Prosecution Insights
Last updated: October 27, 2026

RESONAC Corporation

Technology area: Chemistry & Materials

126 pending office actions • 69 art units • 113 examiners • 0 of 126 (0%) have an AI response strategy ready • 100 patents granted in the last 365 days

Analysis

RESONAC Corporation has 126 pending office actions in Chemistry & Materials. The portfolio includes 112 distinct examiners and 70 distinct art units, showing extensive examiner dispersion and recurring prosecution activity within numerous technical units.

REMAVEGE, CHRISTOPHER is the busiest examiner, with 3 pending matters. The limited concentration at that examiner contrasts with the breadth of the overall program, making centralized docket oversight and art-unit-specific analysis important for maintaining consistent prosecution positions.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Portfolio Summary

126
Total Pending OAs
89
Non-Final OAs
32
Final Rejections
5
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 23 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

10
Overdue
3
Due this week
4
Due this month
6
Due in next 60 days
0
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 23 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (10)Due ≤ 7 days (3)Due ≤ 30 days (4)Due ≤ 60 days (6)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

57
Hard (45%)
63
Medium (50%)
6
Easy (5%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§101 + other10 (8%)
§103 only46 (37%)
§102 only10 (8%)
§112 only4 (3%)
Double-patenting only2 (2%)
Double-patenting + other7 (6%)
Multi-statute (no §101)47 (37%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

91
Life Sciences
72% of docket
5
Information Tech
4% of docket
2
Communications
2% of docket
20
Semiconductors
16% of docket
6
Mechanical / Eng
5% of docket
2
Business / Other
2% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

1,260 h
Manual time on pending OAs
252 h
Time saved (low, 20%)
441 h
Time saved (mid, 35%)
11.0 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
REMAVEGE, CHRISTOPHER 3 58.5% +25.8%
MILLER, BETHANY MACKENZIE 3 55.1% +49.9%
LU, JIONG-PING 3 83.6% +7.9%
DEO, DUY VU NGUYEN 2 82.5% +7.3%
FARAZDAGHI, ARMAN MAHMOOD 2 — —
RUMMEL, JULIA L 2 34.8% +52.4%
WALKE, AMANDA C 2 88.5% +8.6%
COPENHEAVER, BLAINE R 2 86.4% +18.9%
MORILLO, JANELL COMBS 2 58.2% +26.1%
TURNER, BRIAN 2 83.4% +4.1%

Quick Wins (3)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.

App #TitleExaminerDue in
18867945 ETCHING METHOD DEO, DUY VU NGUYEN —
18258891 FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME TURNER, BRIAN —
17797333 CMP POLISHING LIQUID AND POLISHING METHOD LU, JIONG-PING —

Hard Cases (57)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
18264534 POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD LU, JIONG-PING 10d overdue
18573782 METHOD FOR PRODUCING BONDED BODY COPENHEAVER, BLAINE R 5d overdue
18682767 ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT DUCLAIR, STEPHANIE P. 2d overdue
18860588 METHOD FOR MANUFACTURING SOUND-ABSORBING MEMBER KONVES, ADRIANNA N 9d
18275760 LAYERED STRUCTURE FOR AUTOMOBILE EMBLEM AND OBJECT DETECTION STRUCTURE COPENHEAVER, BLAINE R 12d
18024894 LAMINATED STRUCTURE AND OBJECT DETECTION STRUCTURE AHMED, SHEEBA 33d
18263714 NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, METHOD OF EVALUATING SAME, AND METHOD OF PRODUCING SAME, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, AND LITHIUM-ION SECONDARY BATTERY CANTELMO, GREGG 34d
19273220 SIC SINGLE CRYSTAL, SIC SUBSTRATE AND SIC EPITAXIAL WAFER MULVANEY, ELIZABETH EVANS —

Interview Candidates (12)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
18573782 METHOD FOR PRODUCING BONDED BODY COPENHEAVER, BLAINE R 5d overdue
18859112 PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE MILLER, BETHANY MACKENZIE 5d
18275760 LAYERED STRUCTURE FOR AUTOMOBILE EMBLEM AND OBJECT DETECTION STRUCTURE COPENHEAVER, BLAINE R 12d
18868552 ETCHING METHOD REMAVEGE, CHRISTOPHER —
18861593 MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE MILLER, BETHANY MACKENZIE —
18861003 POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD REMAVEGE, CHRISTOPHER —
18856062 FILM FOR TEMPORARY FIXING, LAMINATE FOR TEMPORARY FIXING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COMPOSITION FOR TEMPORARY FIXING MILLER, BETHANY MACKENZIE —
18854971 COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL RUMMEL, JULIA L —

Top Art Units

Art UnitApps
1713 11
1787 9
1783 5
1785 4
1788 4
1781 4
2847 4
1762 4
1784 3
1733 3

