Prosecution Insights
Prosecution Insights
9 pending office actions • 3 clients • 9 examiners • 8 art units • 0 of 9 (0%) have an AI response strategy ready • 31 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 9 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 9 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 3 (33%) |
| §103 only | 6 (67%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| COLLINS, RAVEN | 1 | 62.3% | +10.5% |
| SKIBINSKI, TOMI SWEET | 1 | 83.6% | +3.3% |
| ZHAI, KYLE | 1 | 74.5% | +18.4% |
| BOROWSKI, MICHAEL | 1 | 17.6% | +37.5% |
| PALANISWAMY, KRISHNA JAYANTHI | 1 | 61.5% | +45.5% |
| GAMBETTA, KELLY M | 1 | 72.0% | +32.7% |
| WEINERTH, GIDEON R | 1 | 57.1% | +15.2% |
| WECHSELBERGER, ALFRED H. | 1 | 57.7% | +35.3% |
| CHAVEZ, ANTHONY RAY | 1 | 16.7% | +100.0% |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18833814 | N-POLAR DEVICES INCLUDING A DEPLETING LAYER WITH IMPROVED CONDUCTIVITY | SKIBINSKI, TOMI SWEET | 9d overdue |
| 17958145 | REPOSITIONING COOLING CHANNELS IN COOLING MOLDS | WECHSELBERGER, ALFRED H. | 15d |
| 18141206 | PROJECTING COST METRICS FROM AN ENGINEERING MODEL TO AN ARCHITECTURAL MODEL | BOROWSKI, MICHAEL | 22d |
| 17849483 | MODELLING FLUID FLOW | CHAVEZ, ANTHONY RAY | 26d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18083148 | Thermally Insulating Packaging | WEINERTH, GIDEON R | 72d overdue |
| 18086516 | THREE-DIMENSIONAL PRINTING | GAMBETTA, KELLY M | 49d overdue |
| 18019742 | III-NITRIDE DEVICES INCLUDING A DEPLETING LAYER | PALANISWAMY, KRISHNA JAYANTHI | 8d overdue |
| 17958145 | REPOSITIONING COOLING CHANNELS IN COOLING MOLDS | WECHSELBERGER, ALFRED H. | 15d |
| 18141206 | PROJECTING COST METRICS FROM AN ENGINEERING MODEL TO AN ARCHITECTURAL MODEL | BOROWSKI, MICHAEL | 22d |
| 18365471 | COMPUTER AIDED AUTOMATED SHAPE ADJUSTMENT OF THREE-DIMENSIONAL GEOMETRIES | ZHAI, KYLE | 26d |
| 17849483 | MODELLING FLUID FLOW | CHAVEZ, ANTHONY RAY | 26d |
| 18999777 | INSULATED SHIPPING CONTAINER AND METHOD OF MAKING | COLLINS, RAVEN | 42d |
| Client (Assignee) | Pending OAs |
|---|---|
| Autodesk | 5 |
| Vericool World LLC | 2 |
| Transphorm Technology, Inc. | 2 |
| Art Unit | Apps |
|---|---|
| 2187 | 2 |
| 3735 | 1 |
| 2842 | 1 |
| 2611 | 1 |
| 3624 | 1 |
| 2899 | 1 |
| 1718 | 1 |
| 3736 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18999777 | INSULATED SHIPPING CONTAINER AND METHOD OF MAKING | Vericool World, LLC | COLLINS, RAVEN | 3735 | §103 | Non-Final OA | 42d | Pending | Dec 23, 2024 |
| 18833814 | N-POLAR DEVICES INCLUDING A DEPLETING LAYER WITH IMPROVED CONDUCTIVITY | Transphorm Technology, Inc. | SKIBINSKI, TOMI SWEET | 2842 | §101 | Non-Final OA | 9d overdue | Pending | Jul 26, 2024 |
| 18365471 | COMPUTER AIDED AUTOMATED SHAPE ADJUSTMENT OF THREE-DIMENSIONAL GEOMETRIES | Autodesk, Inc. | ZHAI, KYLE | 2611 | §103 | Final Rejection | 26d | Pending | Aug 04, 2023 |
| 18141206 | PROJECTING COST METRICS FROM AN ENGINEERING MODEL TO AN ARCHITECTURAL MODEL | Autodesk, Inc. | BOROWSKI, MICHAEL | 3624 | §101 | Final Rejection | 22d | Pending | Apr 28, 2023 |
| 18019742 | III-NITRIDE DEVICES INCLUDING A DEPLETING LAYER | Transphorm Technology, Inc. | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103 | Non-Final OA | 8d overdue | Pending | Feb 03, 2023 |
| 18086516 | THREE-DIMENSIONAL PRINTING | Autodesk, Inc. | GAMBETTA, KELLY M | 1718 | §103 | Non-Final OA | 49d overdue | Pending | Dec 21, 2022 |
| 18083148 | Thermally Insulating Packaging | Vericool World, LLC | WEINERTH, GIDEON R | 3736 | §103 | Non-Final OA | 72d overdue | Pending | Dec 16, 2022 |
| 17958145 | REPOSITIONING COOLING CHANNELS IN COOLING MOLDS | Autodesk, Inc. | WECHSELBERGER, ALFRED H. | 2187 | §101 | Non-Final OA | 15d | Pending | Sep 30, 2022 |
| 17849483 | MODELLING FLUID FLOW | Autodesk, Inc. | CHAVEZ, ANTHONY RAY | 2187 | §103 | Final Rejection | 26d | Pending | Jun 24, 2022 |
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