Listed by the USPTO as FARMER, EMILY NICOLE
Tech Center 2800 • Art Units: 2812
This examiner grants 90% of resolved cases
FARMER, EMILY NICOLE is a USPTO patent examiner in Tech Center 2800 and Art Unit 2812. The profile covers 51 resolved cases, with a 90.2% allowance rate and a 5.2% interview lift. Median time to allowance is 1106 days.
Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, and Fuji Electric Co., Ltd. are the leading companies represented. Calderon Safran & Wright P.C., DITTHAVONG, STEINER, & MLOTKOWSKI, and Essential Patents Group, LLP. are the leading firms. The allowance figure supports careful preservation of claim scope, while the modest interview figure indicates that interviews may have a narrower role in the recorded prosecution outcomes.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18473277 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18715878 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17957359 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Final Rejection | Intel Corporation |
| 18562086 | DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18594394 | MAGNETIC MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18931423 | SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18067705 | SCREEN LAYER INTEGRATION IN GALLIUM NITRIDE TECHNOLOGY | Final Rejection | Texas Instruments Incorporated |
| 18756772 | HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES | Non-Final OA | International Business Machines Corporation |
| 18674220 | SENSOR PROTECTION OF GLASSLESS WAFER-LEVEL OPTICAL SENSOR PACKAGING | Non-Final OA | STMICROELECTRONICS INTERNATIONAL N.V. |
| 18402976 | INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18185394 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18889666 | PACKAGE SUBSTRATE INCLUDING FIBER-REINFORCED DIELECTRIC LAYER, PACKAGE STRUCTURE INCLUDING THE PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18860688 | LAMINATE MANUFACTURING METHOD, INSULATION MATERIAL, AND LAMINATE | Non-Final OA | Resonac Corporation |
| 17874709 | BUILT-IN TEMPERATURE SENSORS | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy90.2% of resolved applications examined by Emily Nicole Farmer were allowed (51 resolved cases), compared with 82.1% across Art Unit 2812 over the last five years.
This examiner's interview lift is +5.2 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Emily Nicole Farmer took 1,106 days on average from filing to allowance.
Emily Nicole Farmer examines applications in Art Unit 2812 in Tech Center 2800 (Semiconductors, Circuits & Optics).
