Technology area: Semiconductors, Circuits & Optics
79 pending office actions • 1 client • 76 examiners • 39 art units • 29 of 79 (37%) have an AI response strategy ready
Essential Patents Group, LLP. handles matters in Semiconductors, Circuits & Optics and records 2866 career applications. Its profile shows 75 pending office actions, reflecting a significant active docket supported by a substantial application history.
The resolved allowance rate is 91.72%, and the average office actions per allowance is 3.17. The rate indicates favorable results among resolved matters, while the action average shows that allowances commonly follow repeated examination interaction rather than an isolated office-action response.
These figures are relevant to applicants with technically dense semiconductor, circuit, or optics claims. The profile suggests experience balancing prosecution volume with continued work on claim distinctions and amendments. Practitioners should treat the allowance rate as an outcome indicator and the action average as a separate planning signal for prosecution effort.
Based on the USPTO statutory response window for each pending office action. 23 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 23 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 3 (4%) |
| §103 only | 35 (44%) |
| §102 only | 6 (8%) |
| §112 only | 2 (3%) |
| Double-patenting + other | 2 (3%) |
| Multi-statute (no §101) | 23 (29%) |
| No statute on record | 8 (10%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| COMBER, KEVIN J | 2 | 82.7% | +11.7% |
| KOLB, THADDEUS J | 2 | 85.7% | +20.8% |
| VALENZUELA, PATRICIA D | 2 | 90.3% | +2.0% |
| BROMELL, ALEXANDRIA Y | 1 | 75.5% | +10.3% |
| RECEK, JASON D | 1 | 70.9% | +22.1% |
| TALUKDAR, ARVIND | 1 | 80.1% | +4.3% |
| WILLIAMS, CLAYTON R | 1 | 81.9% | -4.8% |
| ASSOUMAN, HERVE-LOUIS Y | 1 | 91.4% | +4.1% |
| GEYER, SCOTT B | 1 | 94.2% | +4.2% |
| ANDERSON, WILLIAM H | 1 | 84.9% | +18.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | WILLIAMS, CLAYTON R | — |
| 18762478 | PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER | GEYER, SCOTT B | — |
| 18762484 | POWER DELIVERY STRUCTURES | ANDERSON, WILLIAM H | — |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | COMBER, KEVIN J | — |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | COMBER, KEVIN J | — |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | VALENZUELA, PATRICIA D | — |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | XU, ZHIJUN | 66d overdue |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | CHEN, YU | 44d overdue |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | HANUMASAGAR, SHAMITA S | 18d overdue |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | KOLB, THADDEUS J | 10d overdue |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | ANGUIANO, MICHAEL | 5d overdue |
| 17903327 | METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION | KE, PENG | 9d |
| 17955187 | SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS | GREWAL, HEIM KIRIN | 27d |
| 18114120 | PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT | GARCES, NELSON Y | 28d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | KOLB, THADDEUS J | 10d overdue |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | KOLB, THADDEUS J | 30d |
| 19372602 | Untitled | BROMELL, ALEXANDRIA Y | — |
| 19260043 | TECHNOLOGIES FOR ALLOCATING RESOURCES ACROSS DATA CENTERS | RECEK, JASON D | — |
| 18762484 | POWER DELIVERY STRUCTURES | ANDERSON, WILLIAM H | — |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | COMBER, KEVIN J | — |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | COMBER, KEVIN J | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 79 |
| Art Unit | Apps |
|---|---|
| 2812 | 10 |
| 2898 | 6 |
| 2874 | 5 |
| 2817 | 4 |
| 2814 | 4 |
| 2838 | 4 |
| 2899 | 4 |
| 2443 | 3 |
| 2897 | 3 |
| 2818 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19372602 | Untitled | Intel Corporation | BROMELL, ALEXANDRIA Y | 2156 | — | Non-Final OA | — | Pending | |
| 19260043 | TECHNOLOGIES FOR ALLOCATING RESOURCES ACROSS DATA CENTERS | Intel Corporation | RECEK, JASON D | 2458 | §103 | Non-Final OA | — | Pending | Jul 03, 2025 |
| 18868623 | VARIABLE CACHELINE SET MAPPING | Intel Corporation | TALUKDAR, ARVIND | 2132 | §102§103 | Final Rejection | — | Pending | Nov 22, 2024 |
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | Intel Corporation | WILLIAMS, CLAYTON R | 2443 | §103Other | Non-Final OA | — | AI Ready | Oct 11, 2024 |
| 18907358 | ARRAYS OF DOUBLE-SIDED DRAM CELLS INCLUDING CAPACITORS ON THE FRONTSIDE AND BACKSIDE OF A STACKED TRANSISTOR STRUCTURE | Intel Corporation | ASSOUMAN, HERVE-LOUIS Y | 2812 | Other | Non-Final OA | — | Pending | Oct 04, 2024 |
| 18762478 | PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER | Intel Corporation | GEYER, SCOTT B | 2812 | §102DP | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18762484 | POWER DELIVERY STRUCTURES | Intel Corporation | ANDERSON, WILLIAM H | 2817 | §102Other | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18734891 | VIRTUAL EXECUTION ENVIRONMENT POWER USAGE | Intel Corporation | KAMRAN, MEHRAN | 2196 | — | Final Rejection | — | Pending | Jun 05, 2024 |
| 18668042 | MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES | Intel Corporation | PATEL, REEMA | 2812 | §102§103DP | Non-Final OA | — | Pending | May 17, 2024 |
| 18399494 | Comb Laser Source Architectures for Photonic integrated Circuits | Intel Corporation | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | 71d | AI Ready | Dec 28, 2023 |
| 18399503 | SILICON PHOTONIC INTEGRATED CIRCUITS WITH LOCALIZED THICK BURIED INSULATOR | Intel Corporation | GREEN, TAJANAE NICOLE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18478589 | METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MANAGE NETWORK COMMUNICATIONS IN TIME SENSITIVE NETWORKS | Intel Corporation | WIDHALM DE RODRIG, ANGELA MARIE | 2443 | §102 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18374516 | SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS | Intel Corporation | ONUTA, TIBERIU DAN | 2814 | — | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18240271 | DEVICE, METHOD AND SYSTEM TO SUPPORT A SYNCHRONOUS DATA FLOW WITH AN IDENTIFICATION OF AN EXECUTABLE TASK | Intel Corporation | MACKALL, LARRY T | 2139 | §102 | Non-Final OA | — | Pending | Aug 30, 2023 |
| 18233199 | DEVICE, METHOD AND SYSTEM FOR IN-FIELD LANE TESTING AND REPAIR WITH A THREE-DIMENSIONAL INTEGRATED CIRCUIT | Intel Corporation | ALEJNIKOV JR, ROBERT P | 2857 | §102§103 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18231695 | EXTENDED ERROR MANAGEMENT WITH CONFIGURABLE HEADER LOGS | Intel Corporation | YU, XINYUAN | §101§102§103 | Non-Final OA | — | Pending | Aug 08, 2023 | |
| 18217049 | METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18217056 | FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY | Intel Corporation | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18216493 | PERFORMANCE OPTIMIZATION OF TRANSISTORS SHARING CHANNEL STRUCTURES OF VARYING WIDTH | Intel Corporation | KIM, TONG-HO | 2811 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216476 | MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY USING BACKSIDE PASSIVATION LAYER | Intel Corporation | LEE, WOO KYUNG | 2815 | — | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216456 | DEVICE, SYSTEM, AND METHOD FOR PROVIDING ISOLATION BETWEEN CORES TO FACILITATE A MULTI-TENANT ENVIRONMENT | Intel Corporation | CHAN, DANNY | 2175 | §103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216485 | AND DOUBLE PATTERNING STRATEGY WITH PRINTED ERASABLE DUMMIFICATION | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | — | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216525 | THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES | Intel Corporation | LIU, XIAOMING | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216447 | HIGH-FREQUENCY INTERFACE CIRCUIT PROTECTION FROM ELECTROSTATIC DISCHARGE EVENTS | Intel Corporation | SREEVATSA, SREEYA | 2838 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216352 | DEVICE, METHOD, AND SYSTEM TO PROVIDE A LIMITED POWER STATES MODE FOR MANAGING PROCESSOR OPERATION | Intel Corporation | HARRINGTON, CHERI L. | 2176 | §102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216436 | HARDWARE-BASED CRYPTOGRAPHIC PROTECTION OF TOKENS | Intel Corporation | ZARRINEH, SHAHRIAR | 2496 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18343671 | METHODS AND APPARATUS TO INCREASE PRIVACY FOR FOLLOW-ME SERVICES | Intel Corporation | NOAMAN, BASSAM A | 2497 | — | Final Rejection | — | Pending | Jun 28, 2023 |
