Tech Center 2800 • Art Units: 1713 1714 1718 2817 2893
This examiner grants 65% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18199982 | PLASMA CONTROL APPARATUS AND METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18504452 | OPTICAL ABSORPTION SENSOR FOR SEMICONDUCTOR PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18238810 | METHOD AND APPARATUS FOR GAS DELIVERY IN A PROCESSING CHAMBER | Non-Final OA | Applied Materials, Inc. |
| 18231655 | Electrostatic Chuck with High Cooling Efficiency | Non-Final OA | Applied Materials, Inc. |
| 18220020 | WIRELESS DATA COMMUNICATION IN PLASMA PROCESS CHAMBER THROUGH VI SENSOR AND RF GENERATOR | Non-Final OA | Applied Materials, Inc. |
| 18330687 | METHODS AND APPARATUS FOR RPS-RF PLASMA CLEAN AND ACTIVATION FOR ADVANCED SEMICONDUCTOR PACKAGING | Non-Final OA | Applied Materials, Inc. |
| 18225077 | SEASONING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18273446 | APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE | Final Rejection | Tokyo Electron Limited |
| 18162876 | Antenna Plane Magnets | Final Rejection | Tokyo Electron Limited |
| 17904427 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18186997 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18082044 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kokusai Electric Corporation |
| 18691817 | REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING | Non-Final OA | Lam Research Corporation |
| 17928426 | PHOTOELECTRON ASSISTED PLASMA IGNITION | Final Rejection | LAM RESEARCH CORPORATION |
| 18221603 | ADAPTIVE AND RETROSPECTIVE ENDPOINT DETECTION FOR AUTOMATED DELAYERING OF SEMICONDUCTOR SAMPLES | Non-Final OA | FEI Company |
| 18434762 | ELECTROCHEMICAL-MECHANICAL THINNING METHOD AND APPARATUS FOR LARGE-DIAMETER SEMICONDUCTOR WAFERS | Non-Final OA | XI’AN JIAOTONG UNIVERSITY |
| 18447012 | FEEDING BLOCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | WONIK IPS CO., LTD. |
| 17914633 | PRINT HEADS AND CONTINUOUS PROCESSES FOR PRODUCING ELECTRICALLY CONDUCTIVE MATERIALS | Non-Final OA | Soliyarn LLC |
| 17288070 | PLASMA SOURCE AND METHOD FOR PREPARING AND COATING SURFACES USING ATMOSPHERIC PLASMA PRESSURE WAVES | Non-Final OA | Atmospheric Plasma Solutions, Inc. |
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