Prosecution Insights
Last updated: August 18, 2026

Examiner: BOYLE, ABBIGALE A

Tech Center 2800 • Art Units: 2816 2891 2899

This examiner grants 60% of resolved cases

Performance Statistics

60.3%
Allow Rate
-7.7% vs TC avg
397
Total Applications
+12.5%
Interview Lift
1240
Avg Prosecution Days
Based on 353 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
25.9%
§102 Novelty
54.7%
§103 Obviousness
18.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
17942019 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
18376341 BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS Final Rejection Intel Corporation
17703843 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Non-Final OA YANGTZE MEMORY TECHNOLOGIES CO., LTD.
16160197 PRE-PATTERNED FINE-PITCH BOND PAD INTERPOSER Final Rejection SK Hynix NAND Product Solutions Corp. (dba Solidigm)
18361747 STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE Non-Final OA Texas Instruments Incorporated
18345566 Alternating Lead Configuration for Semiconductor Package Non-Final OA Texas Instruments Incorporated
17720159 ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY Final Rejection Texas Instruments Incorporated
17359635 SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18076538 METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE Non-Final OA Infineon Technologies AG
17137562 METHOD AND APPARATUS FOR CHIP MANUFACTURING Non-Final OA ADVANCED MICRO DEVICES, INC.
17737831 PACKAGE WITH LASER LAPPED SURFACE AND METHOD OF MANUFACTURING SAME Non-Final OA Analog Devices International Unlimited Company
18062479 DIE ATTACHMENT METHOD FOR SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE Non-Final OA STMICROELECTRONICS S.r.l.
17509758 SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ENCAPSULATION FOR ELECTROMAGNETIC SHIELDING Non-Final OA STMICROELECTRONICS, INC.
15931525 ENCAPSULATION STRUCTURE Non-Final OA Industrial Technology Research Institute
18194811 CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS Non-Final OA SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

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