Tech Center 3700 • Art Units: 1713 1718 3723
This examiner grants 41% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18141341 | SHOCK ABSORBING PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18179187 | SEMICONDUCTOR PROCESSING SYSTEM WITH GAS LINE FOR TRANSPORTING EXCITED SPECIES AND RELATED METHODS | Non-Final OA | ASM IP HOLDING B.V. |
| 17840870 | SUSCEPTOR CLEANING | Non-Final OA | ASM IP Holding B.V. |
| 17736691 | SUBSTRATE TREATMENT APPARATUS WITH FLEX-LL FUNCTION, AND SUBSTRATE TRANSFER METHOD | Non-Final OA | ASM IP Holding B.V. |
| 17433693 | PLASMA PROCESSING APPARATUS | Final Rejection | Hitachi High-Tech Corporation |
| 18775749 | CLEANING CHAMBER FOR METAL OXIDE REMOVAL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18614816 | SUBSTRATE SUPPORT ASSEMBLY HAVING AN EDGE VOLTAGE DELIVERY SYSTEM | Non-Final OA | Applied Materials, Inc. |
| 18228393 | CLUSTER PROCESSING SYSTEM FOR FORMING A METAL CONTAINING MATERIAL | Final Rejection | Applied Materials, Inc. |
| 18214745 | Remote Plasma Source and Plasma Processing Chamber Having Same | Non-Final OA | Applied Materials, Inc. |
| 17455197 | RING FOR SUBSTRATE EXTREME EDGE PROTECTION | Non-Final OA | Applied Materials, Inc. |
| 17064389 | MODULAR ZONE CONTROL FOR A PROCESSING CHAMBER | Final Rejection | Applied Materials, Inc. |
| 17063366 | BEVEL BACKSIDE DEPOSITION ELIMINATION | Non-Final OA | Applied Materials, Inc. |
| 18489188 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18372995 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18459151 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18147157 | HEAT TREATMENT APPARATUS, PROCESSING TARGET PROTECTING METHOD, AND STORAGE MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 17848596 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Final Rejection | Tokyo Electron Limited |
| 17757781 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 17655071 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
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