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
19273220 SIC SINGLE CRYSTAL, SIC SUBSTRATE AND SIC EPITAXIAL WAFER MULVANEY, ELIZABETH EVANS 1785 §103§112 Non-Final OA — Pending Jul 18, 2025
19111535 INFORMATION SEARCH DEVICE, METHOD, AND PROGRAM CHANNAVAJJALA, SRIRAMA T 2154 §101§102§103§112 Non-Final OA — Pending Mar 13, 2025
19105911 CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS CHEN, VIVIAN 1787 §103Other Non-Final OA — Pending Feb 24, 2025
19058595 PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE GROSSO, GREGORY CHAD 1748 §102§103 Non-Final OA — Pending Feb 20, 2025
18877000 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET DUCHENEAUX, FRANK D 1788 §103 Final Rejection 35d Pending Dec 19, 2024
18875281 CONNECTING MEMBER AND METHOD FOR MANUFACTURING CONNECTING MEMBER MCNALLY, DANIEL 1746 §102§103 Non-Final OA — Pending Dec 16, 2024
18871881 CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS WANG, XIAOBEI 1784 §103 Final Rejection 9d overdue Pending Dec 05, 2024
18868552 ETCHING METHOD REMAVEGE, CHRISTOPHER 1713 §103DP Non-Final OA — Pending Nov 22, 2024
18868192 FRAME MEMBER AND MANUFACTURING METHOD CLEMMONS, STEVE M 3613 §102§103 Non-Final OA — Pending Nov 22, 2024
18868196 IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM JONES, RAVEN SIMONE 2665 §103 Non-Final OA — Pending Nov 22, 2024
18867945 ETCHING METHOD DEO, DUY VU NGUYEN 1713 §102 Non-Final OA — Pending Nov 21, 2024
18867120 RADIO WAVE TRANSMISSIVE MEMBER, METHOD OF PRODUCING RADIO WAVE TRANSMISSIVE MEMBER, AUTOMOBILE COMPONENT, EMBLEM AND OBJECT DETECTION STRUCTURE TRAN, HAI V 2845 §103DP Non-Final OA 42d Pending Nov 19, 2024
18864550 ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR PATEL, VISHAL I 1746 §103 Non-Final OA — Pending Nov 11, 2024
18864553 ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR BRANCH, CATHERINE S 1763 §112DP Non-Final OA — Pending Nov 11, 2024
18863796 FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING MEDIUM OLADAPO, TAIWO 1771 DP Non-Final OA — Pending Nov 07, 2024
18861995 METHOD FOR PRODUCING HYDROCARBON AND METHOD FOR PRODUCING SILICON CARBIDE CHONG, JASON Y 1772 §103 Non-Final OA — Pending Oct 31, 2024
18933285 SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATE DO, NHAT CHIEU Q 3724 §102§103§112 Non-Final OA — Pending Oct 31, 2024
18861765 MOLD RELEASE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE TSUI, YUNG-SHENG M 1684 §102§112 Non-Final OA — Pending Oct 30, 2024
18861593 MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE MILLER, BETHANY MACKENZIE 1787 §103 Non-Final OA — Pending Oct 30, 2024
18861289 RELEASE FILM AND METHOD OF PRODUCING SEMICONDUCTOR PACKAGE FLORES JR, DONALD M 1781 §102§103§112Other Non-Final OA — Pending Oct 29, 2024
18861339 FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM GOLOBOY, JAMES C 1771 §102 Non-Final OA — Pending Oct 29, 2024
18861385 CONDUCTIVE ADHESIVE FILM, METHOD OF TREATING ADHEREND, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WALSHON, SCOTT R 1788 §102§103Other Non-Final OA — Pending Oct 29, 2024
18861283 FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM CHAU, LINDA N 1785 §112 Non-Final OA 50d Pending Oct 29, 2024
18861396 CONDUCTIVE ADHESIVE FILM, METHOD OF TREATING ADHEREND, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HANDVILLE, BRIAN 1783 §102§103 Non-Final OA — Pending Oct 29, 2024
18861502 METHOD FOR MANUFACTURING CONDUCTIVE VIA-CONTAINING SUBSTRATE, CONDUCTIVE VIA-CONTAINING SUBSTRATE, AND METAL PASTE HEVEY, JOHN A 1733 §102§103 Non-Final OA — Pending Oct 29, 2024
18860688 LAMINATE MANUFACTURING METHOD, INSULATION MATERIAL, AND LAMINATE FARMER, EMILY NICOLE 2812 §103§112 Non-Final OA — Pending Oct 28, 2024
18861003 POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD REMAVEGE, CHRISTOPHER 1713 §103 Non-Final OA — Pending Oct 28, 2024
18860671 RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND ACENAPHTHYLENE HOMOPOLYMER RUMMEL, IAN A 1785 §102§103 Non-Final OA — Pending Oct 27, 2024
18860588 METHOD FOR MANUFACTURING SOUND-ABSORBING MEMBER KONVES, ADRIANNA N 1748 §102§103 Final Rejection 9d Pending Oct 25, 2024
