Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18491204 | IMAGE SENSORS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18461569 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18504233 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE COMPRISING THE LIGHT EMITTING ELEMENT | Non-Final OA | Samsung Display Co., LTD. |
| 18100298 | STRUCTURE AND DEVICE INCLUDING METAL CARBON NITRIDE LAYER AND METHOD OF FORMING SAME | Non-Final OA | ASM IP Holding B.V. |
| 18179431 | SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING | Non-Final OA | International Business Machines Corporation |
| 18458118 | BONDING-TYPE INTERCONNECTION MEMBER | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18349351 | UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMATION | Final Rejection | STMicroelectronics International N.V. |
| 18258164 | MULTISPECTRAL INFRARED PHOTODETECTOR | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18469410 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17893736 | METHOD OF MAKING A PLURALITY OF 3D SEMICONDUCTOR DEVICES WITH ENHANCED MOBILITY AND CONDUCTIVITY | Final Rejection | Tokyo Electron Limited |
| 18455857 | PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18304836 | LIGHT-EMITTING DIODE PACKAGES WITH MATERIALS FOR REDUCING EFFECTS OF ENVIRONMENTAL INGRESS | Non-Final OA | CreeLED, Inc. |
| 18141510 | STACKED PACKAGING STRUCTURE AND POWER CONVERTER | Final Rejection | Silergy Semiconductor Technology (Hangzhou) LTD |
| 18206591 | BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING | Final Rejection | WALTON ADVANCED ENGINEERING, INC. |
| 18020349 | DIE AND MANUFACTURING METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR | Final Rejection | CR RUNAN TECHNOLOGIES (CHONGQING) CO. LTD. |
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