Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1716 1718 1792
This examiner grants 61% of resolved cases
Jeffrie Robert Lund is an examiner in Art Unit 1713 of Tech Center 1700. Based on 752 resolved cases, the examiner maintains an allowance rate of 60.6 percent. This rate provides a baseline for success in this technology area, indicating that a majority of applications reach a grant. Practitioners can use the 60.6 percent figure to inform their strategy and manage client expectations regarding the likelihood of a favorable outcome.
The interview lift is 29.3 percent. This significant lift suggests that interviews are an effective tool for resolving issues and securing an allowance. Practitioners should consider the 29.3 percent lift as a strong reason to engage the examiner in verbal discussion, as it substantially improves the odds of a grant compared to written responses alone. Direct communication appears to be a key factor in overcoming technical rejections.
The median days to allowance is 1452. This timeline indicates that the prosecution process typically takes about four years. The 60.6 percent allowance rate and 1452-day median offer a baseline for planning and managing expectations. These metrics suggest that while the process is lengthy, utilizing the 29.3 percent interview lift can be a strategic way to navigate the multi-year timeline toward a successful grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18766729 | PLASMA PROCESSING APPARATUS | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18324411 | SUBSTRATE SUPPORTS, SEMICONDUCTOR PROCESSING SYSTEMS, AND MATERIAL LAYER DEPOSITION METHODS | Final Rejection | ASM IP Holding, B.V. |
| 18020924 | SUBSTRATE TREATMENT APPARATUS | Final Rejection | JUSUNG ENGINEERING CO., LTD. |
| 18580384 | SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICKNESS TRENDING IN PECVD DEPOSITION SYSTEM | Non-Final OA | LAM RESEARCH CORPORATION |
| 18671402 | THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE FOR GROUNDING AND THERMAL GAP FILLING OF ELECTRODES | Non-Final OA | Applied Materials, Inc. |
| 18825163 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18035401 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | Non-Final OA | Tokyo Electron Limited |
| 18746499 | SUBSTRATE PROCESSING APPARATUS, PROCESS VESSEL, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 17898760 | SUBSTRATE PROCESSING APPARATUS, EXHAUST DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kokusai Electric Corporation |
| 18394805 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD | Final Rejection | Semes Co., Ltd |
| 17993996 | PROCESS GAS SUPPLYING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Final Rejection | SEMES CO., LTD. |
| 18291988 | SEMICONDUCTOR PROCESS DEVICE AND GAS INLET APPARATUS | Non-Final OA | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
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