Listed by the USPTO as SIPPEL, RACHEL T
Tech Center 3700 • Art Units: 3636 3771 3785
This examiner grants 52% of resolved cases
SIPPEL, RACHEL T works in Tech Center 3700 and art unit 3636. The profile records 813 resolved cases and an allowance rate of 52.5%. The interview lift is 58.2%, which is greater than the allowance rate and makes interview preparation a prominent consideration. The median time to allowance is 1409 days, supporting early development of positions that can be presented clearly during prosecution.
The listed companies are James L Orrington Ii D D S P C, Fisher & Paykel Healthcare Limited, and Samsung Electronics Co., Ltd. The listed firms are Arch & Lake LLP, Carlson, Caspers, Vandenburgh & Lindquist, P.A., and COOLEY LLP. Counsel can use this substantial history to plan interviews, preserve fallback claims, and account for extended prosecution timing.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17586926 | METHOD AND APPARATUS FOR RECOGNIZING GAIT TASK | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18296049 | REPLACEABLE FILTER SYSTEMS FOR MECHANICAL VENTILATION | Non-Final OA | Covidien LP |
| 18315102 | RESPIRATOR DEVICES AND FOLDING PATTERNS FOR RESPIRATOR FILTERS | Non-Final OA | Honeywell Safety Products USA, Inc. |
| 18959482 | SLIDING ROD NESTING STRUCTURE | Non-Final OA | Zhejiang Red And Black Technology Co.,Ltd |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy52.5% of resolved applications examined by Rachel T Sippel were allowed (813 resolved cases), compared with 64.2% across Art Unit 3636 over the last five years.
This examiner's interview lift is +58.2 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Rachel T Sippel took 1,409 days on average from filing to allowance.
Rachel T Sippel examines applications in Art Unit 3636 in Tech Center 3700 (Medical Devices & Mechanical Engineering).
