Listed by the USPTO as MCNALLY, DANIEL
Tech Center 3700 • Art Units: 1700 1745 1746 1747 1784 1791 2841 3781
This examiner grants 68% of resolved cases
MCNALLY, DANIEL has 1032 resolved cases in art unit 1700 and tech center 3700. The allowance rate is 68.2%, while the interview lift is 13.3%. Median time to allowance is 1098 days. Together, these figures describe a substantial examination record with a majority allowance outcome and a lengthy path to allowance for the median case.
The listed companies include Corning Incorporated, Siemens Gamesa Renewable Energy S.A., and Biotronik SE & Co. KG. Frequently appearing firms are AMSTER, ROTHSTEIN & EBENSTEIN LLP, Barnes & Thornburg LLP (IN), and BLANK ROME LLP. Applicants working before this examiner may find interview practice relevant, but the recorded interview lift is more limited than the allowance rate, making claim presentation and prosecution planning important from the outset.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18721938 | METHOD FOR MANUFACTURING A PREFORM ELEMENT, METHOD FOR MANUFACTURING A ROTOR BLADE, PREFORM ELEMENT, ROTOR BLADE, WIND TURBINE AND MOLD | Non-Final OA | SIEMENS GAMESA RENEWABLE ENERGY A/S |
| 19234493 | TRANSFER DEVICE | Non-Final OA | TORAY ENGINEERING CO., LTD. |
| 17789582 | METHOD FOR PRODUCING AN IMPLANTABLE ELECTRODE DEVICE | Non-Final OA | BIOTRONIK SE & Co. KG |
| 18855444 | METHOD FOR MANUFACTURING LAYERED PRODUCT AND DEVICE FOR MANUFACTURING LAYERED PRODUCT | Final Rejection | IHI Corporation |
| 18854855 | COLD-FORMED GLASS ARTICLES WITH OVERMOLDED CARRIERS AND METHODS OF FABRICATING THE SAME | Non-Final OA | CORNING INCORPORATED |
| 19083616 | FIBER OPTIC ASSEMBLIES INCLUDING A BONDING AGENT, ALONG WITH RELATED METHODS | Non-Final OA | CORNING RESEARCH & DEVELOPMENT CORPORATION |
| 18875281 | CONNECTING MEMBER AND METHOD FOR MANUFACTURING CONNECTING MEMBER | Non-Final OA | Resonac Corporation |
| 18909138 | WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE, METHOD OF FORMING PATTERN STRUCTURE, IMPRINT MOLD AND METHOD OF MANUFACTURING THE SAME, IMPRINT MOLD SET, AND METHOD OF MANUFACTURING MULTILAYER WIRING BOARD | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy68.2% of resolved applications examined by Daniel Mcnally were allowed (1,032 resolved cases), compared with 40.4% across Art Unit 1700 over the last five years.
This examiner's interview lift is +13.3 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Daniel Mcnally took 1,098 days on average from filing to allowance.
Daniel Mcnally examines applications in Art Unit 1700 in Tech Center 3700 (Medical Devices & Mechanical Engineering).
