Technology areas: Computing & Software • Semiconductors, Circuits & Optics
102 pending office actions • 1 client • 88 examiners • 47 art units • 38 of 102 (37%) have an AI response strategy ready • 143 patents granted in the last 365 days
Alliance IP, LLC - Intel has 106 pending office actions in Semiconductors, Circuits & Optics and 2411 career applications. The active docket is recorded against a substantial prosecution history involving the firm’s broader record.
The resolved allowance rate is 90.45%, while the average office actions per allowance is 3.37. These measures show frequent allowance outcomes alongside several examination exchanges. They can help practitioners plan technical response work, amendment cycles, and portfolio review for semiconductor and circuit matters.
The career figures summarize resolved applications and do not isolate the Intel-labeled docket by examiner, device type, or claim strategy. The pending-action figure remains the more direct indicator of current examination activity.
Based on the USPTO statutory response window for each pending office action. 32 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 32 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 4 (4%) |
| §103 only | 33 (32%) |
| §102 only | 3 (3%) |
| Double-patenting only | 2 (2%) |
| Multi-statute (no §101) | 52 (51%) |
| No statute on record | 8 (8%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ZARNEKE, DAVID A | 4 | 71.1% | +11.1% |
| ENDRESEN, KIRSTEN DANIELA | 3 | 70.7% | +17.5% |
| MANHEIM, MARC ETIENNE | 3 | 83.3% | +19.1% |
| SU, STEPHANIE T | 2 | 67.3% | +28.7% |
| KIANNI, KAVEH C | 2 | 87.2% | +11.0% |
| PARK, GRACE A | 2 | 76.3% | +17.6% |
| HOLLWEG, THOMAS A | 2 | 53.5% | +31.5% |
| SMITH, CHAD | 2 | 78.9% | +20.4% |
| LIU, BENJAMIN T | 2 | 75.1% | +12.4% |
| JEFFERSON, QUOVAUNDA | 2 | 79.4% | +8.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18620866 | TECHNOLOGIES FOR PROGRAMMABLE MICRORING RESONATORS | KIANNI, KAVEH C | — |
| 18309123 | APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED CIRCUITS | KIANNI, KAVEH C | — |
| 17868557 | EMBEDDED PHOTONICS INTEGRATED CIRCUIT IN GLASS CORE OF SUBSTRATE | MANHEIM, MARC ETIENNE | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | MUNOZ, ANDRES F | 77d overdue |
| 17561463 | TECHNOLOGIES FOR THERMOELECTRIC-ENHANCED COOLING | PILLAY, DEVINA | 73d overdue |
| 17855568 | SINX BASED SURFACE FINISH ARCHITECTURE | ONUTA, TIBERIU DAN | 49d overdue |
| 18061083 | POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES | JEFFERSON, QUOVAUNDA | 31d overdue |
| 17957953 | HARDWARE ACCELERATION FOR INTERFACE TYPE CONVERSIONS | HEBERT, THEODORE E | 4d overdue |
| 18066271 | DYNAMICALLY MODIFIABLE AIR MOVERS AND CONTROL THEREOF | WOLCOTT, BRIAN P | 2d overdue |
| 17711671 | PARALLEL MEMORY MODEL FOR DISTRIBUTED FUNCTIONAL SIMULATIONS | CHAVEZ, RENEE D | 5d |
| 17991811 | EXECUTABLE PASSING USING MAILBOX REGISTERS | SPANN, COURTNEY P | 12d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17480168 | PREDICTIVE ANALYTICS MODEL MANAGEMENT USING COLLABORATIVE FILTERING | PARK, GRACE A | 14d |
| 17988051 | BUMPLESS HYBRID ORGANIC GLASS INTERPOSER | ZARNEKE, DAVID A | 22d |
