Listed by the USPTO as FENG, ZHENGFU J
Tech Center 2800 • Art Units: 2835 2841
This examiner grants 76% of resolved cases
FENG, ZHENGFU J has 516 resolved cases in Tech Center 2800 and art unit 2835. The allowance rate is 75.6%, and the interview lift is 38.8%. The median time to allowance is 938 days. The record combines a substantial resolved-case volume with an allowance outcome and interview effect that make examiner-specific prosecution planning relevant.
The listed companies are Intel Corporation, Sony Group Corporation, and Nintendo Co., Ltd. The listed firms are Alliance IP, LLC - Intel, Barnes & Thornburg LLP (IN), and Barron & Young PLLC. Applicants represented by these organizations may find it useful to prepare focused interview positions alongside written claim and evidence amendments, particularly where interview engagement can support movement toward allowance.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18762079 | ELECTRONIC APPARATUS | Non-Final OA | Nintendo Co., Ltd. |
| 18855385 | COOLING FAN, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | Sony Interactive Entertainment Inc. |
| 18854076 | ELECTRONIC DEVICE | Non-Final OA | Sony Interactive Entertainment Inc. |
| 18897675 | LAPTOP COOLING VIA LOW-PRESSURE AIR MOVER | Final Rejection | Intel Corporation |
| 18499112 | IMMERSION COOLING SYSTEM WITH FIRST AND SECOND PRIMARY LOOPS | Non-Final OA | Intel Corporation |
| 18477881 | LAPTOP BLOWER USING AC IONIC WIND PRINCIPLES | Non-Final OA | Intel Corporation |
| 18851768 | HEAT DISSIPATION DEVICE AND BASE STATION EQUIPMENT | Non-Final OA | ZTE CORPORATION |
| 18743879 | SERVER COOLING WITH IMMERSED HEAT SINK | Final Rejection | Carrier Corporation |
| 18897793 | COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPABLE ELECTRONIC COMPONENT INTERFACE | Non-Final OA | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18916246 | NOVEL HEAT PIPE CONFIGURATIONS | Non-Final OA | HONEYWELL INTERNATIONAL INC. |
| 18973407 | COOLER | Non-Final OA | TILTA INC. |
| 18852895 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF EXTERNALLY MOUNTED ELECTRONIC EQUIPMENT FOR AN AIRCRAFT | Non-Final OA | TRAK TECOM Corporation |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy75.6% of resolved applications examined by Zhengfu J Feng were allowed (516 resolved cases), compared with 56.2% across Art Unit 2835 over the last five years.
This examiner's interview lift is +38.8 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by Zhengfu J Feng took 938 days on average from filing to allowance.
Zhengfu J Feng examines applications in Art Unit 2835 in Tech Center 2800 (Semiconductors, Circuits & Optics).
