Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1713 1718 3723
This examiner grants 42% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18328298 | CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18141341 | SHOCK ABSORBING PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18452933 | REMOVING SCALE FROM A PIPELINE | Non-Final OA | Saudi Arabian Oil Company |
| 18179187 | SEMICONDUCTOR PROCESSING SYSTEM WITH GAS LINE FOR TRANSPORTING EXCITED SPECIES AND RELATED METHODS | Non-Final OA | ASM IP HOLDING B.V. |
| 17857344 | SUBSTRATE SUPPORT STRUCTURES AND METHODS OF MAKING SUBSTRATE SUPPORT STRUCTURES | Non-Final OA | ASM IP Holding B.V. |
| 18138733 | MULTI-ELECTRODE SOURCE ASSEMBLY FOR PLASMA PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 17880335 | SHARED RPS CLEAN AND BYPASS DELIVERY ARCHITECTURE | Final Rejection | Applied Materials, Inc. |
| 17510111 | HORIZONTAL BUFFING MODULE | Non-Final OA | Applied Materials, Inc. |
| 17156957 | METHODS AND APPARATUS FOR TUNING SEMICONDUCTOR PROCESSES | Non-Final OA | APPLIED MATERIALS, INC. |
| 18354705 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 18298829 | Method and System for Plasma Processing | Final Rejection | Tokyo Electron Limited |
| 18147157 | HEAT TREATMENT APPARATUS, PROCESSING TARGET PROTECTING METHOD, AND STORAGE MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 17860127 | METHOD AND DEVICE FOR CONTROLLING A THICKNESS OF A PROTECTIVE FILM ON A SUBSTRATE | Final Rejection | Tokyo Electron Limited |
| 17757781 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17761091 | RAW MATERIAL SUPPLY APPARATUS AND RAW MATERIAL SUPPLY METHOD | Final Rejection | TOKYO ELECTRON LIMITED |
| 17433693 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 17967347 | Substrate Processing Apparatus | Final Rejection | Kokusai Electric Corporation |
| 18198780 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SEMES CO., LTD. |
| 17915573 | EDGE RING FOR LOCALIZED DELIVERY OF TUNING GAS | Final Rejection | LAM RESEARCH CORPORATION |
| 17612536 | SHOWERHEAD INSERT FOR UNIFORMITY TUNING | Non-Final OA | Lam Research Corporation |
| 17593117 | PLASMA ETCH TOOL FOR HIGH ASPECT RATIO ETCHING | Final Rejection | Lam Research Corporation |
| 18840629 | APPARATUS FOR FINE POWDER PARTICLE PROCESSING UTILIZING CENTRIFUGAL CONFINEMENT TO MITIGATE PARTICLE ELUTRIATION | Non-Final OA | CVD Equipment Corporation |
| 18122509 | APPARATUS AND METHOD FOR CURRENT SENSING USING EMBEDDED ELECTRODES | Final Rejection | MKS Inc. |
| 17878496 | ATOMIC LAYER DEPOSITION METHOD AND ATOMIC LAYER DEPOSITION DEVICE | Final Rejection | MEIDENSHA CORPORATION |
| 17756306 | Gas Distribution Plate, Fluidizing Device and Reaction Method | Final Rejection | SHANGHAI RESEARCH INSTITUTE OF PETROCHEMICAL TECHNOLOGY SINOPEC |
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