Technology areas: Computing & Software • Semiconductors, Circuits & Optics
106 pending office actions • 1 client • 96 examiners • 46 art units • 31 of 106 (29%) have an AI response strategy ready • 178 patents granted in the last 365 days
Akona IP PC - Intel has 103 pending office actions in Semiconductors, Circuits & Optics and 1753 career applications. The record indicates a substantial active docket and an established application history in a specialized technical field.
The resolved allowance rate is 83.66%, and the average is 2.65 office actions per allowance. The data combines a favorable recorded allowance outcome with evidence that prosecution often involves multiple examination exchanges. Practitioners can use the profile to anticipate both docket-management demands and response activity.
Based on the USPTO statutory response window for each pending office action. 24 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 24 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 1 (1%) |
| §101 + other | 12 (11%) |
| §103 only | 37 (35%) |
| §102 only | 5 (5%) |
| §112 only | 2 (2%) |
| Double-patenting only | 2 (2%) |
| Multi-statute (no §101) | 43 (41%) |
| No statute on record | 4 (4%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BULLARD-CONNOR, GENEVIEVE GRACE | 3 | 42.3% | +37.0% |
| NGUYEN, DUY T V | 2 | 79.0% | +16.7% |
| VARNDELL, ROSS E | 2 | 84.7% | +13.2% |
| CADY, MATTHEW ALAN | 2 | 0.0% | +0.0% |
| JUNG, MICHAEL YOO LIM | 2 | 82.8% | +10.5% |
| WALL, VINCENT | 2 | 62.6% | +24.4% |
| TIVARUS, CRISTIAN ALEXANDRU | 2 | 74.5% | +28.0% |
| MCDONALD, JASON ANDREW | 2 | 62.5% | +46.7% |
| IQBAL, HAMNA FATHIMA | 2 | 81.8% | +22.2% |
| GUYTON, PHILIP A | 1 | 83.8% | +8.8% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | IQBAL, HAMNA FATHIMA | 1d overdue |
| 18411542 | IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS | VARNDELL, ROSS E | 40d |
| 19251520 | SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE | GUYTON, PHILIP A | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17544598 | SYSTEM AND METHOD FOR PRUNING FILTERS IN DEEP NEURAL NETWORKS | MARU, MATIYAS T | 25d overdue |
| 17820593 | NEURAL NETWORK BASED POWER AND PERFORMANCE MODEL FOR VERSATILE PROCESSING UNITS | SPRAUL III, VINCENT ANTON | 19d overdue |
| 17953511 | OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS | CHEN, YU | 4d overdue |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | TIVARUS, CRISTIAN ALEXANDRU | 7d |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | MCCOY, THOMAS WILSON | 13d |
| 18333758 | INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE | KOO, LAMONT B | 22d |
| 18527490 | 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS | VARNDELL, ROSS E | 27d |
| 17929749 | NEURAL NETWORK FACILITATING FIXED-POINT EMULATION OF FLOATING-POINT COMPUTATION | BUI, KENNY KIM | 28d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | BULLARD-CONNOR, GENEVIEVE GRACE | 4d overdue |
| 17555401 | MICROELECTRONIC ASSEMBLIES WITH SILICON NITRIDE MULTILAYER | IQBAL, HAMNA FATHIMA | 1d overdue |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | TIVARUS, CRISTIAN ALEXANDRU | 7d |
| 18527490 | 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS | VARNDELL, ROSS E | 27d |
| 17552581 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS | BULLARD-CONNOR, GENEVIEVE GRACE | 29d |
