Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2813
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18299811 | NEUROMORPHIC MEMORY ELEMENT SIMULTANEOUSLY IMPLEMENTING VOLATILE AND NON-VOLATILE FEATURE FOR EMULATION OF NEURON AND SYNAPSE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18124118 | SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18516581 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18056479 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS | Final Rejection | Mitsubishi Electric Corporation |
| 18379876 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18431219 | PHYSICAL UNCLONABLE FUNCTIONS WITH SILICON-RICH DIELECTRIC DEVICES | Final Rejection | ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY |
| 17930222 | CONDUCTIVE AND FLEXIBLE SANDWICH-STRUCTURED COMPOSITES INCLUDING THERMOSETTING POLYMER AND METAL-CONTAINING CORE LAYERS | Non-Final OA | ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY |
| 18117498 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18449824 | SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18448287 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18646469 | CMOS IMAGE SENSOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18151487 | SEMICONDUCTOR DEVICE | Final Rejection | Industrial Technology Research Institute |
| 18360361 | BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS | Non-Final OA | Sandisk Technologies, Inc. |
| 17579084 | Transparent OLED Device | Final Rejection | Universal Display Corporation |
| 18126690 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 17892189 | LIGHT EMITTING DIODE HAVING MULTIPLE ACTIVE LAYERS AND LIGHT EMITTING DEVICE HAVING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 18355683 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING IMPROVED DEEP SHIELD CONNECTION PATTERNS | Non-Final OA | Wolfspeed, Inc. |
| 18130838 | HIGH LINEARITY FET WITH BURIED GATE STRUCTURES AND TAPERED CHANNEL LAYER | Final Rejection | Teledyne Scientific & Imaging, LLC |
| 18094477 | DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES | Non-Final OA | GaN Systems Inc. |
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