Listed by the USPTO as GOODWIN, DAVID J
Tech Center 4100 • Art Units: 2817 2818 4100
This examiner grants 67% of resolved cases
GOODWIN, DAVID J is assigned to tech center 4100 and art unit 2817. The record includes 824 resolved cases, a 67.2% allowance rate, and a median of 1179 days to allowance. The volume provides a substantial basis for evaluating likely outcomes, while the median timing should be included in portfolio and commercialization planning.
Interviews correspond to a 16.7% allowance lift. Practitioners may use interviews to focus claim amendments, explain technical distinctions, and identify issues that can be resolved without unnecessary exchanges. The principal companies are Taiwan Semiconductor Manufacturing Company, Ltd., Samsung Electronics Co., Ltd., and Micron Technology Inc. The firms listed are Morgan, Lewis & Bockius LLP (WA)(SEC), BIRCH STEWART KOLASCH & BIRCH, LLP, and Dorsey & Whitney LLP - MTI (Nelson).
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17761516 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | Final Rejection | LG ELECTRONICS INC. |
| 18442274 | GATE STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18402021 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18086086 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17659135 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18825338 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18415383 | Light Emitting Element Display Device | Final Rejection | LG Display Co., Ltd. |
| 17749806 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18745789 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18564966 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18565028 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE Technology Group Co., Ltd. |
| 18519172 | METHOD OF FORMING AN ORGANIC POLYMER COMPRISING POLYIMIDE | Final Rejection | ASM IP Holding B.V. |
| 18051543 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18403007 | METHODS FOR MECHANICAL SELF-ALIGNMENT AND SLIP-RESISTANCE IN BONDING SEMICONDUCTOR SUBSTRATES, AND SEMICONDUCTOR DEVICES COMPRISING MECHANICAL SELF-ALIGNMENT STRUCTURES | Non-Final OA | Micron Technology, Inc. |
| 18238848 | HIGH VOLTAGE DEVICE AND METHOD | Final Rejection | Micron Technology, Inc. |
| 17943104 | TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE | Final Rejection | Micron Technology, Inc. |
| 17884775 | FORMATION OF MEMORY DIE AND LOGIC DIE WITH WAFER-ON-WAFER BOND | Non-Final OA | Micron Technology, Inc. |
| 17673309 | ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 17975071 | CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18771873 | METHOD OF FORMING HARD MASK STRUCTURE | Non-Final OA | Tokyo Electron Limited |
| 18742922 | INCREASED CONTACT AREA FOR SELF-ALIGNED GATE ISOLATION | Non-Final OA | International Business Machines Corporation |
| 18607634 | BACKSIDE SELF-ALIGNED DIFFUSION BREAKS | Non-Final OA | International Business Machines Corporation |
| 17983863 | DIAGONAL WIRING LEVEL WITH SKIP-LEVEL VIA CONNECTIONS | Final Rejection | International Business Machines Corporation |
| 18665627 | NITRIDE SEMICONDUCTOR MODULE | Non-Final OA | ROHM CO., LTD. |
| 18344857 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18782253 | MULTI-LEVEL STACKING OF WAFERS AND CHIPS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18648917 | Die Stacking Structure and Method Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18747849 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy67.2% of resolved applications examined by David J Goodwin were allowed (824 resolved cases), compared with 81.7% across Art Unit 2817 over the last five years.
This examiner's interview lift is +16.7 percentage points: the difference in allowance rate between resolved applications that had an examiner interview and those that did not.
Applications allowed by David J Goodwin took 1,179 days on average from filing to allowance.
David J Goodwin examines applications in Art Unit 2817 in Tech Center 4100.
