Listed by the USPTO as NGUYEN, KHIEM D
Tech Center 2800 • Art Units: 2116 2800 2817 2823 2842 2843 2892 2899
This examiner grants 86% of resolved cases
NGUYEN, KHIEM D is assigned to tech center 2800 and art unit 2116. The record includes 2260 resolved cases and an 85.8% allowance rate. The 12.4% interview lift indicates a positive association between interviews and allowance outcomes. The median time to allowance is 852 days, so practitioners should combine favorable outcome expectations with planning for a sustained examination period.
The listed companies are Murata Manufacturing Co., Ltd., NXP Semiconductors N.V., and Taiwan Semiconductor Manufacturing Company, Ltd. The leading firms are ARENTFOX SCHIFF LLP - New York, Chang and Hale LLP, and Harrity & Harrity , LLP. The large resolved-case record provides substantial support for the observed patterns. Interviews may be useful as part of a broader response plan, particularly when claim issues require direct clarification.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18780949 | TRANSMITTER, WIRELESS COMMUNICATION MODULE AND POWER AMPLIFICATION SYSTEM | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18662354 | REGULATED MOS-BASED LOAD FOR STABILIZATION OF HF AMPLIFIER/MIXER GAIN VS. PVT | Non-Final OA | Apple Inc. |
| 18470561 | Wireless Circuitry with Tunable Matching Network | Non-Final OA | Apple Inc. |
| 18633458 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18763339 | DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE HAVING A PLURALITY OF APERTURES IN A ONE-TO-ONE CORRESPONDENCE TO A PLURALITY OF FIRST ELECTRODES | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18767029 | MOLD COMPOUND EMBEDDED DEVICE COOLING STRUCTURE | Non-Final OA | QUALCOMM Incorporated |
| 18428106 | STACKED INTEGRATED CIRCUIT DEVICES INCLUDING LOGIC DIE AND MEMORY STACKS | Final Rejection | QUALCOMM Incorporated |
| 18318755 | Through-Hole Structures for Improved Power Performance | Non-Final OA | Intel Corporation |
| 17485291 | HIGH-K OR FERROELECTRIC GATE OXIDE WITH ZERO-SIO2 IL PROCESS FOR TRANSISTOR | Non-Final OA | Intel Corporation |
| 18752957 | AMPLIFIER AND SIGNAL DISTRIBUTION METHOD | Non-Final OA | Mitsubishi Electric Corporation |
| 18489140 | SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18951069 | Power Amplifier Linearizer | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18943309 | TRACKER CIRCUITS AND VOLTAGE SUPPLY METHOD | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18934576 | SENSOR AMPLIFIER CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18774145 | DOHERTY AMPLIFICATION CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18743889 | POWER AMPLIFIER CIRCUIT AND POWER AMPLIFIER MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18668341 | POWER AMPLIFIER CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18666857 | POWER AMPLIFIER CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18618287 | TRACKER MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18156449 | INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT | Final Rejection | Texas Instruments Incorporated |
| 17977435 | REDUCTION OF NOISE AND WEAK AVALANCHE CURRENT INDUCED ERRORS IN BIPOLAR AMPLIFIERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18356462 | TIA WITH TUNABLE GAIN | Non-Final OA | Nokia Solutions and Networks Oy |
| 18760425 | SHIFTED STACKED FETS WITH BACKSIDE S/D CONTACTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18664959 | SUBTRACTIVE POWER LINES WITH WRAP-AROUND POWER PLANE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18822003 | ADAPTABLE IMPEDANCE CIRCUITS FOR AMPLIFICATION SYSTEMS | Non-Final OA | SKYWORKS SOLUTIONS, INC. |
| 18120287 | WIDE-BANDGAP CHIP HAVING REFERENCE DEVICE | Non-Final OA | SKYWORKS SOLUTIONS, INC. |
| 18475804 | Semiconductor Integrated Circuit | Non-Final OA | ROHM CO., LTD. |
| 18632003 | REDUCED STRAIN HETEROEPITAXY ASSEMBLY FOR THREE-DIMENSIONAL DEVICE AND METHOD OF FABRICATION THEREFOR | Non-Final OA | Applied Materials, Inc. |
| 18812704 | NFC DEMODULATION CIRCUIT | Non-Final OA | STMicroelectronics International N.V. |
| 18433450 | SEMICONDUCTOR MANUFACTURING TOOL AND METHOD OF OPERATING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy85.8% of resolved applications examined by Khiem D Nguyen were allowed (2,260 resolved cases), compared with 70.1% across Art Unit 2116 over the last five years.
This examiner's interview lift is +12.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Khiem D Nguyen took 852 days on average from filing to allowance.
Khiem D Nguyen examines applications in Art Unit 2116 in Tech Center 2800 (Semiconductors, Circuits & Optics).