| 17473414 | PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE | NGUYEN, DUY T V | 29d |
| 18411542 | IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS | VARNDELL, ROSS E | 40d |
| 17972923 | COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE | MCDONALD, JASON ANDREW | 57d |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 106 |
| Art Unit | Apps |
|---|---|
| 2818 | 9 |
| 2899 | 8 |
| 2897 | 6 |
| 2812 | 6 |
| 2817 | 6 |
| 2898 | 6 |
| 2893 | 4 |
| 2874 | 4 |
| 2145 | 3 |
| 2813 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19251520 | SYSTEMS, APPARATUS, AND METHODS TO DEBUG ACCELERATOR HARDWARE | Intel Corporation | GUYTON, PHILIP A | 2192 | §102 | Non-Final OA | — | Pending | Jun 26, 2025 |
| 18997988 | POINT GRID NETWORK WITH LEARNABLE SEMANTIC GRID TRANSFORMATION | Intel Corporation | OAKES, JUSTIN MONTGOMERY | 2662 | §103Other | Non-Final OA | — | Pending | Jan 23, 2025 |
| 18990080 | MULTI-VARIATE STRIDED READ OPERATIONS FOR ACCESSING MATRIX OPERANDS | Intel Corporation | METZGER, MICHAEL J | 2183 | §103 | Non-Final OA | — | Pending | Dec 20, 2024 |
| 18944243 | RADIO FREQUENCY FRONT-END STRUCTURES | Intel Corporation | DIAZ, JOSE | 2875 | DP | Non-Final OA | — | Pending | Nov 12, 2024 |
| 18922038 | METHODS AND APPARATUS TO TILE WALK A TENSOR FOR CONVOLUTION OPERATIONS | Intel Corporation | JEON, JAE UK | 2193 | §101 | Non-Final OA | — | Pending | Oct 21, 2024 |
| 18855943 | RESOLUTION-SWITCHABLE SEGMENTATION NETWORKS | Intel Corporation | YAO, JULIA ZHI-YI | 2666 | §103 | Non-Final OA | — | Pending | Oct 10, 2024 |
| 18907748 | PERFORMANCE SCALING FOR DATAFLOW DEEP NEURAL NETWORK HARDWARE ACCELERATORS | Intel Corporation | TSENG, CHENG YUAN | §102§103Other | Non-Final OA | — | Pending | Oct 07, 2024 | |
| 18806287 | IMPROVING SIZE AND EFFICIENCY OF DIES | Intel Corporation | NGUYEN, DUY T V | 2818 | DP | Non-Final OA | — | Pending | Aug 15, 2024 |
| 18761714 | DYNAMIC PRUNING OF NEURONS ON-THE-FLY TO ACCELERATE NEURAL NETWORK INFERENCES | Intel Corporation | LEE, TSU-CHANG | §103§112 | Non-Final OA | — | Pending | Jul 02, 2024 | |
| 18761453 | HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES | Intel Corporation | ULLAH, ELIAS | 2893 | — | Final Rejection | — | Pending | Jul 02, 2024 |
| 18724510 | DYNAMIC TRIPLET CONVOLUTION FOR CONVOLUTIONAL NEURAL NETWORKS | Intel Corporation | ELCHANTI, ZEINA | 3628 | §112 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18740743 | TRANSISTOR CHANNEL STRUCTURES COMBINING GALLIUM NITRIDE AND SILICON CARBIDE | Intel Corporation | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18630302 | MICROELECTRONIC ASSEMBLIES | Intel Corporation | FAYETTE, NATHALIE RENEE | 2812 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18601774 | PACKAGE STACKING USING CHIP TO WAFER BONDING | Intel Corporation | MUNOZ, ANDRES F | 2818 | §103§112 | Final Rejection | — | AI Ready | Mar 11, 2024 |
| 18423577 | TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING | Intel Corporation | MACARTHUR, SYLVIA | 2899 | §103 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18411542 | IMPORTANCE-AWARE MODEL PRUNING AND RE-TRAINING FOR EFFICIENT CONVOLUTIONAL NEURAL NETWORKS | Intel Corporation | VARNDELL, ROSS E | 2674 | §103 | Final Rejection | 40d | AI Ready | Jan 12, 2024 |
