Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1745 1746 1763 1787 1788 1794
This examiner grants 45% of resolved cases
Anish P. Desai serves in Tech Center 1700 and Art Unit 1745, where they have resolved 731 cases. The examiner has an allowance rate of 45.1 percent, which indicates a challenging environment for applicants. The median days to allowance is 1387, representing the typical timeframe for the 731 cases that have reached a grant.
The interview lift of 7.1 percent is a factor to consider, suggesting that interviews provide a modest increase in the likelihood of success. This 7.1 percent lift means that cases with an interview have a slightly better chance of allowance than the 45.1 percent base rate. Practitioners should factor the 1387-day median timeline into their planning to manage the hurdles indicated by the allowance rate.
With 731 resolved cases, Desai's data highlights a clear strategy for Art Unit 1745. The 45.1 percent allowance rate and 7.1 percent interview lift together point toward a rigorous examination process. The 1387-day median to allowance provides a timeframe for prosecution that applicants must manage alongside these statistical trends.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19080085 | FLUORINE ATOM CONTAINING SILANE COMPOUND | Non-Final OA | DAIKIN INDUSTRIES, LTD. |
| 19034374 | HARDCOAT-LESS FILM, LAMINATE, MULTILAYER LAMINATE, AND DISPLAY DEVICE | Non-Final OA | DAICEL CORPORATION |
| 18707516 | OPTICAL DISPLAY DEVICE AND ADHESIVE FILM TO BE INCLUDED THEREIN | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18372238 | THERMALLY DEBONDABLE COATING COMPOSITIONS AND STRUCTURES MADE THEREFROM | Non-Final OA | Henkel AG & Co. KGaA |
| 18599198 | ADHESIVE COMPOSITION | Final Rejection | SK On Co., Ltd. |
| 18635166 | ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF | Non-Final OA | FURUKAWA ELECTRIC CO., LTD. |
| 18862945 | HIGH-STRENGTH ADHESIVES FROM SUSTAINABLE COMPONENTS | Non-Final OA | PURDUE RESEARCH FOUNDATION |
| 18709313 | RELEASE COMPOSITION, ARTICLES PREPARED FROM THE RELEASE COMPOSITION, AND RELATED METHODS | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 18201793 | ADHESIVE, ADHESIVE FOR BONDING DISSIMILAR MATERIALS, ADHESIVE SHEET, AND ADHESIVE SHEET FOR BONDING DISSIMILAR MATERIALS | Final Rejection | MITSUBISHI CHEMICAL CORPORATION |
| 18701393 | SELF-ADHERING SEALING ELEMENT | Final Rejection | SIKA TECHNOLOGY AG |
| 18691609 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR TEMPORARILY FIXING ELECTRONIC COMPONENT AND METHOD FOR TREATING ELECTRONIC COMPONENT | Final Rejection | NITTO DENKO CORPORATION |
| 18283890 | ADHESIVE SHEET | Non-Final OA | NITTO DENKO CORPORATION |
| 18020144 | ELECTRICALLY DEBONDABLE ADHESIVE SHEET AND JOINED BODY | Non-Final OA | NITTO DENKO CORPORATION |
| 18292249 | WEB-SHAPED ADHESIVE COMPOUND CONTAINING A POLYURETHANE- AND/OR SILICONE-BASED FILLER | Final Rejection | TESA SE |
| 18278469 | MULTILAYER ADHESIVE STRIP WITH FOAMED SUBSEQUENTLY APPLIED COMPOUNDS FOR IMPROVING COLD SHOCK RESISTANCE | Final Rejection | tesa SE |
| 18021301 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION | Final Rejection | tesa SE |
| 18864808 | ARTICLE CONTAINING A WASHABLE ADHESIVE COMPOSITION | Non-Final OA | Rohm and Haas Company |
| 18845250 | ADHESIVE FILM AND METHOD FOR PRODUCING ADHESIVE FILM | Non-Final OA | FUJIMORI KOGYO CO., LTD. |
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