18859963 PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE BURNS, TREMESHA WILLIS 2847 §103 Non-Final OA — Pending Oct 24, 2024
18859951 SHEET COMPRISING THERMAL INSULATION LAYER AND ADHESIVE LAYER DICUS, TAMRA 1787 §102§103 Final Rejection — Pending Oct 24, 2024
18859112 PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE MILLER, BETHANY MACKENZIE 1787 §103Other Final Rejection 5d Pending Oct 22, 2024
18859077 RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, AND CURED PRODUCT OF RESIN COMPOSITION FARAZDAGHI, ARMAN MAHMOOD 1762 §103Other Non-Final OA — Pending Oct 22, 2024
18857814 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING WIEGAND, TYLER J — §103§112 Non-Final OA — Pending Oct 18, 2024
18857460 METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR EVALUATING RESIST LAYER OR WIRING BOARD, AND WIRING BOARD VARGHESE, ROSHN K 2847 §102§103 Non-Final OA — Pending Oct 17, 2024
18857708 POLISHING LIQUID, POLISHING METHOD, COMPONENT PRODUCTION METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD LAOBAK, ANDREW KEELAN 1713 §103§112DP Non-Final OA — Pending Oct 17, 2024
18857335 ABRASIVE GRAIN, SELECTION METHOD THEREFOR, POLISHING AGENT, MULTI-LIQUID POLISHING AGENT, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD DEO, DUY VU NGUYEN 1713 §102§103§112 Non-Final OA — Pending Oct 16, 2024
18857322 ABRASIVE GRAINS AND METHOD FOR SELECTING SAME, POLISHING LIQUID, MULTI-LIQUID TYPE POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD AHMED, SHAMIM 1713 §103 Non-Final OA — Pending Oct 16, 2024
18856974 POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD LU, JIONG-PING 1713 §102§103 Non-Final OA — Pending Oct 15, 2024
18856062 FILM FOR TEMPORARY FIXING, LAMINATE FOR TEMPORARY FIXING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COMPOSITION FOR TEMPORARY FIXING MILLER, BETHANY MACKENZIE 1787 §102 Final Rejection — Pending Oct 11, 2024
18855859 EVALUATION SYSTEM, EVALUATION METHOD, AND EVALUATION PROGRAM LU, TOM Y 2667 §102 Non-Final OA — Pending Oct 10, 2024
18839728 CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND WIRING BOARD AND METHOD FOR PRODUCING SAME NORRIS, JEREMY C 2847 §102§103 Non-Final OA — Pending Oct 10, 2024
18854971 COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL RUMMEL, JULIA L 1784 §103Other Non-Final OA — Pending Oct 08, 2024
18854970 COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL RUMMEL, JULIA L 1784 §103Other Non-Final OA — Pending Oct 08, 2024
18854548 ADHESIVE FILM, ADHESIVE TAPE, ADHESIVE TAPE WITH RELEASE FILM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE ANDUJAR, LEONARDO — §102 Non-Final OA — Pending Oct 07, 2024
18837891 WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND EXPOSURE PATTERN-RENDERING DATA STRUCTURE MCALLISTER, MICHAEL F 2847 §102 Non-Final OA — Pending Oct 07, 2024
18287221 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD KHAN, TAHSEEN 1781 §103 Non-Final OA — Pending Oct 04, 2024
18850560 ADHESIVE FILM FOR SEMICONDUCTORS, DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HARRISON, MONICA D 2815 §102 Non-Final OA — Pending Sep 25, 2024
18896017 METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM AND HEAT TREATMENT APPARATUS USED THEREFOR TADAYYON ESLAMI, TABASSOM 1718 §103 Non-Final OA — Pending Sep 25, 2024
18848913 ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE CHOI, CALVIN Y 2812 §102§103 Non-Final OA — Pending Sep 20, 2024

View all 126 →

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Frequently Asked Questions

How many pending USPTO office actions does RESONAC Corporation have?

RESONAC Corporation has 126 pending office actions as of October 2026, spread across 69 art units and 113 examiners.

Which USPTO examiner handles the most RESONAC Corporation applications?

Christopher Remavege has the most, with 3 of RESONAC Corporation's pending office actions.

What technology area are RESONAC Corporation's patent applications in?

Mostly Chemistry & Materials (USPTO Tech Center 1700), based on where its pending office actions are examined.

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