| 18539957 | EMBEDDED SAR-ADC WITH LEAST SIGNIFICANT BIT SKIPPING BASED RELU ACTIVATION FUNCTION | Intel Corporation | JEANGLAUDE, JEAN BRUNER | 2845 | §102 | Non-Final OA | — | Pending | Dec 14, 2023 |
| 18527490 | 3D OBJECT RECOGNITION USING 3D CONVOLUTIONAL NEURAL NETWORK WITH DEPTH BASED MULTI-SCALE FILTERS | Intel Corporation | VARNDELL, ROSS E | 2674 | §101§103Other | Final Rejection | 27d | AI Ready | Dec 04, 2023 |
| 18489327 | SOLVING OPTIMIZATION PROBLEMS USING SPIKING NEUROMORPHIC NETWORK | Intel Corporation | KIM, SEHWAN | 4100 | §101§102§103 | Non-Final OA | — | Pending | Oct 18, 2023 |
| 18474564 | REAL-TIME INFERENCE OF TEMPORAL DOWN-SAMPLING CONVOLUTIONAL NETWORKS | Intel Corporation | LEE, MICHAEL CHRISTOPHER | 2128 | — | Non-Final OA | — | Pending | Sep 26, 2023 |
| 18469674 | LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES | Intel Corporation | DIALLO, MAMADOU L | 2897 | — | Non-Final OA | — | Pending | Sep 19, 2023 |
| 18460931 | PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING MICROCHANNEL | Intel Corporation | KEBEDE, BROOK | 2818 | §112 | Non-Final OA | — | Pending | Sep 05, 2023 |
| 18459824 | LONG DURATION STRUCTURED VIDEO ACTION SEGMENTATION | Intel Corporation | COUSO, JOSE L | 2667 | §102§103 | Non-Final OA | — | Pending | Sep 01, 2023 |
| 18459664 | INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES | Intel Corporation | NGUYEN, DAO H | 2818 | §102§112 | Non-Final OA | — | Pending | Sep 01, 2023 |
| 18457002 | TRAINING NEURAL NETWORK WITH BUDDING ENSEMBLE ARCHITECTURE BASED ON DIVERSITY LOSS | Intel Corporation | LEE, WILLIAM MICHAEL | 2145 | §101§103§112 | Final Rejection | — | Pending | Aug 28, 2023 |
| 18453715 | PRUNING ACTIVATIONS AND WEIGHTS OF NEURAL NETWORKS WITH PROGRAMMABLE THRESHOLDS | Intel Corporation | PENG, STEVEN | 2125 | §101§103 | Non-Final OA | — | Pending | Aug 22, 2023 |
| 18451150 | PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS | Intel Corporation | HSIEH, HSIN YI | §103§112 | Non-Final OA | — | Pending | Aug 17, 2023 | |
| 18233803 | Method and System of Audio Detection of a Target Audio Source in Noisy Environments | Intel Corporation | SNIEZEK, ANDREW L | 2693 | §102§103 | Non-Final OA | — | Pending | Aug 14, 2023 |
| 18364814 | PERFORMING OPERATION IN NEURAL NETWORK WITH STORAGE POINTER AND SPARSITY MAP | Intel Corporation | CADY, MATTHEW ALAN | §102 | Non-Final OA | — | Pending | Aug 03, 2023 | |
| 18360999 | INTEGRATED PHOTONIC DEVICES AND SYSTEMS WITH THERMAL DRIFT COMPENSATION | Intel Corporation | GOLUB-MILLER, MARCIA A | 2828 | §103§112 | Non-Final OA | — | Pending | Jul 28, 2023 |
| 18346966 | GRAPH SEARCH USING NEURAL NETWORK WITH SPIKING NEUROMORPHIC ARCHITECTURE | Intel Corporation | LE, HUNG VAN | 2145 | §101§103 | Non-Final OA | — | Pending | Jul 05, 2023 |