| 18215033 | DISTRIBUTED CIRCUIT FOR ELECTROSTATIC DISCHARGE PROTECTION FOR A SIGNAL PAD | Intel Corporation | JACKSON, STEPHEN W | 2838 | §102 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18331799 | METHODS AND APPARATUS TO SLICE NETWORKS FOR WIRELESS SERVICES | Intel Corporation | HSU, BAILOR CHIA-JONG | 2461 | §112 | Non-Final OA | — | Pending | Jun 08, 2023 |
| 18201656 | OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS | Intel Corporation | MINNEY, GABRIEL SEBASTIAN | 2897 | §103 | Non-Final OA | — | Pending | May 24, 2023 |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | Intel Corporation | COMBER, KEVIN J | 2838 | §103 | Non-Final OA | — | Pending | May 24, 2023 |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | Intel Corporation | COMBER, KEVIN J | 2838 | §103Other | Non-Final OA | — | Pending | May 24, 2023 |
| 18139078 | EXECUTION OF CONTAINER IMAGES IN A TRUSTED EXECUTION ENVIRONMENT | Intel Corporation | COYER, RYAN D | 2191 | §103 | Final Rejection | 33d | AI Ready | Apr 25, 2023 |
| 18136972 | HARDWARE-BASED ACCELERATORS IN CLOUD NATIVE APPLICATIONS WRITTEN IN HIGH LEVEL PROGRAMMING LANGUAGES | Intel Corporation | DASCOMB, JACOB D | 2198 | §103 | Final Rejection | 21d | AI Ready | Apr 20, 2023 |
| 18133353 | OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES | Intel Corporation | KIANNI, KAVEH C | 2874 | §102 | Non-Final OA | — | Pending | Apr 11, 2023 |
| 18296264 | DISPLAY SYNCHRONIZATION FOR TIME SENSITIVE NETWORKING | Intel Corporation | VAUGHN JR, WILLIAM C | 2481 | — | Final Rejection | 83d | Pending | Apr 05, 2023 |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Intel Corporation | STARK, JARRETT J | 2898 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18129690 | CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE | Intel Corporation | CHOWDHURY, TARIFUR RASHID | 2877 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18129617 | MODULATION OF CHIP PERFORMANCE BY CONTROLLING TRANSISTOR GATE PROFILE | Intel Corporation | MENZ, DOUGLAS M | 2893 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18129704 | PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON OXIDIZABLE MATERIAL | Intel Corporation | MOVVA, AMAR | 2898 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18116940 | IN-ORDER STREAMING IN-NETWORK COMPUTATION | Intel Corporation | BARRY, LANCE LEONARD | 2443 | §103 | Final Rejection | — | Pending | Mar 03, 2023 |
| 18114120 | PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Final Rejection | 28d | AI Ready | Feb 24, 2023 |
| 18109774 | TECHNOLOGIES FOR COORDINATING DISAGGREGATED ACCELERATOR DEVICE RESOURCES | Intel Corporation | CAO, DIEM K | 2196 | §103 | Non-Final OA | — | Pending | Feb 14, 2023 |
| 18090707 | DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING | Intel Corporation | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103§112 | Final Rejection | — | AI Ready | Dec 29, 2022 |
| 18091270 | IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS | Intel Corporation | AU, BAC H | 2898 | §103 | Final Rejection | 15d | AI Ready | Dec 29, 2022 |
| 18090258 | ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE | Intel Corporation | TRAN, HOANG Q | 2874 | §103 | Final Rejection | 20d | AI Ready | Dec 28, 2022 |
| 18090140 | SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES | Intel Corporation | ARMAND, MARC ANTHONY | 2813 | §103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Intel Corporation | LINDSEY, COLE LEON | 2812 | §103 | Final Rejection | 9d overdue | AI Ready | Dec 22, 2022 |
| 18086232 | GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | §103 | Final Rejection | — | Pending | Dec 21, 2022 |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Final Rejection | 18d overdue | AI Ready | Dec 19, 2022 |
IP Author helps law firms respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial91.7% of resolved applications prosecuted by Essential Patents Group, Llp. were allowed, across 2,866 applications in USPTO records.
3.17 office actions per allowed application on average.
79 pending office actions as of October 2026, for 1 client, before 76 examiners in 39 art units.
