Listed by the USPTO as DAS, PINAKI
Tech Center 2800 • Art Units: 2898
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18586789 | INFRARED IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Electronics Co., Ltd. |
| 18417150 | CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17846245 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17792178 | METHOD FOR PRODUCING AN OHMIC CONTACT ON A CRYSTALLOGRAPHIC C-SIDE OF A SILICON CARBIDE SUBSTRATE, AND OHMIC CONTACT | Non-Final OA | Robert Bosch GmbH |
| 18676609 | DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18656470 | DISPLAY DEVICE AND MANUFACTURING METHOD FOR SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18668106 | METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING BONDING VOIDS | Non-Final OA | Micron Technology, Inc. |
| 17929933 | ELECTRONIC DEVICES INCLUDING A METAL SILICIDE MATERIAL OVER A SOURCE CONTACT, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS OF FORMING | Non-Final OA | Micron Technology, Inc. |
| 17874206 | HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATED METHODS | Non-Final OA | Micron Technology, Inc. |
| 17719241 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCTURES FOR THERMAL DISSIPATION AND METHODS OF MAKING THE SAME | Final Rejection | Micron Technology, Inc. |
| 17769582 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Final Rejection | SHARP KABUSHIKI KAISHA |
| 18082285 | INTEGRATED CIRCUIT HAVING EXPOSED LEADS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17991062 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18124154 | METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18659212 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18166109 | METHODS FOR FORMING SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17870770 | FIELD EFFECT TRANSISTOR WITH ISOLATION STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18787277 | SEMICONDUCTOR DEVICE WITH TUNABLE EPITAXY STRUCTURES AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd |
| 18812168 | METHOD OF MANUFACTURING WAFER | Non-Final OA | DISCO CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy87.5% of resolved applications examined by Pinaki Das were allowed (56 resolved cases), compared with 80.2% across Art Unit 2898 over the last five years.
This examiner's interview lift is -1.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Pinaki Das took 1,311 days on average from filing to allowance.
Pinaki Das examines applications in Art Unit 2898 in Tech Center 2800 (Semiconductors, Circuits & Optics).
