Listed by the USPTO as CUTLER, ETHAN EDWARD
Tech Center 2800 • Art Units: 2800 2892
This examiner grants 92% of resolved cases
Ethan Edward Cutler examines cases in Tech Center 2800 and Art Unit 2800, with 66 resolved cases. His allowance rate is 92.4%, and the median time to allowance is 1267 days. The interview lift is 11.1%, indicating that interviews are a productive tool for reaching an allowance.
Major applicants include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., and National Institute of Advanced Industrial Science and Technology. Firms like JCIPRNET, Muir Patent Law, PLLC, and Dorsey & Whitney LLP - MTI (Nelson) are top representatives. The 92.4% allowance rate is exceptionally high, though the 1267 day median pendency suggests a longer wait for issuance. With 66 cases resolved, the 11.1% interview lift confirms that direct communication can further enhance the already high probability of success. Practitioners should factor the 1267 day timeline into their long-term patent portfolio strategies.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18405534 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18404529 | IINTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18723840 | COMPOUND SEMICONDUCTOR SUBSTRATE | Non-Final OA | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
| 17895965 | GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE | Final Rejection | Intel Corporation |
| 18809258 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18217827 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS AND METHODS FOR FORMING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 17459869 | WAFER-LEVEL BACKSIDE LAYER FOR SEMICONDUCTOR APPARATUS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18594987 | SEMICONDUCTOR DEVICE INCLUDING SELECTOR | Non-Final OA | SK hynix Inc. |
| 18403616 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18465622 | EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy92.4% of resolved applications examined by Ethan Edward Cutler were allowed (66 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +11.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Ethan Edward Cutler took 1,267 days on average from filing to allowance.
Ethan Edward Cutler examines applications in Art Unit 2800 in Tech Center 2800 (Semiconductors, Circuits & Optics).
