Listed by the USPTO as OZDEN, ILKER NMN
Tech Center 2800 • Art Units: 2812 2816 2897
This examiner grants 83% of resolved cases
OZDEN, ILKER NMN is assigned to Tech Center 2800 and Art Unit 2812. The record contains 42 resolved cases, with an allowance rate of 83.3%. Median time to allowance is 1239 days, and interview lift is 25.9%. The positive lift indicates that interviews were associated with more favorable allowance outcomes than cases without interviews in the recorded data.
The listed companies are Samsung Electronics Co., Ltd., Kabushiki Kaisha Toshiba, and Panasonic Holdings Corporation. The firms are FISH & RICHARDSON P.C. (TC), Muir Patent Law, PLLC, and AMPACC Law Group, PLLC. Given the limited resolved-case record, practitioners should treat the figures as directional and combine them with application-specific analysis.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18888158 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18816416 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18810729 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18795874 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18787293 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18666967 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18520453 | SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18133198 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18206325 | PATTERNING USING MONOMER BASED SACRIFICIAL MATERIAL LIFTOFF | Non-Final OA | BAE SYSTEMS Information and Electronic Systems Integration Inc. |
| 18085421 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING SEPARATION PATTERNS HAVING DIFFERENT STRUCTURES | Non-Final OA | SK hynix Inc. |
| 18141177 | HYBRID WAFER DICING APPROACH USING A RECTANGULAR LASER SPOT-BASED LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS | Non-Final OA | Applied Materials, Inc. |
| 18159625 | V-SHAPED INNER SPACER FOR A MULTI-GATE DEVICE AND RELATED METHODS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18657170 | DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy83.3% of resolved applications examined by Ilker Nmn Ozden were allowed (42 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is +25.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Ilker Nmn Ozden took 1,239 days on average from filing to allowance.
Ilker Nmn Ozden examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
