Tech Center 2800 • Art Units: 1715 1718 1789 1792 2818 2837 2899
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19001890 | JIG FOR SHEET MATERIAL AND METHOD OF MANUFACTURING SHEET MATERIAL | Non-Final OA | HONDA MOTOR CO., LTD. |
| 18985474 | METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND DEVICES | Final Rejection | ASM IP Holding B.V. |
| 18214255 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | Non-Final OA | ASM IP Holding B.V. |
| 18876553 | METHODS OF FORMING STABLE CONDUCTIVE SURFACES | Non-Final OA | NORTHWESTERN UNIVERSITY |
| 18979741 | Patterned DLC Coating for High Temperature Electrostatic Chucks | Final Rejection | Applied Materials, Inc. |
| 18372792 | Selective Deposition of Thin Films with Improved Stability | Final Rejection | Applied Materials, Inc. |
| 18982168 | SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18556569 | FILM FORMING METHOD AND FILM FORMING APPARATUS | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18436231 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 19110207 | LAYERED METAL OXIDE-SILICON OXIDE FILMS | Non-Final OA | Lam Research Corporation |
| 18837560 | LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS | Non-Final OA | Lam Research Corporation |
| 18721457 | CONFORMAL SILICON OXIDE DEPOSITION USING AMINOSILANE AND CHLOROSILANE PRECURSORS | Final Rejection | Lam Research Corporation |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy