Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18516367 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18508445 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18352177 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18216157 | SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18368966 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18567154 | LIGHT EMITTING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | Sony Semiconductor Solutions Corporation |
| 18399017 | STACKED FORKSHEET TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18352847 | Structure and Method for High-Voltage Device | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17855568 | SINX BASED SURFACE FINISH ARCHITECTURE | Non-Final OA | Intel Corporation |
| 18463792 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18384029 | WAFER-LEVEL HYBRID BONDED RF SWITCH WITH REDISTRIBUTION LAYER | Non-Final OA | Qorvo US, Inc. |
| 18366469 | CONTACT PLUG STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18174932 | SEMICONDUCTOR DEVICE | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18283837 | SEMICONDUCTOR SUBSTRATE COMPRISING A THROUGH-SUBSTRATE-VIA AND METHOD FOR PRODUCING THEREOF | Non-Final OA | ams-OSRAM AG |
| 18539321 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18096811 | ELECTROSTATIC DEVICE | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18073536 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | DB HiTek Co., Ltd. |
| 18200931 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
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