Listed by the USPTO as KACKAR, RAM N
Tech Center 2600 • Art Units: 1711 1713 1716 1718 1792 2615
This examiner grants 41% of resolved cases
KACKAR, RAM N works in Tech Center 2600 and Art Unit 1711. The profile records 520 resolved cases and a 40.6% allowance rate. Allowance occurred in less than half of the recorded cases, indicating that applicants should prepare for substantive examination and develop claim positions with careful attention to the cited art.
The interview lift is 57.8%, the strongest positive interview association in this profile. That result makes interview preparation a particularly important consideration, although the allowance history shows that interviews should supplement rather than replace detailed written amendments and arguments. The median time to allowance is 1435 days, indicating a prolonged prosecution path. The leading companies are Applied Materials Inc., Lam Research Corporation, and Tokyo Electron Limited. The listed firms are Muir Patent Law, PLLC, Chrisman Gallo Tochtrop LLC, and MILES & STOCKBRIDGE PC.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508704 | PROCESS CHAMBER CLEANING APPARATUS AND METHOD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18136448 | PLASMA PROCESSING APPARATUS | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17147827 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD FOR MONITORING INTEGRATED VALUE | Non-Final OA | ASM IP Holding B.V. |
| 18250740 | Wear Compensating Confinement Ring | Non-Final OA | Lam Research Corporation |
| 18013475 | CONTROLLING TEMPERATURE PROFILES OF PLASMA CHAMBER COMPONENTS USING STRESS ANALYSIS | Non-Final OA | LAM RESEARCH CORPORATION |
| 18730100 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18353757 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | TOKYO ELECTRON LIMITED |
| 18296944 | PLASMA PROCESSING SYSTEMS WITH MATCHING NETWORK AND METHODS | Non-Final OA | Tokyo Electron Limited |
| 17278423 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18630981 | BACKING PLATE AND DIFFUSER PLATE ASSEMBLY | Non-Final OA | Applied Materials, Inc. |
| 18206847 | CCP GAS DELIVERY NOZZLE | Final Rejection | Applied Materials, Inc. |
| 18142654 | LARGE-AREA HIGH-DENSITY PLASMA PROCESSING CHAMBER FOR FLAT PANEL DISPLAYS | Final Rejection | Applied Materials, Inc. |
| 18102055 | RF GROUNDING CONFIGURATION FOR PEDESTALS | Non-Final OA | Applied Materials, Inc. |
| 17893018 | GROUND PATH SYSTEMS FOR PROVIDING A SHORTER AND SYMMETRICAL GROUND PATH | Final Rejection | Applied Materials, Inc. |
| 18790913 | SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy40.6% of resolved applications examined by Ram N Kackar were allowed (520 resolved cases), compared with 63.9% across Art Unit 1711 over the last five years.
This examiner's interview lift is +57.8 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Ram N Kackar took 1,435 days on average from filing to allowance.
Ram N Kackar examines applications in Art Unit 1711 in Tech Center 2600 (Communications).
