Prosecution Insights
Last updated: October 25, 2026

Eschweiler & Potashnik, LLC (Tsmc)

Technology area: Semiconductors, Circuits & Optics

124 pending office actions • 19 clients • 103 examiners • 48 art units • 0 of 124 (0%) have an AI response strategy ready

Quality Metrics (n=7436 apps, methodology: how we score firms)

96.9%
Allowance Rate
n=7436
+0.55σ
Allowance Rate (norm)
n=7436
2.8
OAs to Allowance
n=5277
-0.23σ
OAs to Allow (norm)
n=5277
918 days
Time to Allowance
n=5277
+1.7pp
Interview Lift
n=7436
17.0%
RCE Rate
n=7436
3.1%
Appeal Rate
n=7436

Rejection Performance (% of received rejections ultimately overcome)

87.7%
§101 Overcome
n=317
91.8%
§102 Overcome
n=2414
90.8%
§103 Overcome
n=3267
91.3%
§112 Overcome
n=1632

Specialization & Scale

H01L, H10D, H10W
Top CPC Subclasses
32%
Top-3 CPC Share
n=7436
0
Practitioners
n=7436
—
Apps / Practitioner
n=7436 (min 20)

Portfolio Summary

124
Total Pending OAs
102
Non-Final OAs
19
Final Rejections
3
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 18 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

8
Overdue
1
Due this week
4
Due this month
5
Due in next 60 days
0
Due later

Deadline Fire Line

Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 18 of the docket's apps have a known mailing date.

-30dToday30d60d90d120d
Overdue (8)Due ≤ 7 days (1)Due ≤ 30 days (4)Due ≤ 60 days (5)

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

62
Hard (50%)
52
Medium (42%)
9
Easy (7%)
1
Unknown (1%)

Rejection Statute Mix

BucketCases
§101 only1 (1%)
§101 + other7 (6%)
§103 only37 (30%)
§102 only10 (8%)
§112 only5 (4%)
Double-patenting only4 (3%)
Double-patenting + other5 (4%)
Multi-statute (no §101)54 (44%)
No statute on record1 (1%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

4
Life Sciences
3% of docket
10
Information Tech
8% of docket
2
Communications
2% of docket
92
Semiconductors
74% of docket
9
Mechanical / Eng
7% of docket
7
Business / Other
6% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

1,240 h
Manual time on pending OAs
248 h
Time saved (low, 20%)
434 h
Time saved (mid, 35%)
10.8 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
BELOUSOV, ALEXANDER 6 76.6% +16.3%
PARKER, JOHN M 6 92.0% +0.4%
LIN, JOHN 3 60.0% +8.5%
WARD, ERIC A 2 78.3% +13.3%
DIAZ, JOSE R 2 87.0% +7.9%
HOSSAIN, MOAZZAM 2 88.1% +11.1%
KLEIN, JORDAN M 2 85.6% +7.9%
HO, TU TU V 2 93.6% +5.2%
WINTERS, SEAN AYERS 2 88.7% +17.9%
TRAN, TRANG Q 2 81.4% +7.2%

Quick Wins (7)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.

App #TitleExaminerDue in
18357251 CAVITY IN METAL INTERCONNECT STRUCTURE PARKER, JOHN M 3d overdue
18783569 CAPACITOR DEVICE WITH SELF ALIGNED SPACER DIAZ, JOSE R —
18781081 BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR KLEIN, JORDAN M —
18772364 CAPPING LAYER OVER FET FERAM TO INCREASE CHARGE MOBILITY DIAZ, JOSE R —
18679546 USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA PARKER, JOHN M —
18645455 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE PARKER, JOHN M —
18444896 IMAGE SENSOR AND METHOD OF MANUFACTURING IMAGE SENSOR HOSSAIN, MOAZZAM —

Hard Cases (62)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
17210938 INVERTER WITH A HOUSING HAVING A COOLING UNIT RALIS, STEPHEN J 175d overdue
17393619 VIA RAIL SOLUTION FOR HIGH POWER ELECTROMIGRATION LIN, JOHN 72d overdue
19027128 SYSTEM AND METHOD FOR HANDLING DIGITAL CONTENT GOVERNANCE IN AN ORGANIZATION LE, UYEN T 30d overdue
17750746 BOND ROUTING STRUCTURE FOR STACKED WAFERS SON, ERIKA HEERA 18d overdue
18170030 IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY RODRIGUEZ VILLANU, SANDRA MILENA 8d
18753075 CROSS-ENTERPRISE DOCUMENT SHARING (XDS) METADATA MORPHING HAMILTON, MATTHEW L 16d
18919483 APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING LOGIE, MICHAEL J 34d
18918276 DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM MENDOZA, ALEXANDRIA ARELLANO 42d

Interview Candidates (12)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.