| 17833650 | GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS | ZARNEKE, DAVID A | 78d |
| 19425232 | Untitled | SU, STEPHANIE T | — |
| 19288619 | INDEPENDENT SAFETY MONITORING OF AN AUTOMATED DRIVING SYSTEM | SU, STEPHANIE T | — |
| 18620866 | TECHNOLOGIES FOR PROGRAMMABLE MICRORING RESONATORS | KIANNI, KAVEH C | — |
| 18400632 | DATA PRIVACY PRESERVATION IN MACHINE LEARNING TRAINING | PARK, GRACE A | — |
| 18477836 | TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE | ENDRESEN, KIRSTEN DANIELA | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Intel | 102 |
| Art Unit | Apps |
|---|---|
| 2874 | 15 |
| 2891 | 5 |
| 2897 | 5 |
| 2811 | 4 |
| 2818 | 4 |
| 2893 | 4 |
| 2899 | 4 |
| 2184 | 3 |
| 2812 | 3 |
| 2896 | 3 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19425232 | Untitled | Intel Corporation | SU, STEPHANIE T | 3662 | — | Non-Final OA | — | Pending | |
| 19288619 | INDEPENDENT SAFETY MONITORING OF AN AUTOMATED DRIVING SYSTEM | Intel Corporation | SU, STEPHANIE T | 3662 | §103 | Non-Final OA | — | Pending | Aug 01, 2025 |
| 19239325 | DIE-TO-DIE INTERCONNECT | Intel Corporation | DALEY, CHRISTOPHER ANTHONY | 2184 | DP | Non-Final OA | — | Pending | Jun 16, 2025 |
| 19075313 | ISOLATED POWER DOMAINS IN A COMPUTING DEVICE | Intel Corporation | DARE, RYAN A | 2132 | §103§112 | Non-Final OA | 40d | Pending | Mar 10, 2025 |
| 19107813 | DISTRIBUTED ADDRESS TRANSLATION SERVICES | Intel Corporation | YOON, ALEXANDER J | 2135 | §103§112 | Final Rejection | — | Pending | Feb 28, 2025 |
| 19106586 | COMMUNICATION OF MEDIA CONFIGURATION INFORMATION OVER A SERIAL COMMUNICATION INTERFACE | Intel Corporation | YIMER, GETENTE A | §103 | Non-Final OA | — | Pending | Feb 25, 2025 | |
| 19042760 | SOURCE ORDERING IN DEVICE INTERCONNECTS | Intel Corporation | HASSAN, AURANGZEB | 2184 | §103 | Final Rejection | — | Pending | Jan 31, 2025 |
| 18940819 | Tall DIMM Structural Retention | Intel Corporation | KRIM, PETER | 2841 | §102§103 | Non-Final OA | — | Pending | Nov 07, 2024 |
| 18920362 | CHARACTERIZING AND MARGINING MULTI-VOLTAGE SIGNAL ENCODING FOR INTERCONNECTS | Intel Corporation | KNAPP, JUSTIN R | 2112 | DP | Final Rejection | 40d | AI Ready | Oct 18, 2024 |
| 18899209 | FLEXIBLE MOUNTING STRUCTURES FOR SURFACE MOUNT COMPONENTS | Intel Corporation | MISHLER, ROBIN J | 2628 | §103 | Final Rejection | 15d overdue | Pending | Sep 27, 2024 |
| 18849897 | PHYSICAL DOWNLINK CONTROL CHANNEL (PDCCH) MONITORING CAPABILITY FOR MULTI-CELL SCHEDULING | Intel Corporation | LE, BRIAN T | 2479 | §102§103§112 | Non-Final OA | — | Pending | Sep 23, 2024 |
| 18843970 | MECHANISMS FOR MULTI-CARRIER TRANSMIT SWITCHING FOR NEW RADIO SYSTEMS IN 5G RAN1 | Intel Corporation | HUYNH, DUNG B. | 2469 | §103§112 | Non-Final OA | — | Pending | Sep 04, 2024 |
| 18838740 | TECHNOLOGIES FOR LOW POWER INDOOR AND OUTDOOR DETECTION | Intel Corporation | TRAN, VI N | 2117 | §101§102§103 | Non-Final OA | — | Pending | Aug 15, 2024 |
| 18833337 | SYSTEMS AND METHODS FOR TIMING CONTROL AND UCI MULTIPLEXING IN MULTI-TRP MULTI-PANEL OPERATION | Intel Corporation | COBY, FRANTZ | 2459 | §103 | Non-Final OA | — | Pending | Jul 25, 2024 |
| 18738798 | POWER OPTIMIZED MULTI-REGIONAL UPDATE DISPLAY | Intel Corporation | AZARI, SEPEHR | 2621 | §102§103 | Final Rejection | — | AI Ready | Jun 10, 2024 |
