Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1742 1787
This examiner grants 55% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18300008 | WATERBORNE EPOXY RESIN COATING WITH GRAPHENE-COMPOSITE FOR VEHICLE SEAT TRACKS WITH SELF-LUBRIFICATION AND ANTICORROSION PROPERTIES | Final Rejection | Ford Global Technologies, LLC |
| 18705373 | MOLD RELEASE FILM AND LAMINATE THEREOF, AND PRODUCTION METHOD FOR MEMBRANE ELECTRODE ASSEMBLY | Non-Final OA | Daicel Corporation |
| 18788071 | UNIAXIALLY STRETCHED MULTILAYER STRUCTURE AND METHOD OF PRODUCING THE SAME | Non-Final OA | MITSUBISHI CHEMICAL CORPORATION |
| 18920270 | INDIUM ZINC TIN OXIDE TRANSPARENT ELECTRODE WITH PANI:PSS INTERMEDIATE LAYER | Non-Final OA | UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION |
| 18859112 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Non-Final OA | Resonac Corporation |
| 18920144 | MEMBRANES WITH IMPROVED SOLAR REFLECTANCE AND RELATED SYSTEMS AND METHODS | Non-Final OA | BMIC LLC |
| 18348406 | FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | Final Rejection | AGC Inc. |
| 18428128 | ARTICLE INCLUDING A RELEASE LAYER | Final Rejection | VIAVI SOLUTIONS INC. |
| 18937558 | RECYCLABLE, THERMOFORMABLE PAPER BASE WEB | Non-Final OA | PROAMPAC HOLDINGS INC. |
| 18238798 | NEAR-INFRARED (NIR) SENSITIZED ADHESIVE AND SEALANT COMPOSITIONS | Non-Final OA | Henkel AG & Co. KGaA |
| 18238844 | PHOTOCURABLE ADHESIVE OR SEALANT COMPOSITION | Non-Final OA | Henkel AG & Co. KGaA |
| 18897545 | CLADS HAVING POLYMER FILMS AND METAL LAYERS | Non-Final OA | DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC |
| 18846083 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | Non-Final OA | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 18844109 | MULTILAYER BODY AND MULTILAYER CONTAINER | Non-Final OA | Mitsubishi Gas Chemical Company, Inc. |
| 17621362 | FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE | Non-Final OA | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 18264090 | COMPOSITIONS CONTAINING A FREE RADICAL POLYMERIZATION INITIATOR | Non-Final OA | PRC-Desoto International, Inc. |
| 17781734 | THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE | Final Rejection | SUMITOMO BAKELITE CO., LTD. |
| 18698615 | COMPOSITE COATING, PREPARATION METHOD, AND DEVICE | Non-Final OA | JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. |
| 18033534 | ONE-COMPONENT STRUCTURAL ADHESIVE | Final Rejection | DDP SPECIALTY ELECTRONIC MATERIALS US, LLC |
| 18042321 | COATING COMPOSITION AND COATED ARTICLE INCLUDING COATING FORMED BY THE COATING COMPOSITION | Non-Final OA | Sherwin-Williams (Guangdong) New Material Co., Ltd. |
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