Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1731 1743 1749 1761 1788
This examiner grants 20% of resolved cases
Thomas A. Mangohig serves in Art Unit 1731 within Tech Center 1700, where he has resolved 440 cases. His allowance rate is 20.0 percent. This 20.0 percent figure provides a baseline for understanding the likelihood of success in this art unit. An interview lift of 24.4 percent is also recorded. This 24.4 percent lift suggests that direct communication can influence the outcome of an application.
The median days to allowance is 1470. This 1470-day timeline is a factor for practitioners to consider when planning their prosecution strategy. The 440 resolved cases offer a data set for analyzing the examiner's historical performance. Both the 20.0 percent allowance rate and the 24.4 percent interview lift are components of this profile.
Practitioners should use the 1470-day median to set expectations for their clients. The recorded lift indicates that interviews are a documented method for addressing rejections. The 440 cases resolved in Art Unit 1731 reflect the examiner's patterns in Tech Center 1700. Understanding these metrics is relevant for navigating the examination process.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18426062 | RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18448826 | WINDOW AND DISPLAY DEVICE HAVING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18255989 | CHIP RESISTOR | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 18143998 | CORROSION RESISTANT ADHESIVE SOL-GEL | Final Rejection | THE BOEING COMPANY |
| 17600395 | MULTILAYER FILMS FOR AIRBAG APPLICATIONS | Final Rejection | ZF Automotive Germany GmbH |
| 17641311 | Acrylic Emulsion Pressure-Sensitive Adhesive Composition | Non-Final OA | LG Chem, Ltd. |
| 18147515 | METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETIC AND ELECTROSTATIC DISSIPATATIVE FEATURES | Non-Final OA | Intel Corporation |
| 18955030 | LAMINATE, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE | Non-Final OA | KANEKA CORPORATION |
| 18453737 | METAL/METAL OXIDE DECORATED POLYMER SUBSTRATE-BASED MULTIFUNCTIONAL NANOCOMPOSITES | Non-Final OA | KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS |
| 17642134 | FILM BACKING FOR RELEASABLE SECUREMENT | Non-Final OA | Solventum Intellectual Properties Company |
| 18485059 | SEALING TAPE FOR RECHARGEABLE LITHIUM BATTERY AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18700739 | THERMOPLASTIC POLYURETHANE POWDERS AND 3D MOLDING FORMED FROM THE SAME | Final Rejection | Stratasys, Inc. |
| 18688511 | Preparation of High Molecular Weight Polymers with Minimal Gel Content | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 18653617 | PASSIVATED PIGMENT WITH CORE ENCAPSULATION | Non-Final OA | VIAVI Solutions Inc. |
| 18542104 | COMPOSITION AND METHOD FOR A MICROTEXTURE HYDROPHOBIC OR SUPERHYDROPHOBIC COATING | Final Rejection | University of Virginia Patent Foundation |
| 18768517 | ADHESIVE TAPE | Final Rejection | MITSUBISHI CHEMICAL CORPORATION |
| 17624708 | ADHESIVE FILM FOR METAL TERMINAL, METAL TERMINAL WITH ADHESIVE FILM FOR METAL TERMINAL, POWER STORAGE DEVICE USING SAID ADHESIVE FILM FOR METAL TERMINAL, AND METHOD FOR PRODUCING POWER STORAGE DEVICE | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18430976 | PRESSURE-SENSITIVE ADHESIVE SHEET | Non-Final OA | NITTO DENKO CORPORATION |
| 18568471 | INFRARED ABSORBING COMPOSITE FINE PARTICLES, INFRARED ABSORBING FINE PARTICLE DISPERSION LIQUID, AND INFRARED ABSORBING FINE PARTICLE DISPERSION BODY | Final Rejection | SUMITOMO METAL MINING CO., LTD. |
| 17393457 | LOW THERMAL EXPANSION FILM ADHESIVES FOR MULTILAYER TRANSPARENT ARMOUR AND RELATED APPLICATIONS | Non-Final OA | National Research Council of Canada |
| 17731331 | Gypsum Board Including a Laminate Layer | Final Rejection | Gold Bond Building Products, LLC |
| 18853881 | MULTILAYERED FILM | Non-Final OA | BOREALIS AG |
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