Tech Center 1700 • Art Units: 1718
This examiner grants 44% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18328298 | CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18141341 | SHOCK ABSORBING PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18138733 | MULTI-ELECTRODE SOURCE ASSEMBLY FOR PLASMA PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 17880335 | SHARED RPS CLEAN AND BYPASS DELIVERY ARCHITECTURE | Final Rejection | Applied Materials, Inc. |
| 17510111 | HORIZONTAL BUFFING MODULE | Non-Final OA | Applied Materials, Inc. |
| 17476200 | UNIFORM PLASMA LINEAR ION SOURCE | Final Rejection | Applied Materials, Inc. |
| 17156957 | METHODS AND APPARATUS FOR TUNING SEMICONDUCTOR PROCESSES | Non-Final OA | APPLIED MATERIALS, INC. |
| 18249552 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17860127 | METHOD AND DEVICE FOR CONTROLLING A THICKNESS OF A PROTECTIVE FILM ON A SUBSTRATE | Final Rejection | Tokyo Electron Limited |
| 17848596 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Non-Final OA | Tokyo Electron Limited |
| 17757781 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17655071 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 17761091 | RAW MATERIAL SUPPLY APPARATUS AND RAW MATERIAL SUPPLY METHOD | Final Rejection | TOKYO ELECTRON LIMITED |
| 17380624 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | Tokyo Electron Limited |
| 17433693 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18179187 | SEMICONDUCTOR PROCESSING SYSTEM WITH GAS LINE FOR TRANSPORTING EXCITED SPECIES AND RELATED METHODS | Final Rejection | ASM IP HOLDING B.V. |
| 17840870 | SUSCEPTOR CLEANING | Final Rejection | ASM IP Holding B.V. |
| 17967347 | Substrate Processing Apparatus | Final Rejection | Kokusai Electric Corporation |
| 18198780 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SEMES CO., LTD. |
| 17518480 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 17915573 | EDGE RING FOR LOCALIZED DELIVERY OF TUNING GAS | Final Rejection | LAM RESEARCH CORPORATION |
| 17612536 | SHOWERHEAD INSERT FOR UNIFORMITY TUNING | Non-Final OA | Lam Research Corporation |
| 17593117 | PLASMA ETCH TOOL FOR HIGH ASPECT RATIO ETCHING | Final Rejection | Lam Research Corporation |
| 18840629 | APPARATUS FOR FINE POWDER PARTICLE PROCESSING UTILIZING CENTRIFUGAL CONFINEMENT TO MITIGATE PARTICLE ELUTRIATION | Non-Final OA | CVD Equipment Corporation |
| 17878496 | ATOMIC LAYER DEPOSITION METHOD AND ATOMIC LAYER DEPOSITION DEVICE | Final Rejection | MEIDENSHA CORPORATION |
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