Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 1715 1718 1792 3774
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19008803 | METHOD AND APPARATUS FOR AREA-SELECTIVE DEPOSITION | Non-Final OA | ASM IP Holding B.V. |
| 18815445 | SYSTEMS AND METHODS FOR REMOVING COLLATERAL DEPOSITIONS FROM WITHIN CHAMBER ARRANGEMENTS IN SEMICONDUCTOR PROCESSING SYSTEMS | Final Rejection | ASM IP Holding B.V. |
| 18524307 | SUBSTRATE PROCESSING METHOD | Non-Final OA | ASM IP Holding B.V. |
| 18300301 | DEPOSITION OF FLOWABLE SICN FILMS BY PLASMA ENHANCED ATOMIC LAYER DEPOSITION | Non-Final OA | ASM IP HOLDING B.V. |
| 18072764 | METHODS FOR IMPROVING THIN FILM QUALITY | Non-Final OA | ASM IP Holding B.V. |
| 18636461 | METHODS FOR IMPROVING THROUGHPUT AND GAPFILL QUALITY FOR METAL DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18690370 | GAS-ASSISTED COCRYSTAL DE-SUBLIMATION | Final Rejection | THE REGENTS OF THE UNIVERSITY OF MICHIGAN |
| 18086516 | THREE-DIMENSIONAL PRINTING | Non-Final OA | Autodesk, Inc. |
| 18850155 | FILLING METHOD AND SUBSTRATE PROCESSING SYSTEM | Non-Final OA | Tokyo Electron Limited |
| 18653410 | FILM-FORMING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18584114 | METHOD AND APPARATUS FOR EMBEDDING TUNGSTEN INTO RECESS FORMED ON SUBSTRATE | Final Rejection | Tokyo Electron Limited |
| 18410046 | METHOD OF FORMING SILICON NITRIDE FILM | Non-Final OA | Tokyo Electron Limited |
| 18333724 | FILM FORMING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17620213 | METHOD FOR PRODUCING A SHEET METAL PRODUCT AND SHEET METAL PRODUCT | Non-Final OA | ThyssenKrupp Steel Europe AG |
| 18598293 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18975045 | FINISHING OF ADDITIVELY MANUFACTURED PARTS WITH SMOOTHING AND COLOR | Non-Final OA | PostProcess Technologies, Inc. |
| 18847652 | LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NITRIDE | Non-Final OA | Lam Research Corporation |
| 18764717 | Area-Selective Hardmask Deposition: Methods and Tools for Advanced Patterning | Non-Final OA | Nederlandse Organisatie voor Toegepast-natuurwetenschappelijk onderzoek TNO |
| 18761840 | CERAMIC SUBSTATE WITH REACTION-BONDED SILICON CARBIDE HAVING DIAMOND PARTICLES | Non-Final OA | II-VI Delaware, Inc. |
| 18698210 | METHOD FOR PRODUCING A COATING ON AN OBJECT AND CORRESPONDINGLY PRODUCED COATED BODY | Final Rejection | BOEHLERIT GmbH & Co.KG. |
| 18614659 | APPLICATIONS OF A MATTE COATING LAYER IN PRINTING PROCESSES TO CREATE VARYING VISUAL EFFECTS ON PRINTED ARTICLES | Non-Final OA | HARRIS & BRUNO INTERNATIONAL, INC. |
| 18291335 | SOLUBLE POLYIMIDES FOR COATING ON POLYMERIC SUBSTRATES | Final Rejection | HD MICROSYSTEMS |
| 18416325 | SCALABLE METHOD FOR ACHIEVING SHAPE CONTROL OF DIAMOND MICRO-NANOPARTICLES | Non-Final OA | Dongguan Institute of Opto-electronics, Peking University |
| 18219022 | USING PLASMA ENHANCED PROCESS TO DO PERIODIC MAINTENANCE | Final Rejection | SKY TECH INC. |
| 18314842 | METHOD OF DEPOSITING THIN FILM AND METHOD OF MANUFACTURING MEMORY DEVICE INCLUDING THE SAME | Non-Final OA | EGTM Co., Ltd. |
| 17611754 | PLASMA ETCHING METHOD | Final Rejection | SHOWA DENKO K.K. |
| 18168311 | Stents Having Biodegradable Layers | Non-Final OA | MT Acquisition Holdings LLC |
| 17309458 | A WORKPIECE, A WORKPIECE PROCESSING METHOD AND A WORKPIECE PROCESSING SYSTEM THEREOF | Non-Final OA | Nanowall Technology PTE LTD |
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