Listed by the USPTO as WARD, DAVID WILLIAM
Tech Center 2800 • Art Units: 2891
This examiner grants 62% of resolved cases
WARD, DAVID WILLIAM works in tech center 2800 and art unit 2891. The profile records 80 resolved cases, an allowance rate of 62.5%, and a median of 1342 days to allowance. Interview lift is 36.7%, indicating a substantial positive association between interviews and allowance outcomes. The median timing figure points to a prosecution path that applicants should incorporate into portfolio planning.
Associated companies include Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and LG Display Co., Ltd. The listed firms are Bayes PLLC, BIRCH STEWART KOLASCH & BIRCH, LLP, and Haynes and Boone, LLP (24061). The portfolio centers on semiconductor and display applicants. A focused interview strategy may be useful alongside detailed responses addressing technical distinctions.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18812022 | METHOD OF FABRICATING MAGNETIC MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18661906 | INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18393855 | LIGHT-EMITTING DIODE PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18390782 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18512199 | PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18641403 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18060505 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 17874763 | Display Device and Method for Manufacturing Cushion Plate | Final Rejection | LG Display Co., Ltd. |
| 18781655 | PIXEL AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17876788 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17874556 | SEALING STRUCTURE AND DISPLAY DEVICE HAVING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17851668 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18294638 | SEMICONDUCTOR DEVICE PACKAGE AND HEAT-DISSIPATING LEAD FRAME | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18262726 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17910221 | DISPLAY DEVICE AND ELECTRONIC APPARATUS | Final Rejection | Sony Semiconductor Solutions Corporation |
| 17630666 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18390887 | GATE-ALL-AROUND AND FORKSHEET DEVICE ARCHITECTURE IN STANDARD CELLS | Final Rejection | QUALCOMM Incorporated |
| 18126857 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY | Non-Final OA | Intel Corporation |
| 17848660 | VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT | Final Rejection | Intel Corporation |
| 18704779 | MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY | Non-Final OA | TDK Corporation |
| 18639781 | MULTIPLE METAL WORD LINE GATES IN A THREE DIMENSIONAL MEMORY ARRAY | Non-Final OA | Micron Technology, Inc. |
| 18391307 | INTEGRATED CIRCUIT (IC) WITH CORRUGATED CHANNEL STRUCTURES HAVING VERTICALLY SEPARATED SOURCE AND BODY CONTACT REGIONS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18708553 | METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE | Non-Final OA | AMS-OSRAM INTERNATIONAL GMBH |
| 17455226 | EMBEDDED MAGNETORESISTIVE RANDOM ACCESS MEMORY TOP ELECTRODE STRUCTURE | Non-Final OA | International Business Machines Corporation |
| 18268804 | POWER SEMICONDUCTOR DEVICE WITH AN INSULATED TRENCH GATE ELECTRODE AND METHOD OF PRODUCING A POWER SEMICONDUCTOR DEVICE | Final Rejection | Hitachi Energy Ltd |
| 18809348 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE REGIONS HAVING RECESSED PORTIONS | Non-Final OA | SK hynix Inc. |
| 18390993 | SYSTEMS AND METHODS FOR THREE PART SYSTEM ON CHIP MEMORY STACKING | Final Rejection | Meta Platforms Technologies, LLC |
| 18789569 | SEMICONDUCTOR DEVICES HAVING PARASITIC CHANNEL STRUCTURES | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18746081 | FIN-TYPE FIELD EFFECT TRANSISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18679251 | PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy62.5% of resolved applications examined by David William Ward were allowed (80 resolved cases), compared with 69.5% across Art Unit 2891 over the last five years.
This examiner's interview lift is +36.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by David William Ward took 1,342 days on average from filing to allowance.
David William Ward examines applications in Art Unit 2891 in Tech Center 2800 (Semiconductors, Circuits & Optics).
