |
| 18901953 | PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTAL MATERIAL | Final Rejection | Soitec |
| 18845638 | GARMENT MANUFACTURING METHOD | Non-Final OA | ZUIKO CORPORATION |
| 18804194 | SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHUCKS AND HEATERS | Non-Final OA | WATLOW ELECTRIC MANUFACTURING COMPANY |
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