| 18620866 | TECHNOLOGIES FOR PROGRAMMABLE MICRORING RESONATORS | Intel Corporation | KIANNI, KAVEH C | 2874 | §103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18400632 | DATA PRIVACY PRESERVATION IN MACHINE LEARNING TRAINING | Intel Corporation | PARK, GRACE A | 2144 | §102§103 | Non-Final OA | — | Pending | Dec 29, 2023 |
| 18395162 | VIRTUAL ENVIRONMENT MODIFICATIONS BASED ON USER BEHAVIOR OR CONTEXT | Intel Corporation | BLAUFELD, JUSTIN R | 2151 | §102§103§112 | Final Rejection | 54d | AI Ready | Dec 22, 2023 |
| 18535544 | APPARATUS FOR UE MEASUREMENT DELAY AND GRANULARITY FOR NEW RADIO POSITIONING MEASUREMENT | Intel Corporation | EISNER, RONALD | 2644 | §103 | Final Rejection | 7d | AI Ready | Dec 11, 2023 |
| 18565408 | METHOD AND APPARATUS FOR MODIFYING A SUBSTRATE | Intel Corporation | EVANGELISTA, THEODORE JUSTINE | 3761 | §102§103§112 | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18492007 | COMPOSABLE TRUSTED EXECUTION ENVIRONMENTS | Intel Corporation | MILLS, PAUL V | 2196 | §103 | Final Rejection | 41d | AI Ready | Oct 23, 2023 |
| 18477881 | LAPTOP BLOWER USING AC IONIC WIND PRINCIPLES | Intel Corporation | FENG, ZHENGFU J | 2841 | §102§103 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18477836 | TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE | Intel Corporation | ENDRESEN, KIRSTEN DANIELA | 2874 | §102§103§112 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18552213 | PRINTED CIRCUIT BOARD PIN FIELD SIGNAL ROUTING | Intel Corporation | SOUNDRANAYAGAM, RAYAPPU NMN | 2851 | §102§103 | Non-Final OA | — | Pending | Sep 25, 2023 |
| 18458621 | HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCALABILITY | Intel Corporation | TAYLOR, EARL N | 2811 | — | Non-Final OA | — | Pending | Aug 30, 2023 |
| 18264214 | TECHNOLOGIES FOR WIRELESS SENSOR NETWORKS | Intel Corporation | ABAZA, AYMAN A | 2465 | §103 | Non-Final OA | 14d | AI Ready | Aug 03, 2023 |
| 18362308 | TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED CIRCUIT DIES | Intel Corporation | HOLLWEG, THOMAS A | 2874 | §102§103 | Non-Final OA | — | Pending | Jul 31, 2023 |
| 18346212 | TWO-TERMINAL FERROELECTRIC PEROVSKITE DIODE MEMORY ELEMENT | Intel Corporation | STUESSY, NOLAN GABRIEL | 2812 | §103 | Non-Final OA | — | Pending | Jul 01, 2023 |
| 18345208 | STREAMING FABRIC INTERFACE | Intel Corporation | HUYNH, KIM T | 2184 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18346098 | FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT | Intel Corporation | ANYA, IGWE U | 2891 | §102 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18345106 | TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR | Intel Corporation | JORDAN, ANDREW | 2874 | §102§103§112 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | Intel Corporation | ERDEM, FAZLI | 2812 | §102 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18346039 | PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVING PROCESS TOLERANCE | Intel Corporation | SMITH, CHAD | 2874 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18345127 | TECHNOLOGIES FOR BARRIER LAYERS IN PEROVSKITE TRANSISTORS | Intel Corporation | YUSHINA, GALINA G | 2811 | — | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18217165 | ADAPTERS FOR HETEROGENOUS OPTICAL CONNECTORS | Intel Corporation | RAHLL, JERRY T | 2874 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18344042 | ARCHITECTURAL INTERFACE FOR ADDRESS TRANSLATION CACHE (ATC) IN XPU TO SUBMIT COMMAND DIRECTLY TO GUEST SOFTWARE | Intel Corporation | LI, SIDNEY | 2137 | §103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18342422 | TECHNOLOGIES FOR A HYBRID OPTICAL CHIP-TO-CHIP COUPLING | Intel Corporation | TAVLYKAEV, ROBERT FUATOVICH | 2896 | §102§103 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18209827 | AUTOMATIC TUNING OF HETEROGENOUS WIRELESS INFRASTRUCTURE | Intel Corporation | CHEEMA, HASAN ALI | 2465 | §103 | Non-Final OA | — | Pending | Jun 14, 2023 |
| 18334025 | HARDWARE ACCELERATION IN A NETWORK INTERFACE DEVICE | Intel Corporation | NGUYEN, VAN H | 2199 | §102§112 | Non-Final OA | — | Pending | Jun 13, 2023 |
| 18326773 | DYNAMIC HARDWARE PROFILE MODIFICATION | Intel Corporation | AYERS, MICHAEL W | 2195 | §102§103§112 | Non-Final OA | — | Pending | May 31, 2023 |
| 18325512 | KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME | Intel Corporation | MANHEIM, MARC ETIENNE | 2874 | §102§103 | Non-Final OA | — | Pending | May 30, 2023 |
| 18324640 | HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES | Intel Corporation | TURNER, BRIAN | 2818 | §103 | Non-Final OA | — | Pending | May 26, 2023 |
| 18323812 | SOFTWARE-BASED PHYSICAL LAYER CONFIGURATION | Intel Corporation | PHAN, RAYMOND NGAN | 2175 | §101§103§112Other | Non-Final OA | — | Pending | May 25, 2023 |
| 18323521 | SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE | Intel Corporation | MINNEY, GABRIEL SEBASTIAN | 2897 | §102§103 | Non-Final OA | — | Pending | May 25, 2023 |
| 18309123 | APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED CIRCUITS | Intel Corporation | KIANNI, KAVEH C | 2874 | §103 | Non-Final OA | — | Pending | Apr 28, 2023 |
| 18131783 | ADAPTIVE MULTIMODAL EVENT DETECTION | Intel Corporation | LE, PETER D | 2488 | §103 | Final Rejection | 62d | Pending | Apr 06, 2023 |
| 18130404 | Liquid-Proof Edge Connector Designs for Immersion Cooling | Intel Corporation | PAUMEN, GARY F | 2834 | §102§103 | Final Rejection | — | Pending | Apr 03, 2023 |
| 18194147 | TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING ANGLES | Intel Corporation | SMITH, CHAD | 2874 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18126833 | FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS | Intel Corporation | LIU, BENJAMIN T | 2893 | — | Non-Final OA | — | Pending | Mar 27, 2023 |
| 18189844 | PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN | Intel Corporation | HOLLWEG, THOMAS A | 2874 | §102§103 | Final Rejection | — | Pending | Mar 24, 2023 |
IP Author helps law firms respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free Trial90.5% of resolved applications prosecuted by Alliance Ip, LLC - Intel were allowed, across 2,411 applications in USPTO records.
3.37 office actions per allowed application on average.
102 pending office actions as of October 2026, for 1 client, before 88 examiners in 47 art units.
