Prosecution Insights
Prosecution Insights
3 pending office actions • 3 art units • 3 examiners • 0 of 3 (0%) have an AI response strategy ready • 1 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 3 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 3 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 3 (100%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHAN, CANDICE | 1 | 72.7% | +19.1% |
| ARORA, AJAY | 1 | 84.2% | +5.6% |
| LEE, ERIC D | 1 | 81.3% | +19.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17800316 | APPARATUS, SYSTEMS AND METHODS FOR LOAD-ADAPTIVE 3D WIRELESS CHARGING | LEE, ERIC D | 29d |
| 17945231 | FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS | ARORA, AJAY | 69d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18094477 | DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES | CHAN, CANDICE | 6d |
| 17800316 | APPARATUS, SYSTEMS AND METHODS FOR LOAD-ADAPTIVE 3D WIRELESS CHARGING | LEE, ERIC D | 29d |
| Art Unit | Apps |
|---|---|
| 2813 | 1 |
| 2892 | 1 |
| 2851 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18094477 | DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES | CHAN, CANDICE | 2813 | §103 | Non-Final OA | 6d | Pending | Jan 09, 2023 |
| 17945231 | FABRICATION OF EMBEDDED DIE PACKAGING COMPRISING LASER DRILLED VIAS | ARORA, AJAY | 2892 | §103 | Non-Final OA | 69d | Pending | Sep 15, 2022 |
| 17800316 | APPARATUS, SYSTEMS AND METHODS FOR LOAD-ADAPTIVE 3D WIRELESS CHARGING | LEE, ERIC D | 2851 | §103 | Non-Final OA | 29d | Pending | Aug 17, 2022 |
IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial