Listed by the USPTO as WHALEN, DANIEL B
Tech Center 2800 • Art Units: 2800 2829 2893
This examiner grants 80% of resolved cases
WHALEN, DANIEL B is assigned to Tech Center 2800 and Art Unit 2800. His record includes 1029 resolved cases, with an allowance rate of 80.3% and a median of 876 days to allowance. The 15.9% interview lift is positive, showing that interviews are associated with improved outcomes while the overall record already reflects a high rate of allowance.
The listed companies are Samsung Electronics Co., Ltd., Samsung Display Co., Ltd., and Semiconductor Energy Laboratory Co., Ltd. The listed firms are FISH & RICHARDSON P.C. (TC), Womble Bond Dickinson US LLP, and CANTOR COLBURN LLP. Practitioners may benefit from using interviews to resolve focused issues without overcomplicating the written record. The 876-day median provides a meaningful timing consideration for portfolio planning and continuation decisions.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18791709 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18653571 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18435107 | ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE CHANGE MATERIAL | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18428207 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18489220 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18389836 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17932475 | Purcell-Effect-Enhanced Organic Light Emitting Diodes with Sub-Electrode Microlens Array | Final Rejection | The Regents of the University of Michigan |
| 17581736 | ORGANIC LIGHT EMITTING DEVICE COMPRISING ORGANIC EMISSIVE LAYER BETWEEN ANODE-SIDE REFLECTOR AND CATHODE-SIDE REFLECTOR | Final Rejection | The Regents of the University of Michigan |
| 18526098 | ELECTRICAL AND/OR ELECTRONIC DEVICE | Final Rejection | Robert Bosch GmbH |
| 18913532 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE USING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18636893 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18428136 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Display Co., Ltd. |
| 18465289 | ELECTRON TRANSPORT LAYER INCLUDING MIXED COMPOSITION, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE INCLUDING THE ELECTRON TRANSPORT LAYER, AND LIGHT-EMITTING DEVICE AND ELECTRONIC DEVICE USING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17933670 | LIGHT-EMITTING DEVICE COMPRISING ANTI-OXIDATION LAYER BETWEEN ELECTRON TRANSPORT REGION AND SECOND ELECTRODE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 17925376 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF, AND LIGHT EMITTING APPARATUS | Final Rejection | BOE Technology Group Co., Ltd. |
| 17914155 | OLED DISPLAY DEVICE HAVING BLUE LIGHT-EMITTING STRUCTURE WITH ANISOTROPIC REFRACTIVE INDEX, AND DISPLAY DEVICE AND DISPLAY PANEL HAVING OLED DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18437444 | CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE | Non-Final OA | Huawei Technologies Co., Ltd. |
| 17928659 | LIGHT-EMITTING DEVICE, FUNCTIONAL PANEL, LIGHT-EMITTING APPARATUS, DISPLAY DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 18420465 | PEDMOS Transistor Devices | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18542928 | SELF-ALIGNED DIELECTRIC ISOLATION ON SOURCE/DRAINS | Final Rejection | International Business Machines Corporation |
| 18183189 | METHOD AND STRUCTURE OF ACCURATELY CONTROLLING CONTACT GOUGING POSITION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18394775 | BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE INCLUDING THE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18276026 | ELECTROLUMINESCENT ELEMENT | Non-Final OA | TOPPAN INC. |
| 18273976 | ELECTROLUMINESCENT DEVICE AND DISPLAY DEVICE | Non-Final OA | TOPPAN INC |
| 18934303 | NITRIDE SEMICONDUCTOR DEVICE COMPRISING LAYERED STRUCTURE OF ACTIVE REGION AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | ROHM CO., LTD. |
| 18450140 | IN-TRENCH CAPACITOR MERGED STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18502966 | SOLDER PREFORMS WITH EMBEDDED BEADS TO ACT AS STANDOFFS | Final Rejection | Dell Products L.P. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy80.3% of resolved applications examined by Daniel B Whalen were allowed (1,029 resolved cases), compared with 69.7% across Art Unit 2800 over the last five years.
This examiner's interview lift is +15.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Daniel B Whalen took 876 days on average from filing to allowance.
Daniel B Whalen examines applications in Art Unit 2800 in Tech Center 2800 (Semiconductors, Circuits & Optics).
