3 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18094477 | DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES | CHAN, CANDICE | 2813 | Non-Final OA | Jan 09, 2023 |
| 17800316 | APPARATUS, SYSTEMS AND METHODS FOR LOAD-ADAPTIVE 3D WIRELESS CHARGING | LEE, ERIC D | 2851 | Non-Final OA | Aug 17, 2022 |
| 17881096 | DEVICE STRUCTURE FOR POWER SEMICONDUCTOR TRANSISTOR | ONUTA, TIBERIU DAN | 2814 | Non-Final OA | Aug 04, 2022 |
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