2 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18020349 | DIE AND MANUFACTURING METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR | BAIG, ANEESA RIAZ | 2814 | Final Rejection | Feb 08, 2023 |
| 18013656 | SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE | STARK, JARRETT J | 2898 | Final Rejection | Dec 29, 2022 |
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