3 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18233092 | POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Aug 11, 2023 |
| 18330284 | THIN SUBSTRATE PACKAGE AND LEAD FRAME | WATTS, JEREMY DANIEL | 2897 | Final Rejection | Jun 06, 2023 |
| 17346766 | SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL LEADS | BOYLE, ABBIGALE A | 2899 | Non-Final OA | Jun 14, 2021 |
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