Listed by the USPTO as NGUYEN, NIKI HOANG
Tech Center 2800 • Art Units: 2818 2858
This examiner grants 91% of resolved cases
NGUYEN, NIKI HOANG is a USPTO patent examiner in tech center 2800 and art unit 2818. The record includes 952 resolved cases and a 91.0% allowance rate. Median time to allowance is 769 days. Interview lift is 5.1%, well below the allowance rate. This combination presents a favorable allowance record with a limited measured interview effect, making clear written claim positioning an important part of prosecution preparation.
The leading companies are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and Seiko Epson Corporation. The principal firms are JCIPRNET, Haynes and Boone, LLP (24061), and Knobbe, Martens, Olson & Bear, LLP. The 769-day median provides a useful planning point for applicants managing portfolio timing and expected pendency.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18752024 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18757429 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SEIKO EPSON CORPORATION |
| 18050307 | DIFFUSION BARRIERS AND METHOD OF FORMING SAME | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18679729 | MAGNETIC FIELD SENSOR WITH BIAS RESISTOR | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18780501 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18774903 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770372 | Gate Isolation for Multigate Device | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18768995 | STRUCTURE AND METHOD FOR MRAM DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18785410 | Dummy Fin Structures and Methods of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18770392 | PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18768080 | Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18654367 | HIGH PERFORMANCE AND LOW POWER THREE-DIMENSIONAL STATIC RANDOM ACCESS MEMORY AND METHOD OF FORMING SAME | Non-Final OA | Katholieke Universiteit Leuven |
| 18740524 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy91.0% of resolved applications examined by Niki Hoang Nguyen were allowed (952 resolved cases), compared with 85.2% across Art Unit 2818 over the last five years.
This examiner's interview lift is +5.1 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Niki Hoang Nguyen took 769 days on average from filing to allowance.
Niki Hoang Nguyen examines applications in Art Unit 2818 in Tech Center 2800 (Semiconductors, Circuits & Optics).
