Listed by the USPTO as ZERVIGON, RUDY
Tech Center 2800 • Art Units: 1713 1714 1715 1716 1718 1792 2812 2881
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18669753 | SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18479233 | ATOMIC LAYER DEPOSITION APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18327211 | PLASMA POST-PROCESSING APPARATUS AND PLASMA POST-PROCESSING METHOD USING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 19313558 | SEMICONDUCTOR PROCESSING SYSTEMS AND ASSOCIATED METHODS FOR FORMING SUPER-LATTICE STRUCTURES USING SEMICONDUCTOR PROCESSING SYSTEMS | Non-Final OA | ASM IP Holding B. V. |
| 18386481 | CHAMBER LINER FOR SUBSTRATE PROCESSING APPARATUS | Non-Final OA | ASM IP Holding B.V. |
| 18773920 | SYSTEM AND METHOD FOR RECLAIMING TUNGSTEN COMPOUNDS | Non-Final OA | Micron Technology, Inc. |
| 18856129 | FLOWRATE CONTROL UNIT FOR TEMPERATURE ADJUSTMENT AND SEMICONDUCTOR MANUFACTURING DEVICE | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18159865 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR PROCESSING SUBSTRATE | Non-Final OA | Tokyo Electron Limited |
| 18014884 | FILM FORMING APPARATUS AND FILM FORMING METHOD | Final Rejection | Tokyo Electron Limited |
| 17845354 | SHOWER HEAD AND PLASMA PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 18652612 | PROCESSING CHAMBER AND METHOD FOR INTEGRATED ETCHING AND DEPOSITION | Final Rejection | Applied Materials, Inc. |
| 18589251 | LINERS HAVING FLOW OPENINGS, AND RELATED CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18391089 | CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION IN SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18540680 | GAS FLOW SUBSTRATE SUPPORTS, PROCESSING CHAMBERS, AND RELATED METHODS AND APPARATUS, FOR SEMICONDUCTOR MANUFACTURING | Final Rejection | Applied Materials, Inc. |
| 18558817 | NOZZLE FOR A DISTRIBUTOR OF A MATERIAL DEPOSITION SOURCE, MATERIAL DEPOSITION SOURCE, VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL | Final Rejection | Applied Materials, Inc. |
| 18065742 | Gas Distribution Apparatuses | Non-Final OA | Applied Materials, Inc. |
| 18077087 | REDUCTION OF BR2 AND CL2 IN SEMICONDUCTOR PROCESSES | Final Rejection | Applied Materials, Inc. |
| 18279027 | AUTOMATED THIN FILM DEPOSITION SYSTEM AND THIN FILM DEPOSITION METHOD TO WHICH MACHINE LEARNING IS APPLIED | Final Rejection | SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy66.9% of resolved applications examined by Rudy Zervigon were allowed (1,082 resolved cases), compared with 62.4% across Art Unit 1713 over the last five years.
This examiner's interview lift is -5.4 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Rudy Zervigon took 1,251 days on average from filing to allowance.
Rudy Zervigon examines applications in Art Unit 1713 in Tech Center 2800 (Semiconductors, Circuits & Optics).
