Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2813
This examiner grants 73% of resolved cases
Candice Chan operates as an examiner in Tech Center 2800 and Art Unit 2800. The data shows 555 resolved cases for this examiner. The allowance rate is 72.6 percent, which represents the proportion of applications that are granted. The median days to allowance is 1208, providing a timeline for the prosecution process in this specific unit.
The interview lift is 19.3 percent. This figure indicates that conducting an interview is associated with a 19.3 percent change in the likelihood of allowance. With 555 resolved cases, this lift is a factor in the examiner's profile. The 72.6 percent allowance rate and the 1208 median days to allowance are the available figures for developing a prosecution strategy.
The Art Unit 2800 designation and the Tech Center 2800 location define the scope of this profile. The 72.6 percent allowance rate provides a statistical baseline, while the 19.3 percent interview lift highlights the impact of verbal negotiation. These resolved cases define the current data for this examiner based on the provided prosecution history.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18621451 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18604705 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18398957 | SEMICONDUCTOR LIGHT EMITTING DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18583336 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18516581 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18711620 | LIGHT-EMITTING DIODE ELEMENT | Non-Final OA | STANLEY ELECTRIC CO., LTD. |
| 18379876 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 17918720 | FLIP CHIP MICROLED AND CARTRIDGE ARRANGEMENT | Non-Final OA | VueReal Inc. |
| 18628589 | STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEATURES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17930222 | CONDUCTIVE AND FLEXIBLE SANDWICH-STRUCTURED COMPOSITES INCLUDING THERMOSETTING POLYMER AND METAL-CONTAINING CORE LAYERS | Non-Final OA | ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY |
| 18448287 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18431532 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Kioxia Corporation |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18646469 | CMOS IMAGE SENSOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18527423 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | AUO Corporation |
| 18527170 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17892189 | LIGHT EMITTING DIODE HAVING MULTIPLE ACTIVE LAYERS AND LIGHT EMITTING DEVICE HAVING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 18506008 | MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF | Non-Final OA | JCET GROUP CO., LTD. |
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