Tech Center 3700 • Art Units: 1711 1745 1746 1759 1788 1796 3736
This examiner grants 51% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18473952 | THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND METHOD OF REPLACING THERMAL CONDUCTIVE SHEET IN ELECTRONIC DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18290527 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR PROCESSING, FILM COMPRISING SAME FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE USING SAME | Non-Final OA | LG CHEM, LTD. |
| 17415464 | Acrylic Emulsion Pressure-Sensitive Adhesive Composition | Final Rejection | LG Chem, Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy