Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1713 2821 2844 2845
This examiner grants 89% of resolved cases
Srinivas Sathiraju is an examiner in Art Unit 1713 of Tech Center 2800. With 839 resolved cases, the examiner has an allowance rate of 88.9 percent. This 88.9 percent rate is much higher than the 6.2 percent interview lift. The median days to allowance is 736, which is a relatively efficient timeframe for reaching a grant. This 736 day timeline is a key benchmark for applications in Art Unit 1713.
The 6.2 percent interview lift indicates that interviews have a modest impact on the 88.9 percent baseline. With 839 cases resolved, the examiner's high allowance rate is a well-established feature of his practice. Practitioners should use the 736 day median to manage client expectations regarding pendency. The 839 case volume in Tech Center 2800 suggests that these metrics are statistically significant. While the 6.2 percent lift is small, it can still be used to resolve minor examiner concerns.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19179656 | LIGHTING DEVICE AND CONTROL METHOD THEREFOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD |
| 19028372 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18882950 | NOTIFYING OTHERS OF DETECTION STATUS TO MITIGATE ACCIDENT RISK | Final Rejection | Volvo Truck Corporation |
| 19220332 | INFORMATION PROCESSING METHOD | Non-Final OA | SEIKO EPSON CORPORATION |
| 18979952 | PIEZOELECTRIC TRANSFORMER | Non-Final OA | TDK Electronics AG |
| 18997892 | DC/DC CONVERTER | Non-Final OA | Mitsubishi Electric Corporation |
| 18259907 | Joint Schemes for Stacked Plate, Non-Insulated Superconducting Magnets | Non-Final OA | Massachusetts Institute of Technology |
| 19286823 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18841495 | MEMBER FOR PLASMA PROCESSING APPARATUS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Hitachi High-Tech Corporation |
| 18866767 | CUSTOMIZING ETCH SELECTIVITY AND HIGH ASPECT RATIO FEATURE LOADING THROUGH MULTI-LEVEL PULSING SCHEMES UTILIZING SINUSOIDAL AND CUSTOM RF WAVEFORMS | Non-Final OA | Lam Research Corporation |
| 19233036 | CONTROL METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 19232884 | CONTROL METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18935665 | CONTROL METHOD AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 19061830 | LIGHT ARRAY CONTROL | Non-Final OA | Analog Devices International Unlimited Company |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy