Listed by the USPTO as KLUNK, MARGARET D
Tech Center 2800 • Art Units: 1712 1713 1716 1718 1759 2897
This examiner grants 44% of resolved cases
Margaret D. Klunk works in Tech Center 2800 and Art Unit 1712. The profile records 443 resolved cases, a 44.0% allowance rate, and a median of 1,388 days to allowance. The interview lift is 31.5%, indicating a positive association between interviews and allowance in this dataset.
The listed companies are Applied Materials Inc., ASM IP Holding B.V., and Taiwan Semiconductor Manufacturing Company, Ltd. The listed firms are Snell & Wilmer (ASM IP Holding B.V.), Anova Law Group, PLLC, and Ascenda Law Group, PC. The 44.0% allowance rate shows that prosecution outcomes are mixed in the reported record, making claim development and response strategy important. The 31.5% interview lift supports considering examiner discussions, while the 1,388-day median highlights the need for timeline planning.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18224312 | DEPOSITION APPARATUS | Final Rejection | Samsung Display Co., LTD. |
| 18388578 | METHOD AND DEVICE FOR DEPOSITING SILICON ONTO SUBSTRATES | Final Rejection | ASM IP Holding B.V. |
| 17896218 | CVD APPARATUS AND METHOD FOR CLEANING CHAMBER OF CVD APPARATUS | Final Rejection | ASM IP Holding B.V. |
| 17895370 | SEALING SYSTEM FOR A REACTOR SYSTEM | Non-Final OA | ASM IP Holding B.V. |
| 17689392 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | ASM IP Holding B.V. |
| 18187342 | ELECTRON EXCITATION ATOMIC LAYER ETCH | Final Rejection | Lam Research Corporation |
| 17912358 | CERAMIC ADDITIVE MANUFACTURING TECHNIQUES FOR GAS INJECTORS | Non-Final OA | Lam Research Corporation |
| 18588315 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18588371 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18325423 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18531857 | SHIELDING PLASMA ETCHING DATA COLLECTION WINDOWS USING POSITIVELY CHARGED CONDUCTIVE FILMS | Non-Final OA | International Business Machines Corporation |
| 18282292 | ETCHING PLASMA PROCESSING APPARATUS INCLUDING CONSUMABLE METAL MEMBER | Final Rejection | Research & Business Foundation SUNGKYUNKWAN UNIVERSITY |
| 18646597 | NOZZLE ASSEMBLY FOR A FLUID RECOVERY SYSTEM | Non-Final OA | Applied Materials, Inc. |
| 18442378 | METHOD AND APPARATUS FOR SUBSTRATE NOTCH SENSING ON CMP HEAD FOR LOCAL PLANARIZATION | Non-Final OA | Applied Materials, Inc. |
| 18484165 | PEDESTAL HEATER WITH SUBSTRATE TEMPERATURE MEASUREMENT SYSTEM | Non-Final OA | Applied Materials, Inc. |
| 17893430 | CLAMPED DUAL-CHANNEL SHOWERHEAD | Final Rejection | Applied Materials, Inc. |
| 17831781 | PLASMA CHAMBER WITH A MULTIPHASE ROTATING CROSS-FLOW WITH UNIFORMITY TUNING | Non-Final OA | Applied Materials, Inc. |
| 17380788 | FACE-UP WAFER EDGE POLISHING APPARATUS | Final Rejection | Applied Materials, Inc. |
| 17232563 | VALVE BOX MODULE, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18787915 | SYSTEM AND METHOD FOR PLASMA ENHANCED ATOMIC LAYER DEPOSITION WITH PROTECTIVE GRID | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17883128 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 19082746 | SUBSTRATE PROCESSING APPARATUS, NOZZLE, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18458866 | SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD | Final Rejection | Ebara Corporation |
| 18181295 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | SCREEN Holdings Co., Ltd. |
| 18381647 | PROCESSING APPARATUS AND PROCESSING METHOD | Non-Final OA | United Semiconductor (Xiamen) Co., Ltd. |
| 18409805 | ATOMIC LAYER DEPOSITION APPARATUS | Final Rejection | Industrial Technology Research Institute |
| 18394198 | APPARATUS AND METHOD FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18507065 | FOCUS RING INSPECTION DEVICE AND FOCUS RING INSPECTION METHOD | Non-Final OA | SEMES CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy44.0% of resolved applications examined by Margaret D Klunk were allowed (443 resolved cases), compared with 43.3% across Art Unit 1712 over the last five years.
This examiner's interview lift is +31.5 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Margaret D Klunk took 1,388 days on average from filing to allowance.
Margaret D Klunk examines applications in Art Unit 1712 in Tech Center 2800 (Semiconductors, Circuits & Optics).
