Tech Center 2800 • Art Units: 2816 2891 2899
This examiner grants 61% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18376341 | BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS | Final Rejection | Intel Corporation |
| 16810589 | PACKAGE COMPRISING DUMMY INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 15931525 | ENCAPSULATION STRUCTURE | Non-Final OA | Industrial Technology Research Institute |
| 16877197 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 17737831 | PACKAGE WITH LASER LAPPED SURFACE AND METHOD OF MANUFACTURING SAME | Final Rejection | Analog Devices International Unlimited Company |
| 16704644 | Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection | Final Rejection | Wolfspeed, Inc. |
| 17346766 | SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL LEADS | Non-Final OA | STMICROELECTRONICS, INC. |
| 17336150 | POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE | Non-Final OA | SEMIKRON ELEKTRONIK GMBH & CO. KG |
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