Listed by the USPTO as PARKER, JOHN M
Tech Center 2800 • Art Units: 2811 2816 2823 2899
This examiner grants 92% of resolved cases
This record includes 865 resolved cases in Tech Center 2800 and Art Unit 2811. The allowance rate is 92.0%, and the median time to allowance is 815 days. Interview lift is 0.4%, indicating almost no recorded association between interviews and allowance outcomes.
The listed companies are Taiwan Semiconductor Manufacturing Company, Ltd., Qualcomm Incorporated, and Micron Technology Inc. The listed firms are Eschweiler & Potashnik, LLC, Haynes and Boone, LLP, and NZ Carr Law Office. The strong allowance result and limited interview lift suggest that written prosecution work is the more important planning focus.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17573461 | LOW VIA RESISTANCE INTERCONNECT STRUCTURE | Non-Final OA | QUALCOMM Incorporated |
| 18513303 | REDUCED RESISTIVITY FOR ACCESS LINES IN A MEMORY ARRAY | Non-Final OA | Micron Technology, Inc. |
| 18136970 | HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APPLICATIONS | Final Rejection | Applied Materials, Inc. |
| 18758180 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18679546 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18664402 | RING STRUCTURE FOR FILM RESISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18648884 | BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18645455 | 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18582746 | SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18357251 | CAVITY IN METAL INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18785934 | Spacers for Semiconductor Devices Including Backside Power Rails | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18782335 | AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18641764 | SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18784583 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH BOTTOM SELF-ALIGNED VIA LANDING | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18757668 | THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy92.0% of resolved applications examined by John M Parker were allowed (865 resolved cases), compared with 72.2% across Art Unit 2811 over the last five years.
This examiner's interview lift is +0.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by John M Parker took 815 days on average from filing to allowance.
John M Parker examines applications in Art Unit 2811 in Tech Center 2800 (Semiconductors, Circuits & Optics).
