Tech Center 2800 • Art Units: 2800 2813
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18516581 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18226986 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17837150 | UNIFORM SEMICONDUCTOR ACTIVE FIN WIDTH | Final Rejection | International Business Machines Corporation |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17930222 | CONDUCTIVE AND FLEXIBLE SANDWICH-STRUCTURED COMPOSITES INCLUDING THERMOSETTING POLYMER AND METAL-CONTAINING CORE LAYERS | Non-Final OA | ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY |
| 18117498 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18448287 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 17579084 | Transparent OLED Device | Final Rejection | Universal Display Corporation |
| 17816799 | SEMICONDUCTOR STRUCTURE INCLUDING FIELD EFFECT TRANSISTOR WITH SCALED GATE LENGTH AND METHOD | Final Rejection | GlobalFoundries U.S. Inc. |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18628589 | STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEATURES | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18094477 | DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES | Non-Final OA | GaN Systems Inc. |
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