Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2891 2899
This examiner grants 60% of resolved cases
Abbigale A. Boyle is an examiner in Tech Center 2800 and Art Unit 2816. The examiner has 355 resolved cases on record. The data shows an allowance rate of 60.0% for these applications. This 60.0% allowance rate provides a metric for the frequency of successful outcomes. The median days to allowance is 1241, which establishes a timeframe for the duration of the examination process from filing to the final grant.
The profile also includes an interview lift of 13.1%. This lift indicates that conducting an interview with the examiner correlates with a change in the likelihood of success. For practitioners, the 13.1% lift suggests that direct communication is a useful strategy for addressing rejections. With 355 resolved cases, the examiner's history provides a basis for these observations. The 1241-day median to allowance remains a key consideration for managing client expectations and prosecution resources in Art Unit 2816.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17942019 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18076538 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE | Non-Final OA | Infineon Technologies AG |
| 16160197 | PRE-PATTERNED FINE-PITCH BOND PAD INTERPOSER | Final Rejection | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18361747 | STRESS RELIEF SAWN QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18345566 | Alternating Lead Configuration for Semiconductor Package | Non-Final OA | Texas Instruments Incorporated |
| 17953410 | MOLD, LEAD FRAME, METHOD, AND ELECTRONIC DEVICE WITH EXPOSED DIE PAD PACKAGING | Non-Final OA | Texas Instruments Incorporated |
| 17359635 | SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18062479 | DIE ATTACHMENT METHOD FOR SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 17509758 | SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ENCAPSULATION FOR ELECTROMAGNETIC SHIELDING | Non-Final OA | STMICROELECTRONICS, INC. |
| 17730217 | SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17737831 | PACKAGE WITH LASER LAPPED SURFACE AND METHOD OF MANUFACTURING SAME | Non-Final OA | Analog Devices International Unlimited Company |
| 15931525 | ENCAPSULATION STRUCTURE | Non-Final OA | Industrial Technology Research Institute |
| 18194811 | CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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