Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2891 2899
This examiner grants 60% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18376341 | BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS | Final Rejection | Intel Corporation |
| 16810589 | PACKAGE COMPRISING DUMMY INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 17730217 | SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 15931525 | ENCAPSULATION STRUCTURE | Non-Final OA | Industrial Technology Research Institute |
| 17737831 | PACKAGE WITH LASER LAPPED SURFACE AND METHOD OF MANUFACTURING SAME | Final Rejection | Analog Devices International Unlimited Company |
| 16704644 | Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection | Final Rejection | Wolfspeed, Inc. |
| 16877197 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Advanced Semiconductor Engineering, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy