Listed by the USPTO as MELLOTT, JAMES M
Tech Center 2800 • Art Units: 1712 1718 1759 1794 2853
This examiner grants 51% of resolved cases
James M. Mellott has resolved 569 cases in Art Unit 1712. His allowance rate is 51.1 percent, and the median days to allowance is 1225. These figures provide a clear picture of his work in Tech Center 2800. For firms like CANTOR COLBURN LLP, these metrics are essential for strategy.
The interview lift is 44.1 percent, one of the higher figures in this tech center. This suggests that for firms like HAUPTMAN HAM, LLP, an interview is a highly effective tool for increasing the chances of allowance. Direct engagement can help practitioners navigate toward the 51.1 percent allowance rate.
Top companies in his docket include Samsung Display Co., Ltd. and Taiwan Semiconductor Manufacturing Company, Ltd. Screen Holdings Co., Ltd. also features prominently. SUGHRUE MION, PLLC is another firm with significant experience before this examiner, managing cases within the 1225 median days to allowance.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18358135 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18420055 | INKJET PRINTING APPARATUS AND INKJET PRINTING METHOD USING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18396845 | ELECTROSTATIC CHUCK AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18509692 | MASK, MASK ASSEMBLY INCLUDING THE MASK, AND METHDO OF FABRICATING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18348507 | WINDOW REINFORCING APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 19251984 | METHODS FOR FORMING A DOPED HIGH-K LAYER ON A SUBSTRATE | Final Rejection | ASM IP Holding B.V. |
| 18894737 | Die Coater for Coating Electrode Slurry and Insulating Liquid | Non-Final OA | LG Energy Solution, Ltd. |
| 18866108 | CAPACITIVELY COUPLED PLASMA-ENHANCED ATOMIC LAYER DEPOSITION METHOD | Final Rejection | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE |
| 18866416 | PLASMA-ENHANCED DEPOSITION REACTOR | Non-Final OA | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE |
| 18438393 | ELECTRODE PLATE MANUFACTURING APPARATUS AND ELECTRODE PLATE MANUFACTURING METHOD | Final Rejection | CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED |
| 16497051 | METHOD OF 3D-PRINTING PRODUCING A COMPONENT FOR USE IN A LIGHTING DEVICE | Final Rejection | SIGNIFY HOLDING B.V. |
| 18880585 | PROCESS FOR PREPARING OF TRANSITION METAL-CONTAINING FILMS | Non-Final OA | BASF SE |
| 17183138 | SENSOR TECHNOLOGY INTEGRATION INTO COATING TRACK | Final Rejection | Tokyo Electron Limited |
| 19308701 | Nanostructure Coating Materials and Methods of Use Thereof | Non-Final OA | Nelumbo Inc. |
| 18786836 | DUAL AMPOULE SEPARATOR PLATE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18789812 | WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 18561598 | METHOD FOR MANUFACTURING A THIN FILM COMPOSITE MEMBRANE FOR ALKALINE WATER ELECTROLYSIS | Non-Final OA | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| 18848987 | PHOTOIRRADIATION UNIT, PRINTER, AND PRINTING SYSTEM | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 18437852 | SUBSTRATE TREATING METHOD, SUBSTRATE TREATING APPARATUS, TREATMENT LIQUID, AND TREATMENT LIQUID EVALUATION METHOD | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 19132073 | FILM-FORMING AUXILIARY AGENT FOR CHEMICAL VAPOR DEPOSITION, COATING SOLUTION FOR CHEMICAL VAPOR DEPOSITION, METAL OXIDE FILM, AND FILM-FORMING METHOD FOR METAL OXIDE FILM | Final Rejection | NOF CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy51.1% of resolved applications examined by James M Mellott were allowed (569 resolved cases), compared with 43.3% across Art Unit 1712 over the last five years.
This examiner's interview lift is +44.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by James M Mellott took 1,225 days on average from filing to allowance.
James M Mellott examines applications in Art Unit 1712 in Tech Center 2800 (Semiconductors, Circuits & Optics).