App #TitleExaminerDue in
18346544 MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE BELOUSOV, ALEXANDER 14d
18395841 IMAGE SENSORS AND METHODS OF MANUFACTURE WINTERS, SEAN AYERS 55d
18921069 FeRAM MFM STRUCTURE WITH SELECTIVE ELECTRODE ETCH WARD, ERIC A —
18783538 HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE BELOUSOV, ALEXANDER —
18783574 DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE HOSSAIN, MOAZZAM —
18782159 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF BELOUSOV, ALEXANDER —
18779305 DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE WARD, ERIC A —
18778985 CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME BELOUSOV, ALEXANDER —

Client Portfolio (19 clients)

Top Art Units

Art UnitApps
281813
289313
28979
28999
28128
28987
28156
28114
28743
28133

Pending Office Actions

App #TitleClientExaminerArt UnitStatutesStatusDue inAIFiled
19303520 AUTOMATIC POOL CLEANING DEVICE AND ITS CONTROLLING METHOD Aiper Global Pte. Ltd. ALAM, NAEEM TASLIM 3668 §102§103 Non-Final OA — Pending Aug 19, 2025
19243074 THERMAL BARRIER STRUCTURE IN PHASE CHANGE MATERIAL DEVICE Taiwan Semiconductor Manufacturing Company, Ltd. TAN, DAVE 2897 §102§103 Non-Final OA — Pending Jun 19, 2025
19209878 ELECTRONIC DEVICE AND METHOD FOR RESTORING A STATE OF AN INTEGRATED CIRCUIT Infineon Technologies AG JACKSON, JAYLUN ARMAN 2112 §103 Non-Final OA — Pending May 16, 2025
19093485 DOOR PROTECTION DEVICE Waspw, LLC MENEZES, MARCUS 3634 §102§103 Non-Final OA — Pending Mar 28, 2025
19089118 PROTECTION OF AI MODELS Infineon Technologies AG SRIRAM, ADITYA 2491 §101§103§112 Non-Final OA — Pending Mar 25, 2025
19073656 POWER/AREA EFFICIENT ACCELERATION OF PROCESSOR-BASED ARTIFICIAL NEURAL NETWORK COMPUTATION Infineon Technologies AG SADLER, NATHAN 2139 §103DP Final Rejection — Pending Mar 07, 2025
19063918 LOW-TEMPERATURE VAPORIZER FOR ION IMPLANTER WITH IN-VACUUM CONTROLLED FLOW Axcelis Technologies, Inc. CHEN, KEATH T 1716 §103 Final Rejection 132d overdue Pending Feb 26, 2025
19105161 FEEDER POLE APPARATUS, METHOD OF USE AND MANUFACTURE THEREOF Innovative Blasting Technologies Pty Ltd. CULLER, JILL E §103 Non-Final OA — Pending Feb 20, 2025
19058173 RESOLVING A HARDWARE FAULT OCCURRENCE IN A MULTI-DOMAIN DEVICE Infineon Technologies AG RUSIN, KAYO LISA 2114 §102§103 Non-Final OA — Pending Feb 20, 2025
19099902 STORAGE STABLE MICROBIAL COMPOSITION Lanbiotic GmbH ROBINSON, HOPE A 1652 §112 Non-Final OA — Pending Jan 30, 2025
19027128 SYSTEM AND METHOD FOR HANDLING DIGITAL CONTENT GOVERNANCE IN AN ORGANIZATION Hyland UK Operations Limited LE, UYEN T 2156 §101§103§112 Non-Final OA 30d overdue Pending Jan 17, 2025
19028479 PERMISSIONS-CONSTRAINED DYNAMIC FACETING OF SEARCH RESULTS IN A CONTENT MANAGEMENT SYSTEM Hyland UK Operations Limited WILLOUGHBY, ALICIA M 2156 §103Other Non-Final OA 33d Pending Jan 17, 2025
18981800 MEMORY CELL WITH UNIPOLAR SELECTORS Taiwan Semiconductor Manufacturing Company, Ltd. LAPPAS, JASON 2827 §103 Non-Final OA — Pending Dec 16, 2024
18980276 WAFER ALIGNMENT, CLEANLINESS, AND SURFACE QUALITY VERIFICATION USING LASER LIGHT SCATTERING Axcelis Technologies, Inc. STOCK JR, GORDON J 2877 §102§103 Non-Final OA — Pending Dec 13, 2024
18969428 IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT Taiwan Semiconductor Manufacturing Company, Ltd. SOHN, SEUNG C 2878 §112 Non-Final OA — Pending Dec 05, 2024
