Listed by the USPTO as BOULGHASSOUL, YOUNES
Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
BOULGHASSOUL, YOUNES examines applications in tech center 2800 and art unit 2814. The profile includes 532 resolved cases, an 88.3% allowance rate, and a median of 807 days to allowance. The interview lift is 6.9%, showing a positive but comparatively modest association between interviews and allowance.
The leading companies are Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, and Samsung Display Co., Ltd. The principal firms are SCHWABE, WILLIAMSON & WYATT, P.C., BIRCH STEWART KOLASCH & BIRCH, LLP, and CKC & Partners Co., LLC. Practitioners can plan around a high allowance rate and a median timeline of 807 days, with interviews serving as a supporting rather than dominant tactic.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18441071 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18396224 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18624012 | LIGHT EMITTING DISPLAY DEVICE INCLUDING SHAPED LIGHT EMITTING AREAS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18531428 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18506402 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18469465 | SELF-ALIGNED BACKSIDE INTERCONNECT | Non-Final OA | QUALCOMM Incorporated |
| 17958302 | SOURCE/DRAIN CONTACTS FOR NON-PLANAR TRANSISTORS | Non-Final OA | Intel Corporation |
| 18411331 | SEMICONDUCTOR PROCESSING INTEGRATION FOR BIPOLAR JUNCTION TRANSISTOR (BJT) | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18596803 | DEEP VIA STRUCTURES FOR STACKED TRANSISTOR DEVICES | Non-Final OA | International Business Machines Corporation |
| 18537385 | THERMAL TRANSFER VIAS AND SEMICONDUCTOR VIA STRUCTURE FOR ENHANCED THERMAL TRANSFER | Non-Final OA | International Business Machines Corporation |
| 18423437 | INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS | Non-Final OA | Applied Materials, Inc. |
| 18391776 | DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS | Non-Final OA | Applied Materials, Inc. |
| 18648510 | METHODS FOR FORMING SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18582200 | PIXEL SENSOR ARRAYS AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17890571 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18630164 | INTERCONNECTION STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18457975 | SEMICONDUCTOR GAP FILL AND PLANARIZATION | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18149265 | Via Structures | Non-Final OA | Taiwan Semiconductor Manufacturing Co. Ltd. |
| 18464287 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18408602 | SEMICONDUCTOR STRUCTURE WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy88.3% of resolved applications examined by Younes Boulghassoul were allowed (532 resolved cases), compared with 74.2% across Art Unit 2814 over the last five years.
This examiner's interview lift is +6.9 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Younes Boulghassoul took 807 days on average from filing to allowance.
Younes Boulghassoul examines applications in Art Unit 2814 in Tech Center 2800 (Semiconductors, Circuits & Optics).
