Tech Center 2800 • Art Units: 2814
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18630286 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17920351 | FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING SAME, AND DISPLAY PANEL | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18458118 | BONDING-TYPE INTERCONNECTION MEMBER | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 19269841 | THICK REDISTRIBUTION LAYER FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17893736 | METHOD OF MAKING A PLURALITY OF 3D SEMICONDUCTOR DEVICES WITH ENHANCED MOBILITY AND CONDUCTIVITY | Final Rejection | Tokyo Electron Limited |
| 18216404 | UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS | Non-Final OA | International Business Machines Corporation |
| 18179431 | SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING | Final Rejection | International Business Machines Corporation |
| 18635547 | STACKED HIGH-POWER RF SWITCH | Non-Final OA | GlobalFoundries U.S. Inc. |
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