Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1711 1745 1746 1759 1788 1796 3736
This examiner grants 51% of resolved cases
Scott R. Walshon has processed 526 resolved cases in Art Unit 1711 of Tech Center 3700. The examiner's allowance rate is 51.3 percent, suggesting a more challenging prosecution environment for applicants. This 51.3 percent rate indicates that about half of the applications do not reach allowance, requiring practitioners to be exceptionally well-prepared and persistent to secure a patent grant.
The median days to allowance is 1370, indicating a longer timeline for reaching a final resolution compared to other examiners. This 1370 day median means that applicants must be prepared for a multi-year process. However, the interview lift of 20.6 percent is substantial, suggesting that verbal communication is an effective strategy for overcoming hurdles and potentially improving the chances of a grant.
Practitioners should leverage the 20.6 percent lift to address the examiner's concerns directly and move the case toward allowance. Given the 51.3 percent baseline and the 1370 day median, an interview is a critical tool for resolving technical disagreements more efficiently. A combination of strong evidence and strategic verbal engagement is necessary to navigate this examiner's docket successfully.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18894644 | RESIN COMPOSITION, CURED RESIN PRODUCT, AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18743512 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 18473952 | THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND METHOD OF REPLACING THERMAL CONDUCTIVE SHEET IN ELECTRONIC DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18722876 | ADHESIVE FILM AND PREPARATION METHOD THEREOF, COMPOSITE ASSEMBLY, AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18290527 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR PROCESSING, FILM COMPRISING SAME FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE USING SAME | Non-Final OA | LG CHEM, LTD. |
| 17415464 | Acrylic Emulsion Pressure-Sensitive Adhesive Composition | Non-Final OA | LG Chem, Ltd. |
| 18019614 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER | Non-Final OA | Resonac Corporation |
| 19013232 | CURABLE ADHESIVE COMPOSITIONS FOR BONDING ONE OR MORE SUBSTRATES | Non-Final OA | Henkel AG & Co. KGaA |
| 18665791 | COPOLYMER AND HOT MELT COMPOSITIONS COMPRISING SAID COPOLYMER | Final Rejection | Henkel AG & Co. KGaA |
| 18928457 | PARAFFIN BASED CORROSION INHIBITOR COMPOSITIONS AND USES THEREOF | Non-Final OA | ChampionX LLC |
| 18711168 | ADHESIVE SHEET | Non-Final OA | LINTEC CORPORATION |
| 18556812 | ENERGY RAY-CROSSLINKABLE ADHESIVE AGENT COMPOSITION, CROSSLINKED ADHESIVE AGENT, ADHESIVE SHEET, AND METHODS FOR PRODUCING SAME | Final Rejection | LINTEC CORPORATION |
| 18024037 | DOUBLE-SIDED TISSUE TAPE AND RELATED ARTICLE | Non-Final OA | 3M INNOVATIVE PROPERTIES COMPANY |
| 18060463 | LAMINATED STRUCTURE FOR THERMAL CONDUCTION IN A FLEXIBLE ELECTRICAL SUBSTRATE | Final Rejection | Tektronix, Inc. |
| 18710884 | PRESSURE-SENSITIVE ADHESIVE TAPE AND USE THEREOF | Non-Final OA | NITTO DENKO CORPORATION |
| 18709224 | ADHESIVE TAPE FOR APPLYING TO AND REMOVING BY TWISTING OFF OR PRYING OFF OBJECTS FROM DELICATE SUBSTRATES | Non-Final OA | tesa SE |
| 18643234 | REACTIVE PRESSURE-SENSITIVE ADHESIVE ELEMENT | Non-Final OA | tesa SE |
| 18129435 | REDETACHABLE SELF-ADHESIVE PRODUCTS | Non-Final OA | tesa SE |
| 18659267 | ADHESIVE COMPOSITIONS AND TAPES MADE THERFROM | Non-Final OA | DelStar Technologies, Inc. |
| 18477432 | SEALED LAMINATED WINDOW UNIT | Non-Final OA | DelStar Technologies, Inc. |
| 18577439 | BIAXIALLY ORIENTED LAMINATED POLYPROPYLENE FILM | Non-Final OA | TOYOBO CO., LTD. |
| 17801291 | SELF-ADHERING ROOFING MEMBRANE COMPOSITES | Final Rejection | Amrize Technology Switzerland LLC |
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