Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2439 2815 2899
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18377569 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18356322 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18204783 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18365062 | Recess Island Lid Design for TIM Delamination Risk Mitigation | Final Rejection | Apple Inc. |
| 18378650 | DISPLAY PANEL MANUFACTURING METHOD AND APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 17968080 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17956486 | LOW-COST SURFACE MOUNT EMI GASKETS | Final Rejection | Intel Corporation |
| 18391018 | SYSTEMS AND METHODS FOR THREE-DIMENSIONAL MEMORY STACKING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18232978 | SEMICONDUCTOR MODULE | Final Rejection | Mitsubishi Electric Corporation |
| 18343490 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18483489 | MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS | Non-Final OA | SK hynix Inc. |
| 18492382 | Contact Formation Method and Related Structure | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18418786 | METHODS OF FORMING INTERCONNECT STRUCTURES | Non-Final OA | Applied Materials, Inc. |
| 18419033 | TWINNED MICROMACHINED ULTRASONIC TRANSDUCER | Non-Final OA | Infineon Technologies AG |
| 18388581 | CHIP PACKAGE AND METHOD INCLUDING ENCAPSULATING SPACED CHIPS BY LOCALLY CURABLE MATERIAL | Non-Final OA | Infineon Technologies AG |
| 18369209 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
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