| 18345437 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | FOX, BRANDON C | 2818 | §102§103§112 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18344260 | PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Intel Corporation | JUNG, MICHAEL YOO LIM | 2817 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18341875 | ANTENNA MODULES WITH PARTIALLY OVERLAPPING STACKED CIRCUITS | Intel Corporation | STOYTCHEV, MARIN STOYTCHEV | 2845 | §103§112 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18214884 | METHOD AND SYSTEM OF SOUND LOCALIZATION USING BINAURAL AUDIO CAPTURE | Intel Corporation | SUTHERS, DOUGLAS JOHN | 2695 | §101§102§103 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18341852 | THREE-DIMENSIONAL FLOATING BODY MEMORY | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | §103§112 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18342564 | METHODS AND APPARATUS TO IMPROVE AUDIO QUALITY BASED ON LOAD IMPEDANCE SENSING | Intel Corporation | ADDY, THJUAN KNOWLIN | 2693 | §102 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18342112 | Integrated Waveguides for Semiconductor Technology | Intel Corporation | MARUF, SHEIKH | 2897 | §103§112 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18340072 | INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCRIBE LINES | Intel Corporation | JANG, BO BIN | 2818 | §102§103 | Non-Final OA | — | Pending | Jun 23, 2023 |
| 18338404 | MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS | Intel Corporation | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | — | Pending | Jun 21, 2023 |
| 18338395 | INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES | Intel Corporation | LIU, MIKKA H | 2817 | §102§112 | Non-Final OA | — | Pending | Jun 21, 2023 |
| 18337655 | DEEP NEURAL NETWORK ACCELERATOR WITH MEMORY HAVING TWO-LEVEL TOPOLOGY | Intel Corporation | STANLEY, JEREMY L | 2127 | §103 | Non-Final OA | — | Pending | Jun 20, 2023 |
| 18333711 | INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN | Intel Corporation | HIBBERT, DANIEL JOHNATHAN | 2899 | §102 | Final Rejection | 10d overdue | AI Ready | Jun 13, 2023 |
| 18333758 | INTEGRATED CIRCUIT DEVICE WITH MULTI-LENGTH GATE ELECTRODE | Intel Corporation | KOO, LAMONT B | 2813 | §102§103 | Final Rejection | 22d | AI Ready | Jun 13, 2023 |
| 18332918 | TWO-TERMINAL INTEGRATED CIRCUIT DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION | Intel Corporation | MUSLIM, SHAWN SHAW | 2897 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2023 |
| 18325267 | CAUSAL EXPLANATION OF ATTENTION-BASED NEURAL NETWORK OUTPUT | Intel Corporation | SAX, STEVEN PAUL | 2146 | §101§103 | Final Rejection | 54d | AI Ready | May 30, 2023 |
| 18325374 | FEDERATED LEARNING ADAPTIVE TO CAPABILITIES OF CONTRIBUTING DEVICES | Intel Corporation | GOLAN, MATTHEW BRYCE | 2123 | §103§112 | Final Rejection | — | Pending | May 30, 2023 |
| 18325298 | SPARSITY-BASED REDUCTION OF GATE SWITCHING IN DEEP NEURAL NETWORK ACCELERATORS | Intel Corporation | MAIDO, MAGGIE T | 2129 | §101§102§103 | Non-Final OA | — | Pending | May 30, 2023 |
| 18306399 | MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS | Intel Corporation | SMITH, SAMUEL JONATHAN | 2817 | §102§103 | Non-Final OA | — | Pending | Apr 25, 2023 |
| 18304659 | INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN | Intel Corporation | KEAGY, ROSE ALYSSA | 2818 | §102§103 | Non-Final OA | — | Pending | Apr 21, 2023 |
IP Author helps law firms respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial83.7% of resolved applications prosecuted by Akona Ip Pc - Intel were allowed, across 1,753 applications in USPTO records.
2.65 office actions per allowed application on average.
106 pending office actions as of October 2026, for 1 client, before 96 examiners in 46 art units.
