Listed by the USPTO as FAYETTE, NATHALIE RENEE
Tech Center 2800 • Art Units: 2812
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18438335 | SEMICONDUCTOR PACKAGE IN A STACK FORM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18438167 | HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18660255 | DISPLAY PANEL AND DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18634784 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18497485 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18718096 | SENSOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18558270 | DISPLAY APPARATUS AND DISPLAY PANEL | Final Rejection | BOE Technology Group Co., Ltd. |
| 18630302 | MICROELECTRONIC ASSEMBLIES | Non-Final OA | Intel Corporation |
| 17995461 | LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION | Final Rejection | Lam Research Corporation |
| 18674651 | INTEGRATED COOLING ASSEMBLIES WITH MULTIFUNCTIONAL LAYERS AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18586767 | SUPPORT SUBSTRATE, MANUFACTURING METHOD OF SUPPORT SUBSTRATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18621642 | SHAPED DIE FOR SEMICONDUCTOR PACKAGES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18622887 | DIRECT BACKSIDE CONTACTS FOR STACKED TRANSISTOR ARCHITECTURES | Non-Final OA | International Business Machines Corporation |
| 18231176 | METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCTOR SUBSTRATE, AND SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | Infineon Technologies AG |
| 18782942 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Non-Final OA | ROHM CO., LTD. |
| 18619758 | SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18619090 | INTEGRATED CIRCUIT PACKAGE DEVICE WITH A POWER DELIVERY SUBSTRATE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18609368 | SEMICONDUCTOR STRUCTURE | Final Rejection | MediaTek Singapore Pte. Ltd. |
| 18510923 | CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy94.5% of resolved applications examined by Nathalie Renee Fayette were allowed (55 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is -1.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Nathalie Renee Fayette took 1,214 days on average from filing to allowance.
Nathalie Renee Fayette examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