18950296 APPLICATION OF SECURITY PARAMETERS FOR CONTENT Hyland UK Operations Limited CHOY, KA SHAN 2435 §103 Non-Final OA — Pending Nov 18, 2024
18935391 MULTI-CHANNEL CONTROL SYSTEM FOR CONTROLLING PLURALITY OF SMART WINDOWS Gooil Solution Co., Ltd. WILSON, PAISLEY L 2871 §102§112 Non-Final OA — Pending Nov 01, 2024
18921069 FeRAM MFM STRUCTURE WITH SELECTIVE ELECTRODE ETCH Taiwan Semiconductor Manufacturing Company, Ltd. WARD, ERIC A §103 Non-Final OA — Pending Oct 21, 2024
18919483 APPARATUS AND METHOD FOR TWO-DIMENSIONAL ION BEAM PROFILING Axcelis Technologies, Inc. LOGIE, MICHAEL J 2881 §103§112 Final Rejection 34d Pending Oct 18, 2024
18918276 DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM Axcelis Technologies, Inc. MENDOZA, ALEXANDRIA ARELLANO 2877 §102§103§112 Non-Final OA 42d Pending Oct 17, 2024
18901408 MEDICAL ANALYSIS USING SPATIOTEMPORAL ANALYSIS AND TRANSFORMER-BASED MODELS Emory University HUYNH, VAN D 2665 §102§103 Non-Final OA — Pending Sep 30, 2024
18783997 STOPPER BUMP STRUCTURES FOR MEMS DEVICE Taiwan Semiconductor Manufacturing Company, Ltd. WATTS, JEREMY DANIEL 2897 §102§103 Non-Final OA — Pending Jul 25, 2024
18783569 CAPACITOR DEVICE WITH SELF ALIGNED SPACER Taiwan Semiconductor Manufacturing Company, Ltd. DIAZ, JOSE R 2815 §102§103DP Non-Final OA — Pending Jul 25, 2024
18784638 NOVEL MIM STRUCTURE Taiwan Semiconductor Manufacturing Co., Ltd. PAGE, STEVEN MITCHELL CHR 2812 §102 Non-Final OA — Pending Jul 25, 2024
18783538 HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE Taiwan Semiconductor Manufacturing Company, Ltd. BELOUSOV, ALEXANDER 2818 §102§103 Non-Final OA — Pending Jul 25, 2024
18783574 DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE Taiwan Semiconductor Manufacturing Company, Ltd. HOSSAIN, MOAZZAM 2898 §102§103 Non-Final OA — Pending Jul 25, 2024
18783824 BOND PAD WITH ENHANCED RELIABILITY Taiwan Semiconductor Manufacturing Company, Ltd. DIALLO, MAMADOU L 2897 §102 Non-Final OA — Pending Jul 25, 2024
18784428 INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME Taiwan Semiconductor Manufacturing Co., Ltd. VU, HUNG K 2897 §112DP Non-Final OA — Pending Jul 25, 2024
18783529 BARRIER STRUCTURE CONFIGURED TO INCREASE PERFORMANCE OF III-V DEVICES Taiwan Semiconductor Manufacturing Company, Ltd. JUNG, MICHAEL YOO LIM 2817 §102§103 Non-Final OA — Pending Jul 25, 2024
18782439 HIGH ASPECT RATIO BOSCH DEEP ETCH Taiwan Semiconductor Manufacturing Company, Ltd. CHAMBLISS, ALONZO 2897 §102DP Non-Final OA — Pending Jul 24, 2024
18782159 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF Taiwan Semiconductor Manufacturing Company, Ltd. BELOUSOV, ALEXANDER 2818 §102 Non-Final OA — Pending Jul 24, 2024
18782291 INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME Taiwan Semiconductor Manufacturing Company, Ltd. AU, BAC H §103Other Non-Final OA — Pending Jul 24, 2024
18780959 SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION STRUCTURE Taiwan Semiconductor Manufacturing Company, Ltd. BRASFIELD, QUINTON A 2814 §103 Non-Final OA — Pending Jul 23, 2024
18781081 BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR Taiwan Semiconductor Manufacturing Company, Ltd. KLEIN, JORDAN M 2893 DP Non-Final OA — Pending Jul 23, 2024
18780581 INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE Taiwan Semiconductor Manufacturing Company, Ltd. MOJADDEDI, OMAR F 2898 §102§103 Non-Final OA — Pending Jul 23, 2024
