Listed by the USPTO as GONDARENKO, NATALIA A
Tech Center 2800 • Art Units: 2426 2811 2891
This examiner grants 73% of resolved cases
GONDARENKO, NATALIA A is assigned to tech center 2800 and art unit 2426. The examiner’s record includes 914 resolved cases, a 72.9% allowance rate, and a median of 879 days to allowance. The volume provides a substantial base for evaluating expected prosecution activity and for setting client timelines.
Interviews correspond to a 20.8% lift in allowance outcomes. Counsel may accordingly consider interviews as part of a structured response strategy, especially when claim construction or cited art requires discussion. The main companies are Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., and KIOXIA Corporation. The leading firms are Calderon Safran & Wright P.C., FISH & RICHARDSON P.C. (TC), and Kim & Stewart LLP- TMC.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18816677 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18815956 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18815929 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18748414 | WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD |
| 18816197 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18839233 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18884642 | BONDED STRUCTURES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18848128 | HEAT DISSIPATION MEMBER, COOLING DEVICE, AND SEMICONDUCTOR MODULE | Non-Final OA | NIDEC CORPORATION |
| 18459339 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18179922 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18841511 | SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT | Non-Final OA | KYOCERA Corporation |
| 18828356 | FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR THE FRINGE CAPACITOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18359991 | SEMICONDUCTOR DEVICE HAVING A DOPED REGION UNDERLYING A GATE LAYER AND IN A BARRIER LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18755906 | INTERCONNECT STRUCTURE WITH HYBRID BOND ANTI-FUSES | Non-Final OA | International Business Machines Corporation |
| 18891864 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18679093 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF A MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18884144 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18792449 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18624939 | WORD LINE PROTECTION METHOD IN THE BACKSIDE PROCESS OF A VERTICAL DYNAMIC RANDOM ACCESS MEMORY (DRAM) DEVICE | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18458877 | RECESSED GATE HEMT PROCESSING WITH REVERSED ETCHING | Final Rejection | STMicroelectronics International N.V. |
| 18444268 | IC Structure with Stress-Release Pattern to Enhance Package Yield | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18514410 | VIAS WITH SELECTED GRAIN DISTRIBUTION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18816317 | METHOD TO ACHIEVE LOW CONTACT RESISTANCE AND THE STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18789042 | FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18542393 | HIGH FREQUENCY DEVICE PACKAGES | Final Rejection | ANALOG DEVICES, INC. |
| 18915372 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18829265 | RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18666604 | COMBINATION STRUCTURE OF SEMICONDUCTOR DEEP TRENCH DEVICES AND MANUFACTURING METHOD THEREOF | Non-Final OA | Richtek Technology Corporation |
| 18886381 | VERTICALLY STACKED DIODE-TRIGGER SILICON CONTROLLED RECTIFIER | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
| 18511743 | TMR SENSOR HAVING TUNED VORTEX RESPONSE | Non-Final OA | Allegro MicroSystems, LLC |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy72.9% of resolved applications examined by Natalia A Gondarenko were allowed (914 resolved cases), compared with 67.6% across Art Unit 2426 over the last five years.
This examiner's interview lift is +20.8 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Natalia A Gondarenko took 879 days on average from filing to allowance.
Natalia A Gondarenko examines applications in Art Unit 2426 in Tech Center 2800 (Semiconductors, Circuits & Optics).
