Listed by the USPTO as CHEN, KEATH T
Tech Center 1700 • Art Units: 1711 1712 1713 1716 1718 1792
This examiner grants 30% of resolved cases
CHEN, KEATH T is a USPTO patent examiner in tech center 1700 and art unit 1711. The record includes 1160 resolved cases, an allowance rate of 30.2%, and a median of 1356 days to allowance. The interview lift is 24.7%, showing a positive interview-associated difference despite the lower overall allowance result in the profile.
The listed companies are Applied Materials Inc., Tokyo Electron Limited, and Samsung Display Co., Ltd. The listed firms are HARNESS, DICKEY & PIERCE, P.L.C., CANTOR COLBURN LLP, and NIXON & VANDERHYE, PC. Practitioners should account for the recorded allowance outcome and timing, while evaluating whether interviews can address the issues driving prosecution difficulty.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18442991 | SUBSTRATE SUPPORT, THIN FILM PROCESSING DEVICE, AND THIN FILM DEPOSITION CONTROL METHOD USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18442548 | CHEMICAL LIQUID SUPPLY APPARATUS, AND SUBSTRATE TREATING APPARATUS HAVING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18409082 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18933462 | DEPOSITION MASK AND DEPOSITION EQUIPMENT INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18449822 | MASK ASSEMBLY AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18366820 | DEPOSITION SOURCE AND DEPOSITION APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18296490 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18696355 | EVAPORATION MASK, EVAPORATION DEVICE, AND EVAPORATION METHOD | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18243173 | SYSTEM AND APPARATUS FOR A LIFT PIN | Non-Final OA | ASM IP Holding B.V. |
| 17346347 | SYSTEMS AND METHODS FOR GRAFTING A MOLECULAR CODE ONTO A MATERIAL BY AN ATMOSPHERIC PLASMA TREATMENT | Final Rejection | Illinois Tool Works Inc. |
| 18493614 | DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF | Final Rejection | Lam Research Corporation |
| 18035200 | PEDESTAL INCLUDING SEAL | Non-Final OA | LAM RESEARCH CORPORATION |
| 17910139 | SUBSTRATE SUPPORTS INCLUDING BONDING LAYERS WITH STUD ARRAYS FOR SUBSTRATE PROCESSING SYSTEMS | Non-Final OA | LAM RESEARCH CORPORATION |
| 18754488 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18750960 | SYSTEMS FOR REAL-TIME PULSE MEASUREMENT AND PULSE TIMING ADJUSTMENT TO CONTROL PLASMA PROCESS PERFORMANCE | Non-Final OA | Tokyo Electron Limited |
| 18600373 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | TOKYO ELECTRON LIMITED |
| 18589744 | DISTRIBUTOR AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18453350 | PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18353747 | PLASMA PROCESSING APPARATUS AND PLASMA STATE ESTIMATION METHOD | Final Rejection | TOKYO ELECTRON LIMITED |
| 18156618 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17983128 | UPPER ELECTRODE AND PLASMA PROCESSING APPARATUS | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18442808 | LOCAL PART MASKING FOR IMPROVED UNIFORMITY IN CERAMIC MATRIX COMPOSITES | Final Rejection | RTX Corporation |
| 18113846 | PLASMA PROCESSING APPARATUS | Non-Final OA | Hitachi High-Tech Corporation |
| 18627065 | PLASMA SHOWERHEAD ASSEMBLY | Final Rejection | Applied Materials, Inc. |
| 18603672 | SEMICONDUCTOR PROCESSING CHAMBER LID AND SEALING MECHANISM | Non-Final OA | Applied Materials, Inc. |
| 18526788 | HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY | Final Rejection | Applied Materials, Inc. |
| 18523394 | SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION | Non-Final OA | Applied Materials, Inc. |
| 18198123 | SENSOR FOR MEASUREMENT OF RADICALS | Non-Final OA | Applied Materials, Inc. |
| 18094765 | CHAMBERS, METHODS, AND APPARATUS FOR GENERATING ATOMIC RADICALS USING UV LIGHT | Non-Final OA | Applied Materials, Inc. |
| 17693037 | SEMICONDUCTOR CHAMBER COMPONENTS WITH MULTI-LAYER COATING | Final Rejection | Applied Materials, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy30.2% of resolved applications examined by Keath T Chen were allowed (1,160 resolved cases), compared with 63.9% across Art Unit 1711 over the last five years.
This examiner's interview lift is +24.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Keath T Chen took 1,356 days on average from filing to allowance.
Keath T Chen examines applications in Art Unit 1711 in Tech Center 1700 (Chemistry & Materials).