18779180 CLADDING STRUCTURE FOR SEMICONDUCTOR WAVEGUIDE Taiwan Semiconductor Manufacturing Company, Ltd. ENDRESEN, KIRSTEN DANIELA 2874 §103 Non-Final OA — Pending Jul 22, 2024
18779252 STILTED PAD STRUCTURE Taiwan Semiconductor Manufacturing Company, Ltd. VU, DAVID 2818 §102§103 Non-Final OA — Pending Jul 22, 2024
18779844 DOPED SEMICONDUCTOR STRUCTURE FOR NIR SENSORS Taiwan Semiconductor Manufacturing Company, Ltd. SARKER-NAG, AKHEE 2893 §102§103§112 Non-Final OA — Pending Jul 22, 2024
18779188 IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE Taiwan Semiconductor Manufacturing Company, Ltd. ROLAND, CHRISTOPHER M 2893 §103 Non-Final OA — Pending Jul 22, 2024
18779221 METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES Taiwan Semiconductor Manufacturing Company, Ltd. LEE, ALVIN LYNGHI 2813 §102§103§112 Non-Final OA — Pending Jul 22, 2024
18779305 DISHING PREVENTION STRUCTURE EMBEDDED IN A GATE ELECTRODE Taiwan Semiconductor Manufacturing Company, Ltd. WARD, ERIC A 2891 §102§103§112Other Non-Final OA — Pending Jul 22, 2024
18778990 SPACER SCHEME AND METHOD FOR MRAM Taiwan Semiconductor Manufacturing Company, Ltd. HO, TU TU V 2818 §102§103 Non-Final OA — Pending Jul 21, 2024
18778989 MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME Taiwan Semiconductor Manufacturing Company, Ltd. MICHAUD, NICHOLAS BRIAN 2818 §103§112 Non-Final OA — Pending Jul 21, 2024
18778985 CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTURING AND USING THE SAME Taiwan Semiconductor Manufacturing Company, Ltd. BELOUSOV, ALEXANDER 2818 §103 Non-Final OA — Pending Jul 21, 2024
18777885 CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS DEVICE Taiwan Semiconductor Manufacturing Company, Ltd. CRITE, ANTONIO B §102 Non-Final OA — Pending Jul 19, 2024
18778189 SONAR SENSOR IN PROCESSING CHAMBER Taiwan Semiconductor Manufacturing Company, Ltd. OH, JAEHWAN 2899 DP Non-Final OA — Pending Jul 19, 2024
18777807 STRAP TECHNOLOGY TO IMPROVE ESD HBM PERFORMANCE Taiwan Semiconductor Manufacturing Company, Ltd. ZHU, SHENG-BAI 2897 §103 Non-Final OA — Pending Jul 19, 2024
18776416 3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE Taiwan Semiconductor Manufacturing Company, Ltd. GEBREMARIAM, SAMUEL A 2811 §112 Non-Final OA — Pending Jul 18, 2024
18774988 METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICONDUCTOR SUBSTRATE Taiwan Semiconductor Manufacturing Company, Ltd. CHIU, TSZ K 2898 §102§103 Non-Final OA — Pending Jul 17, 2024
18775130 INTEGRATED CHIP WITH INTER-WIRE CAVITIES Taiwan Semiconductor Manufacturing Company, Ltd. CLINTON, EVAN GARRETT 2899 §102 Non-Final OA — Pending Jul 17, 2024

View all 124 →

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Frequently Asked Questions

What is Eschweiler & Potashnik, LLC (Tsmc)'s patent allowance rate?

96.9% of resolved applications prosecuted by Eschweiler & Potashnik, LLC (Tsmc) were allowed, across 7,436 applications in USPTO records.

How many office actions does Eschweiler & Potashnik, LLC (Tsmc) average before allowance?

2.85 office actions per allowed application on average.

How many pending office actions does Eschweiler & Potashnik, LLC (Tsmc) have?

124 pending office actions as of October 2026, for 19 clients, before 103 examiners in 48 art units.

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